Influences of metallic polymeric materials on the properties of fresh polyester and acrylic polymer concrete

To investigate the influences of three metallic polymeric materials in polyester and acrylic fresh polymer concretes (PCs), PC‐incorporated different levels of these materials have been investigated for their properties of fresh PC. The mix design was made and optimized for workability, strength, and economy, depending on the resin viscosity, the intended use, and the additional quantities of these polymeric materials. The properties investigated include workability, working time, and curing time of fresh PC. It is concluded that these polymeric materials offer the possibility of improving properties of polyester and acrylic fresh polymer concretes. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci, 2006     

Design and development of low‐cost optical‐fiber sensors for temperature metrology: Process monitoring of an epoxy resin system

This article reports the design and deployment of two optical‐fiber temperature sensors based on the fiber Fabry–Perot etalon. The first involved the use of an extrinsic fiber Fabry–Perot sensor, but in this instance, the coefficient of thermal expansion of the reflector and/or capillary was chosen to offer a mismatch. Hence, the cavity length could increase or decrease according to the coefficient of thermal expansion of the fiber and/or capillary. For comparison, single‐mode and multimode optical‐fiber Bragg gratings were also used as temperature sensors. The Fabry–Perot sensors operated from ?50 to 410°C. The accuracy of the measurements was up to ±0.5°C with a low‐cost charged‐coupling‐device spectrometer. The sensors also worked effectively in a microwave oven and in a composite panel in an autoclave. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 83–95, 2004     

Influence of the synthesis conditions on the curing behavior of phenol–urea–formaldehyde resol resins

The curing behavior of synthesized phenol–urea–formaldehyde (PUF) resol resins with various formaldehyde/urea/phenol ratios was studied with differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). The results indicated that the synthesis parameters, including the urea content, formaldehyde/phenol ratio, and pH value, had a combined effect on the curing behavior. The pH value played an important role in affecting the shape of the DSC curing curves, the activation energy, and the reaction rate constant. Depending on the pH value, one or two peaks could appear in the DSC curve. The activation energy was lower when pH was below 11. The reaction rate constant increased with an increase in the pH value at both low and high temperatures. The urea content and formaldehyde/phenol ratio had no significant influence on the activation energy and rate constant. DMA showed that both the gel point and tan δ peak temperature (T_tanδ) had the lowest values in the mid‐pH range for the PUF resins. A different trend was observed for the phenol–formaldehyde resin without the urea component. Instead, the gel point and T_tanδ decreased monotonically with an increase in the pH value. For the PUF resins, a high urea content or a low formaldehyde/phenol ratio resulted in a high gel point. The effect of the urea content on T_tanδ was bigger than that on the gel point because of the reversible reaction associated with the urea component. Too much formaldehyde could lead to more reversible reactions and a higher T_tanδ value. The effects of the synthesis conditions on the rigidity of the cured network were complex for the PUF resins. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 95: 1368–1375, 2005     

绿色环保橡胶硫化配方研究

针对硫磺、促进剂M(2-巯基苯并噻唑)在橡胶制品加工中对环境的污染和对工人健康的危害，研究了硫磺、硫化剂DCP(过氧化二异丙苯)、硫化促进刑M、促进剂CZ(N-环己基-2-苯并噻唑次磺酰胺)在橡胶制品加工中的应用，从环保的角度进行了新的配方设计，并进行了性能测试。结果表明：同等务件下，生产相同的产品胶板，使用硫化剂DCP及促进剂CZ的制品综合性能要优于使用硫磺和促进刑M的制品，且有利于环保。     

Latent catalyst effects in halogen‐free epoxy molding compounds for semiconductor encapsulation

Latent catalyst effects were investigated to improve the physical properties of halogen‐free epoxy molding compounds (EMCs) for semiconductor encapsulation. In this study, biphenyl‐type resins were used as the epoxy and hardener resin for halogen‐free EMCs to obtain high flame‐retardant properties and high filler contents. Latent catalyst effects were examined with two kinds of EMC compositions, halogen‐free EMCs and conventional EMC compositions. We used triphenylphosphine‐benzoquinone salt (TPP‐BQ) as a latent catalyst. Spiral flow and gel time were measured to investigate the change in moldability with the latent catalyst. We measured package fail, moisture absorption, and delamination for reliability evaluation and flexural strength, flexural modulus, and adhesion for mechanical properties to examine latent catalyst effects. An improvement in moldability, reliability, and the mechanical properties were observed in two types of halogen‐free EMCs with TPP‐BQ as a latent catalyst. These phenomena were seen in conventional EMCs, including o‐cresol novolac epoxy resin. The cure kinetics of these systems were investigated by differential scanning calorimetry with an isothermal approach to explain these phenomena. The results indicate that the improvement in moldability in halogen‐free EMCs with TPP‐BQ was due to the low conversion rate of this system, and the increase in mechanical properties was attributed to the high conversion of curing reaction. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 2287–2299, 2005     

