热处理工艺对Al/Cu双金属复合界面的影响

采用POLYVAR-MET型金相显微镜、带有GENESIS60S能谱仪的Sirion200场发射扫描电镜对经高温和低温退火处理的Al/Cu双金属复合界面组织进行观察分析,研究热处理工艺对界面组织及扩散层厚度的影响规律,并进一步通过冷轧实验研究扩散层厚度与界面结合强度的关系,获得综合满足材料结合强度和成型性能的热处理工艺。结果表明:高温退火处理的Al/Cu复合试样难以实现稳定的塑性成型,低温退火处理能使界面结合牢固,冷变形塑性好;Al/Cu双金属复合材料的界面扩散结合层厚度的最佳范围为1.2~3.5μm;最佳工艺为低温退火加热到300~350℃,保温45~60 min。     

Improving the photovoltaic performance of co‐evaporated Cu2ZnSnS4 thin‐film solar cells by incorporation of sodium from NaF layers

We have investigated the influence of sodium (Na) on the properties of co‐evaporated Cu₂ZnSnS₄ (CZTS) layer microstructures and solar cells. The photovoltaic performance and diode properties were improved by incorporating Na from NaF layers into the CZTS layers, while Na had a negligible effect on the microstructural properties of the layer. The best cell fabricated by using an optimal CZTS layer (Cu/(Zn + Sn) = 0.70, Zn/Sn = 1.8) yielded an active area efficiency of 5.23%. The analysis of device properties suggests that charge‐carrier recombination at CZTS/CdS interface is suppressed by intentional Na incorporation from NaF layers. Copyright © 2016 John Wiley & Sons, Ltd.     

激光二极管端面抽运圆形截面Nd∶GdVO_4晶体的热形变

以解析分析理论为基础,研究圆截面Nd∶GdVO4激光晶体受到具有高斯分布半导体激光端面中心入射时,晶体温度场分布和抽运面热形变分布情况。通过对激光二极管(LD)端面入射晶体工作特点分析,建立了符合实际工作情况的热模型,利用热传导方程新求解方法,得出了圆形截面Nd∶GdVO4晶体温度场分布和端面热形变场通解表达式,对比分析了圆形截面和矩形截面Nd∶GdVO4晶体的热形变。研究结果表明,当使用输出功率为15 W激光二极管端面中心入射Nd∶GdVO4激光晶体时,在抽运端面中心获得187.5℃最高温升和1.313μm最大热形变量。两种截面晶体具有相同的热形变形状,当截面尺寸不太大时,如果圆形截面晶体的半径等于矩形截面晶体半边长,最大热形变量将减少4.1%。这种方法还可以应用到其他圆形截面晶体热问题研究中,为有效解决激光系统热问题提供了理论依据。     

Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

During the reflowing of Sn-9Zn solder ball grid array (BGA) packages with Au/Ni/Cu and Ag/Cu pads, the surface-finished Au and Ag film dissolved rapidly and reacted with the Sn-9Zn solder to form a γ₃-AuZn₄/γ-Au₇Zn₁₈ intermetallic double layer and ε-AgZn₆ intermetallic scallops, respectively. The growth of γ₃-AuZn₄ is prompted by further aging at 100°C through the reaction of γ-Au₇Zn₁₈ with the Zn atoms dissolved from the Zn-rich precipitates embedded in the β-Sn matrix of Sn-9Zn solder BGA with Au/Ni/Cu pads. No intermetallic compounds can be observed at the solder/pad interface of the Sn-9Zn BGA specimens aged at 100°C. However, after aging at 150°C, a Ni₄Zn₂₁ intermetallic layer is formed at the interface between Sn-9Zn solder and Ni/Cu pads. Aging the immersion Ag packages at 100°C and 150°C caused a γ-Cu₅Zn₈ intermetallic layer to appear between ε-AgZn₆ intermetallics and the Cu pad. The scallop-shaped ε-AgZn₆ intermetallics were found to detach from the γ-Cu₅Zn₈ layer and float into the solder ball. Accompanied with the intermetallic reactions during the aging process of reflowed Sn-9Zn solder BGA packages with Au/Ni/Cu and Ag/Cu pads, their ball shear strengths degrade from 8.6 N and 4.8 N to about 7.2 N and 2.9 N, respectively.     

Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish

The intermetallic compounds formed in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Ag/Cu pads are investigated. After reflow, scallop-shaped η-Cu₆Sn₅ and continuous planar η-(cu_0.9Ni_0.1)₆Sn₅ intermetallics appear at the interfaces of the Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder joints, respectively. In the case of the Sn3Ag0.5Cu specimens, an additional ε-Cu₃Sn intermetallic layer is formed at the interface between the η-Cu₆Sn₅ and Cu pads after aging at 150°C, while the same type of intermetallic formation is inhibited in the Sn3Ag0.5Cu0.06Ni0.01Ge packages. In addition, the coarsening of Ag₃Sn precipitates also abates in the solder matrix of the Sn3Ag0.5Cu0.06Ni0.01Ge packages, which results in a slightly higher ball shear strength for the specimens.     

