Numerical Simulation of Thermal Stress Fields in the Magnetic Quenching Process of 45 Steel

Based on a transient temperature distribution of a 45 steel cylinder workpiece during magnetic quenching, which was obtainedby solving the governing equations with nonlinear boundary on the condition of coupling effects of heat-magnetism. Accordingto the     

广义预测控制系统的仿真软件设计与开发

介绍了基于广义预测控制的模型预测控制（MPC）系统仿真软件的开发与实现过程。该软件包含了MAC，IMAC，DMC，DDMC和GPC五种预测控制算法，可以用不同的方法实现对预测控制系统的综合性仿真以及控制器参数的调整。利用该软件可对模型预测控制系统的作用机理做进一步仿真分析，并有助于定性分析各种算法中设计参数对系统性能的影响以及不同算法之间的区别。     

雷达仿真系统中电磁干扰环境的仿真设计和实施

雷达仿真系统是为检测雷达设备的抗干扰能力以及在各种电磁环境下的工作性能而设计的，包括有源干扰和无源干扰的模拟仿真。本文阐述了无源干扰即杂波的散射模型和仿真过程；从同步脉冲干扰的基本原理出发，阐明在雷达工作环境仿真系统中距离拖引、速度拖引、虚假目标等同步脉冲有源干扰的设计和实施过程；并针对工作在搜索和跟踪交替模式下的相控阵雷达提出自适应综合干扰方式；最后分析并总结了系统仿真时为真实、有效地模拟电磁干扰环境应注意的关键问题。     

混凝土骨料二维分布的模拟和应用

通过在一个矩形截面上模拟混凝土骨料的实际分布，获得了该截面上任一点的骨料分布密度和骨料分布的统计特性。模拟结果表明，当模拟次数趋向于无穷大时，截面上任一点的骨料分布密度趋向于定值，对于不同的骨料面积百分数，骨料分布密度曲线的形状十分相似，均由上升段和水平段两部分组成。基于这些模拟结果，利用数学拟合获得了骨料分布密度的解析表达式，并被混凝土实验所初步证实。作为一个应用，本文计算了混凝土截面上各点的氯离子扩散系数。     

多排数翅片管空冷器风阻特性的数值模拟

本文对多排数翅片管空冷器空气侧的风阻特性进行了数值模拟.利用商用软件Fluent进行数值计算,结合经验公式和已有的实验数据,分析了不同入口风速下,阻力的变化规律以及流动阻力和温度变化对模拟计算的影响.     

W‐band physical layer design issues in the context of the DAVID–DCE experiment

This paper aims at focusing on the aspects concerning the physical layer design for an innovative satellite communication experiment. Such an experiment, denoted by the acronym DAVID–DCE (Data and Video Interactive Distribution—Data Collection Experiment) is based on the exploitation of the W‐band (75–110 GHz) for high‐bit‐rate satellite transmission. The potential advantages of using of the W‐band are mainly related to the great bandwidth availability, and to the absence of interference. Moreover, an expected result of the experiment is a substantive improvement in the communication system's performances in the presence of meteorological phenomena (e.g. rain) as compared with the more conventional Ka‐band satellite transmission. On the other hand, problems to be faced concern the non‐ideal behaviours of hardware devices employed for high‐frequency digital transmission. In particular, carrier recovery and timing recovery are the most crucial signal‐processing tasks to be carefully considered in the design of the physical level of the system, because they considerably suffer from hardware impairments. The purpose of this work is to illustrate the proposed solutions in terms of the most critical modulation, demodulation and synchronization design issues, together with the effects of non‐ideal behaviours of hardware components on BER performances. Copyright © 2004 John Wiley & Sons, Ltd.     

Simulation by Slepian method of plastic displacements of Gaussian process excited multistory shear frame

The object of study is a stationary Gaussian white noise excited multi-degree-of-freedom (MDOF) linear elastic, ideal plastic, linearly damped, statically determinate oscillator with several potential elements of ideal plastic yielding. Specifically the study is exemplified for a plane multistory shear frame with rigid traverses where all the connecting columns except the columns in one or more of the bottom floors have finite symmetrical yield limits. The white noise excitation acts on the mass of the first floor making the movement of the elastic bottom floors simulate a ground motion that interacts with the structure above the bottom floors. The method of study is so-called Slepian model simulation and is in principle the same for other statically determinate MDOF elasto-plastic oscillators of the considered type. The method is fast as compared to direct simulation and provides results that give good insight in the behavior of the plastic displacement response process.     

铝型材推弯工艺

通过铝型材圆环的推弯实验,研究了推弯工艺原理、变形过程,结合有限元模拟得到了和实验结果相吻合的型材厚度分布、成形零件卸载回弹后的曲率半径及型材截面畸变.结果表明:推弯零件曲率及截面畸变一致性高,成形模具结构简单且便于调整,数值模拟可以用于推弯工艺的优化分析.     

管壳式换热器流场三维数值模拟

采用多孔介质方法 ,在PHOENICS 3 3程序的基础上建立了换热器的三维流动计算模型。引入体积穿透率、表面穿透率、分布阻力等来描述换热器内的管束。模型通过计算Halle等[1] 的实验工况来进行验证 ,并尝试用于计算 2 0 0MW低温供热堆主换热器内的流场     

深亚微米集成电路的快速时域仿真技术

随着深亚微米集成电路技术的发展，集成电路的规模越来越大，工作频率越来越高，并正朝着系统集成的方向发展，因而在模拟速度，模拟精度和可模拟的电路规模等各个方面对电路仿真技术提出了新的要求。近年来，各种新的电路仿真方法和仿真系统用相继脱颖百出，并将取代那些传统的，已经无法适应深亚微米技术发展的电路仿真器。