波纹辊和平辊轧制Ti/Cu/Ti层压复合材料的显微组织与力学性能（英文）

采用波纹辊和平辊轧制方法制备钛/铜/钛(Ti/Cu/Ti)层压复合板材料。通过扫描电镜、数值模拟、剥离和拉伸实验等方法研究层压复合板的显微组织和力学性能,对比分析波纹辊和平辊轧制效果。结果表明：波纹辊和平辊轧制的层压复合板在Ti层和Cu层界面处表现出不同的有效塑性应变分布。波纹辊轧制的层压复合板中,Ti层具有再结晶织构、棱柱面织构和棱锥面织构,Cu层形成高斯织构和剪切织构;而平辊轧制的层压复合板中,Ti层和Cu层均具有典型的变形织构。波纹辊轧制的层压复合板材料具有较高的结合强度、抗拉强度和延展性。     

Microstructure and mechanical properties of Cu/Al joints brazed using (Cu,Ni, Zr,Er)-modified Al—Si filler alloys

To design a promising Al—Si filler alloy with a relatively low melting-point, good strength and plasticity for the Cu/Al joint, the Cu, Ni, Zr and Er elements were innovatively added to modify the traditional Al—Si eutectic filler. The microstructure and mechanical properties of filler alloys and Cu/Al joints were investigated. The result indicated that the Al—Si—Ni—Cu filler alloys mainly consisted of Al(s,s), Al₂(Cu,Ni) and Si(s,s). The Al—10Si—2Ni—6Cu filler alloy exhibited relatively low solidus (521 °C) and liquidus (577 °C) temperature, good tensile strength (305.8 MPa) and fracture elongation (8.5%). The corresponding Cu/Al joint brazed using Al—10Si—2Ni—6Cu filler was mainly composed of Al₈(Mn,Fe)₂Si, Al₂(Cu,Ni)₃, Al(Cu,Ni), Al₂(Cu,Ni) and Al(s,s), yielding a shear strength of (90.3±10.7) MPa. The joint strength was further improved to (94.6±2.5) MPa when the joint was brazed using the Al—10Si—2Ni—6Cu—0.2Er—0.2Zr filler alloy. Consequently, the (Cu, Ni, Zr, Er)-modified Al—Si filler alloy was suitable for obtaining high-quality Cu/Al brazed joints.     

Microstructural evolution and microsegregation in directional solidification of hypoeutectic Al−Cu alloy: A comparison between experimental data and numerical results obtained via phase-field model

The objective of the work is focused on predictions of microsegregation, solidification speed, dendritic arm spacings and dendrite morphology by phase-field model. The numerical results were compared with experimental data. The experimental values for cooling rates and effective partition coefficient were adopted during calculations. The results of microsegregation through phase-field model show excellent agreement with the experimental data. Such excellent agreement is because cooling rates, effective partition coefficient and back-diffusion of solute are considered in the model. For solidification speed, the calculation results show good agreement with the experimental data. Tertiary dendritic arm spacing calculated with phase-field model is compared with experimental data. The results show good agreement between them. The dendrite arm spacing varies with position because high cooling rates are responsible for the refinement effect on microstructure. Finally, two-dimensional simulation produced a dendrite that is similar to that found in the experiment.     

铜中无骨架填充Cr和W电触头复合材料的智能显微组织

为了研究抗电弧断路器合金显微组织的智能响应机制,制备W45Cu55、Cr65Cu35和Cr32W14Cu54合金.与工业合金不同,这些合金中Cr和W相是无骨架填充到铜基体中.其制备方法是在振动(80 Hz)下,将铜熔体渗透到未压实的Cr和W混合粉末中.结果显示,当W由\"骨架\"填充变为\"无骨架\"填充后,触头的抗弧性能有所...     

First-principles investigation on stability and electronic structure of Sc-doped θ′/Al interface in Al−Cu alloys

The properties of Sc-doped θ′ (Al₂Cu)/Al interface in Al−Cu alloys were investigated by first-principles calculations. Sc-doped semi-coherent and coherent θ′ (Al₂Cu)/Al interfaces (Sc doped in Al slab (S1 site), Sc doped in θ′ slab (S2 site)) were modeled based on calculated results and reported experiments. Through the analysis of interfacial bonding strength, it is revealed that the doping of Sc at S1 site can significantly decrease the interface energy and increase the work of adhesion. In particular, the doped coherent interface with Sc at S1 site which is occupied by interstitial Cu atoms has very good bonding strength. The electronic structure shows the strong Al—Cu bonds at the interfaces with Sc at S1 site, and the Al—Al bonds at the interfaces with Sc at S2 site are formed. The formation of strong Al—Cu and Al—Al bonds plays an important role in the enhancement of doped interface strength.     

Designing of MIP-based QCM sensor for the determination of Cu(II) ions in solution

A novel quartz crystal microbalance (QCM) sensor with a high selectivity and sensitivity has been developed for the determination of Cu(II) ions, based on the modification of Cu(II) ion-imprinted polymer (Cu(II)-IIP) film onto a quartz crystal. The performance of the developed MIP-QCM sensor was evaluated and the results indicated that a sensitive MIP-QCM sensor could be fabricated. The obtained MIP-QCM sensor presents high-selectivity monitoring of Cu(II) ions, better reproducibility, shorter response time (6 min), wider linear range (0.001–50 μM) and lower detection limit (8 × 10⁻⁴ μM). The practical analysis of the MIP-QCM sensor confirms the feasibility of Cu(II) determination in wastewater.     

机械合金化铜-钨药型罩材料的研究

采用机械合金化 (MA)技术实现了铜 -钨非互溶系的合金化。通过 X射线衍射(XRD)等手段检测了其合金化的效果、W颗粒尺寸及分布 ,初步探索了用此合金制作药型罩的可行性