Thermal reliability and performances of InGaP schottky contact with Cu/Au and Au/Cu-MSM photodetectors

We report the Schottky performance and thermal reliability of a wide bandgap InGaP layer in contact with a Cu/Au metallic system. An effective Schottky barrier height of 0.97 eV and an ideality factor of 1.21 can be achieved. The thermal reliability of the resultant Schottky barrier diodes was analyzed using Auger electron spectroscopy and atomic force microscopy. The thermal reliability could be main tained up to 450°C. The failure mechanism was attributable to the decomposition of the InGaP layer and the interdiffusion of the chemical elements at higher temperature. Insensitive photoresponsivity with the in cident optical power was found for the resultant Au/Cu-metal-semiconductor-metalphotodetectors (MSM-PDs). According to the measured temporal response of the Au/Cu-MSM-PDs, the operation frequency could be above 10 GHz.     

Electromechanical properties of printed copper ink film using a white flash light annealing process for flexible electronics

We report on a systematic study of the electromechanical properties of flexible copper (Cu) thin film for flexible electronics. Cu ink is synthesized with chemical reduction process. Cu ink film spin-coated on a polyimide substrate is annealed with white flash light, also known as intense pulsed light (IPL), which guarantees a room temperature and sub-second process in ambient conditions. IPL annealed Cu film shows the electrical resistivity of 4.8 μΩ cm and thickness of 200 nm. The electromechanical properties of IPL annealed Cu film are investigated via outer/inner bending, stretching, and adhesion tests, and it is compared with conventional electron-beam evaporated Cu film. IPL annealed Cu film shows a constant electrical resistance within a bending radius of 6 mm. The bending fatigue test shows that the Cu film can withstand 10,000 bending cycles. In the stretching test, the Cu film shows a 50% increase in resistance when a strain of 2.4% was induced. At 4% strain, the resistance increases more than 200%. Meanwhile, the electron-beam evaporated film shows a constant resistance up to a strain of 4%. Lower stretchability of IPL annealed Cu film is attributed to its inherent cracks and porous film morphologies. IPL annealing induces the local melting at the interface between the substrate and Cu film, which increases the adhesion strength of the Cu film. These results provide useful information regarding the mechanical flexibility and durability of the nanoparticle films for the development of flexible electronics.     

铝合金中元素Cr和Cu的双脉冲激光诱导击穿光谱检测

采用共线双脉冲激光诱导击穿光谱(Dual pulse laser induced breakdown spectroscopy, DP-LIBS)技术分析铝合金中微量元素含量,详细研究了共线双脉冲光谱信号强度与 双脉冲间时间延迟的关系,最佳延时为8$\sim$9 $\mu$s。在该延时条件下,双脉冲光谱信号强度比单脉冲光谱 信号强度增强了10倍以上。分别采用双脉冲激光诱导击穿光谱和单脉冲激光诱导击穿光谱(Single-pulse laser induced breakdown spectroscopy, SP-LIBS)技术,得到了以Cu I 324.75 nm, Cr I 425.43 nm 谱线为分析线 的定标曲线。与采用单脉冲激光诱导击穿光谱技术相比,铝合金中 Cu和 Cr的检测极限分别由单脉冲时的169.5 和94.5 $\mu$g/g降低至双脉冲时的21.46 和4.26 $\mu$g/g。     

CdSe/ZnS量子点掺杂聚合物光纤放大器增益特性分析

提出了一种半导体量子点CdSe/ZnS掺杂聚合物光纤放大器。测量了CdSe/ZnS量子点吸收和发射光谱,采用二能级结构和速率方程的方法,全面描述了CdSe/ZnS量子点掺杂聚合物光纤放大器的增益性能。计算了放大器增益随量子点掺杂光纤长度、量子点掺杂浓度和信号光强度的变化,给出了不同泵浦光强条件下的增益谱线及半高全宽。结果表明,在mW量级的泵浦条件下,CdSe/ZnS量子点掺杂聚合物光纤放大器可获得35dB以上的增益,获得相同增益所需泵浦光强度只有同类型染料掺杂聚合物光纤放大器的万分之一。泵浦光强与量子点掺杂浓度之间存在最佳对应关系,单位泵浦功率激发的最佳量子点数为6.33×107/mW。在室温下,CdSe/ZnS量子点掺杂聚合物光纤放大器具有550nm～610nm的带宽,含盖了聚合物光纤的低损窗口。     

电路板嵌入元器件有机模块技术的开发

为了提高电子组装密度,基板嵌入元器件的三维安装模式受到人们更多的关注.介绍了一种以铜芯为基板核心材料的元器件嵌入技术(EOMIN),详细叙述了其外形结构和制造工艺,并通过实验与FR-4基板嵌入元器件和低温共烧陶瓷基板(LTCC)安装元器件进行比较,通过实验数据对比得出EOMIN元器件嵌入技术具有导热性能好,抗疲劳性强,承受热冲击时铜的塑性变形量小,连接可靠性高等优良特性的结论.