纳米铁/活性炭新型材料的制备及其对铜离子的吸附性能研究

以活性炭为载体,采用沉淀法制备纳米铁/活性炭新型材料,对活性炭的结构变化进行BET和TEM表征分析,研究纳米铁负载前后活性炭对水中铜离子的吸附能力以及p H值、起始浓度、吸附时间等因素对吸附性能的影响,同时考察其再生性能。结果表明:纳米铁成功负载于活性炭上,随着p H值的增加,吸附容量逐渐增大,当p H=6时,纳米铁/活性炭的最大吸附量为18.73 mg/g,与活性炭相比提高了150%。新型材料对铜离子的吸附过程符合Langmuir和Freundlich吸附模型,对铜离子的吸附量随时间变化的规律符合准二级动力学模型,由于负载的纳米铁阻碍了铜离子向材料表面扩散,其吸附速率仅为0.002 g/(mg·min),与活性炭相比下降了60%左右。新型材料再生效率高,具有较好的应用前景。     

基于瞬变电磁法的电磁场矿藏解释仿真技术研究

将瞬变电磁法（Transient Electromagnetic Method,TEM）应用到布敦花铜矿矿区的解释中,首先需建立电磁感应模型,对瞬变电磁场中的二次磁场频率、时间特性进行分析,通过MATLAB软件进行程序编写,得出相应的特性曲线图。然后分别计算早、晚期视电阻率和全程视电阻率,得出瞬变电磁场在矿区变化时的视电阻率参数变化,得出相应的数据结论。最后,利用MATLAB的网格化函数,对数据进行处理,模拟出瞬变电磁场在铜区时的异常场变化,完成对矿区的解释。从结果分析可以看出,利用瞬变电磁法解释的结果比利用物探资料进行矿区解释的结果更简单、更精确。这样一来,既提高了工作效率,又提高了解释的准确率。     

适用于鱼肉中氯霉素检测的抗体包被金磁纳米微粒修饰安培免疫传感器研究

研制了基于氯霉素抗体包被Fe3O4/Au金磁纳米微粒(GMP)和三乙撑四胺铜(II)(CuL)共固定修饰平面热解石墨电极的安培免疫传感器(PRG|CuL / anti CAP-GMP),用于测定鱼肉中CAP含量.该免疫传感器是利用外加磁场,将anti CAP-GMP吸引到CuL修饰的PRG电极(PRG|CuL)表面制备而成.CuL对H2O2还原具有良好的电催化能力,当该传感器在含CAP样品液中温育后,CAP与电极表面的anti CAP的免疫结合物导致CuL对H2O2的催化还原电流(I)降低,电流下降值(△I)和CAP浓度成正比,可用于CAP定量测定.在25℃的pH=6.5磷酸盐缓冲液(PBS)中温育30 min,该传感器对CAP的检测线性范围为0.6~110 ng/mL,检出下限为0.092 ng/mL(3σ法).应用于鱼肉中CAP检测并与传统的液相色谱法(HPLC)比较,结果一致,其添加回收率在97%~104%之间.该免疫传感器集分离、富集为一体,电极表面可更新,检测灵敏快速,对于水产品中痕量氯霉素分析提供了一种新颖的方法.     

The Holy Alignment: Geodesic and Astronomical Fundamentals for Calculating the Adjustment of Medieval Naves

It is commonly believed that the longitudinal axes of churches extend exactly in an east-west direction. However, thorough investigations have shown that this is not always correct; rather, both southern and northern deviations of up to about 25° can occur. The angular deviation between the church axis and true east is called the Holy Alignment. This present study presents the possibility that the nave is oriented towards the direction of the sun-rising point on the name day of the patron saint of the church. If several saints share the patronage, the Holy Alignment equals the algebraic sum of the angular distances for each saint. The orientation of a nave can be analyzed by means of common mathematical relations used in geodesy, astronomy and gnomonics. In order to perform such an analysis, it is necessary to know the history of the patronage of the church; the Gauss-Krüger coordinates of the ground plan; and characteristic astronomical quantities at the time the church was built. A calculated example with the saints Andrew, James and Philip for the year 980 illustrates the analysis. An appendix deals with the influence of atmospheric refraction on the apparent altitude of the sun near the horizon.     