超支化聚酯的合成及光固化性能研究

通过甲基四氢苯酐和环氧丙醇的开环聚合反应，一步法制备超支化聚酯，聚酯的数均摩尔质量为1450～2600g／mol，支化度在0．41～0．71之间。用甲基丙烯酸缩水甘油酯改性，合成了UV固化超支化聚酯，并对其光固化性能进行了初步研究，发现超支化聚酯能有效降低固化膜的线收缩率，聚酯的官能度越高，固化膜的硬度越大，固化速度越快，在约1s的固化时问内凝胶率超过75％。     

Characterization of diene monomers as healing agents for autonomic damage repair

For effective autonomic healing of damaged polymers and composites, it is essential to understand how the encapsulated healing agent behaves during and after cure. In this study, two different diene monomers [dicyclopentadiene (DCPD), 5‐ethylidene‐2‐norbornene (ENB)] and their blends were investigated as candidate self‐healing agents, using differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). DSC experiments for samples showed that DCPD has a melting transition while the blends and ENB have no melting in the temperature range measured. Samples for DMA were prepared and tested by two different methods in the presence of Grubbs catalyst. In the first case (method I), monomers were mixed with the catalyst directly. In the second case (method II), the catalyst was mixed with an epoxy/amine system and cured into a film that was polished to expose the catalyst. The cure behavior of monomer samples was examined on the epoxy/catalyst film. Method II is considered to be a simulative experiment, which can occur in a real situation for damaged epoxy matrix composite. It was found that acceleration of cure reaction and reduction of catalyst concentration is possible by blending DCPD with ENB from method I. Storage modulus (G′) value after cure in method II showed that a DCPD : ENB blend ratio of 1 : 3 reached the highest G′ value at shorter cure time and lower catalyst levels than other monomer combinations. DCPD and ENB are presumably responsible for increases in rigidity and reactivity, respectively. This may improve the healing efficiency in autonomic damage repairing applications. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 1266–1272, 2006     

Using silica nanoparticles as curing reagents for epoxy resins to form epoxy–silica nanocomposites

Nanoscale colloidal silica showed high reactivity toward curing epoxy resins to form epoxy–silica nanocomposites under mild conditions. Adding a certain amount (5000 ppm) of magnesium chloride lowered the activation energy of the reaction from 71 to 46 kJ/mol. Less and more magnesium chloride both exhibited counter action on lowering the activation energy of the curing reaction. Tin chloride dihydrate and zinc acetylacetonate hydrate were also added into the curing compositions, however, showing no significant effect on promoting the curing reaction. Through this curing reaction, epoxy–silica nanocomposites containing high silica contents up to 70 wt % were obtained. Therefore, this reaction provided a novel and convenient route in preparation of epoxy–silica nanocomposites. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 95: 1237–1245, 2005     

Fracture toughness of bisphenol A‐type epoxy resin

The relationship between the postcuring conditions and the fracture toughness of a bisphenol A‐type epoxy resin cured with acid anhydride was investigated. The glass transition temperature and fragility parameter, derived from the thermo‐viscoelasticity, were used to characterize the epoxy resin postcured under various conditions. Relationship between these two parameters and the fracture toughness was then investigated, based on the fractography results of a microscopic roughness examination of a fractured surface. The values of the glass transition temperature and fragility greatly depended on the postcuring conditions. The glass transition temperature was approximately 400 K when the crosslinking reaction was saturated. The fragility was independent of the saturation of the reaction and varied between 50 and 180. The results of the fracture test and fractography examination showed that there was no direct correlation between the glass transition temperature, the fracture toughness, and the roughness. On the other hand, there was a correlation between the fragility, fracture toughness, and roughness when the glass transition temperature saturated (at 400 K). As the fragility decreased from 180 to 50, the fracture toughness increased from 0.6 to 1.1 MPa · m^1/2 at the same glass transition temperature. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 10: 2266–2271, 2002     

中温热熔预浸料用环氧树脂及其固化体系的研究进展

本文综述了中温热熔预浸料用环氧树脂体系,包括国内外基体树脂及固化体系的发展现状;分析了粘度对基体树脂的影响规律、固化剂和促进剂的匹配、催化剂的选择等;重点介绍了脲类衍生物和咪唑两类固化促进体系的进展;表明环氧树脂热熔预浸料研制的技术关键是选择合理的树脂体系组合,有较长潜伏期的固化剂和促进剂的匹配及合适的催化剂。