基于混沌遗传算法的铜闪速熔炼过程操作模式智能优化系统

提出了一种铜闪速熔炼操作模式智能优化系统．该系统首先采用动态T-S递归模糊神经网络（Dynamic T-S Recurrent Fuzzy Neural Network, DTRFNN）对工艺参数进行软测量,再采用模式分解的方法对海量数据进行分解,最后对模式子集采用基于神经网络和混沌遗传算法的铜闪速熔炼操作模式智能优化方法进行优化．将该控制系统应用到铜闪速熔炼中,提高了铜闪速炉的生产效率．     

Ligand Design in Atomically Precise Copper Nanoclusters and Their Application in Electrocatalytic Reactions

Metal nanoclusters (MNCs) are compositionally well-defined and also structurally precise materials with unique molecule-like properties and discrete electronic energy levels. Atomically precise ligand-protected Cu nanoclusters (LP-CuNCs) are one category of typical MNCs that usually demonstrate unique geometric and electronic structures to serve as electrocatalysts. However, the synthesis, application, as well as structure-performance relationship of LP-CuNCs are not adequately studied. Significantly, the ligands are essential to the geometric structure, crystal structure, size, and electronic structure of LP-CuNCs, which determine their physiochemical properties and applications. In this review, significant progress in the ligand design of LP-CuNCs, and their application in electrocatalytic reactions is introduced. The general basics of ligand-protected MNCs (LP-MNCs) are first introduced and the functions of ligands are emphasized. Subsequently, a series of different ligands for LP-CuNCs including thiolates, phosphines, alkynyl, polymers, and biomolecules are highlighted. Thereafter, their applications in different electrocatalytic reactions are discussed. It is believed that this review will not only inspire the design and synthesis of novel LP-CuNCs, but also contribute to the extension of their applications in electrocatalytic reactions and the establishment of accurate structure-performance relationships.     

Origin of Hole-Trapping States in Solution-Processed Copper(I) Thiocyanate and Defect-Healing by I2 Doping

Solution-processed copper(I) thiocyanate (CuSCN) typically exhibits low crystallinity with short-range order; the defects result in a high density of trap states that limit the device's performance. Despite the extensive electronic applications of CuSCN, its defect properties are not understood in detail. Through X-ray absorption spectroscopy, pristine CuSCN prepared from the standard diethyl sulfide-based recipe is found to contain under-coordinated Cu atoms, pointing to the presence of SCN⁻ vacancies. A defect passivation strategy is introduced by adding solid I₂ to the processing solution. At small concentrations, the iodine is found to exist as I⁻ which can substitute for the missing SCN⁻ ligand, effectively healing the defective sites and restoring the coordination around Cu. Computational study results also verify this point. Applying I₂-doped CuSCN as a p-channel in thin-film transistors shows that the hole mobility increases by more than five times at the optimal doping concentration of 0.5 mol.%. Importantly, the on/off current ratio and the subthreshold characteristics also improve as the I₂ doping method leads to the defect-healing effect while avoiding the creation of detrimental impurity states. An analysis of the capacitance-voltage characteristics corroborates that the trap state density is reduced upon I₂ addition.     

Antioxidant High-Conductivity Copper Pastes Based on Core–Shell Copper Nanoparticles for Flexible Printed Electronics

As a nontoxic and cost-effective material, copper pastes have attracted great attention in both academia and industry. However, achieving the long-term stability of copper pastes remains challenging due to their susceptibility to oxidation. Therefore, stable copper nanoparticles with a Cu(0)–Cu(I) core–shell structure containing a surface passivation layer of formate ions-involved Cu(I) coordination polymers are developed. Based on the self-reducing nature of the passivation layer, the nanoparticle-based copper pastes can be sintered in <1 min, showing high electrical conductivity (220 000 S cm⁻¹), mechanical flexibility, and long-term stability after sintering. The excellent properties of the developed copper pastes are even comparable with the ones of silver pastes. These stable copper pastes have broad applications in printed electronics (e.g., glucose sensors, RFID tags, and electromagnetic shielding films), showing great potential in the fabrication of flexible printed electronics.