钢渣沥青混凝土技术及其应用研究进展

钢渣常被当成工业废弃物处置,但其碱性强、棱角丰富,兼具有优异的力学特性,可以改善沥青混凝土的抗水损害、抗高温变形以及耐磨和抗滑等性能,被认为是可替代天然矿质集料的理想筑路材料。近年来道路建设对集料用量的高需求与天然集料短缺之间的矛盾越来越突出,钢渣沥青混凝土技术因而成为备受关注的热点。概述了钢渣的材料特性以及钢渣沥青混凝土的设计与性能,介绍了钢渣沥青混凝土的实际应用情况,研究了钢渣沥青混凝土长期应用后的路面性能变化,最后对钢渣沥青混凝土未来的发展趋势进行了展望。     

浇注式沥青混凝土现状与发展

为进一步确定浇注式沥青混凝土科学合理的性能评价指标及要求,全面梳理了国内外浇注式沥青混凝土相关规范,对比评价了不同规范中的技术指标要求及级配范围,系统地调查了大量实体工程及研究动态,厘定了浇注式沥青混凝土钢桥面铺装结构层组合、原材料类型和技术指标要求及级配类型,为浇注式沥青混凝土规范完善与质量控制奠定了基础。结果表明:推荐钢桥面铺装结构层组合为30~35mm GA-10+35~40mm SMA-10,GA基础沥青为SBS改性沥青+TLA(15%~30%),采用2%降粘剂;推荐性能评价指标要求范围为油石比7.9%~8.5%、流动度10~17s、贯入度1.4~2.5mm、贯入度增量不超过0.25mm、弯拉应变不小于7 000με、动稳定度不小于1 000次/mm(参考指标);疲劳性能试验以控制应变模式进行,结果以实测为准。     

超声冲击对高速列车转向架焊接十字接头超高周疲劳性能的影响

针对高速列车转向架在实际运用中出现的疲劳问题,利用HJ-Ⅲ型超声冲击处理装置,对高速列车转向架用SAM490BW钢十字接头焊趾进行超声冲击处理,并对处理后接头的超高周疲劳性能进行研究。结果表明,原始焊态试样和超声冲击态试样的S-N曲线均出现了传统意义上的水平段。超声冲击处理试样的疲劳强度相比于未处理试样提高了25%。经过超声冲击处理后,疲劳裂纹源的数量由多个变为单个,焊接接头焊趾处的应力集中系数下降了32.4%,降低了裂纹萌生概率;超声冲击降低了焊趾区域的残余拉应力,并诱发产生残余压应力,高达-255.5 MPa;焊趾表层晶粒得到细化,晶粒平均尺寸小于100nm;裂纹在塑性变形区扩展路径变长。     

低压烧结温度对一步法制备超细晶WC-Co基硬质合金组织及性能的影响

采用等离子球磨技术制得W-C-10Co-0.9VC-0.3Cr_3C_2纳米复合粉体,并利用单向模压成型法将其压制成生坯,再经低压烧结一步法制备成硬质合金。研究表明,等离子球磨3h所获得的复合粉体呈片层状形貌,并且成分分布均匀。在1 380℃及1 400℃烧结时,由于等离子球磨的特殊作用,VC、Cr_3C_2对WC晶粒长大抑制作用突显。1 380℃烧结制备的硬质合金,致密度为99.2%,WC平均晶粒尺寸为250nm,硬度和横向断裂强度分别为92.3HRA和2 443 MPa,具有最佳的WC晶粒尺寸与致密度配合,以及最佳的综合力学性能。     

Ni-金刚石复合涂层的结构优化及基础磨削性能

采用电沉积技术在304不锈钢基体上制备了Ni-金刚石复合涂层。通过金刚石掺入量、加厚镀时间优化了金刚石复合涂层结构,利用球-盘式摩擦磨损试验仪研究了优化后的金刚石复合涂层对不同材料偶件(GCr15、SiC、304不锈钢)的磨削性能。结果表明:金刚石掺入量为1.5g/L时,金刚石上砂均匀且密集;加厚镀15min时,金刚石埋入率约为2/3,附着强度较好,适合磨削加工;GCr15、SiC、304不锈钢3种材料偶件的磨损体积依次减小,分别为:0.353 76mm~3、0.315 90 mm~3、0.194 01 mm~3,金刚石复合涂层对GCr15有较好的磨削性能;金刚石复合涂层磨削GCr15、SiC、304不锈钢均发生了磨粒磨损,此外,GCr15还发生了微弱的化学磨损,不锈钢发生了较明显的化学磨损和粘着磨损。     

LiNi0.8 Co0.15 A10.05 O2正极材料的表面包覆改性研究

LiNi_0.8 Co_0.15 A1_0.05 O₂正极材料具有容量高、价格低等优点,被认为是最具发展前景的锂离子电池正极材料之一.但LiNi 0.8Co 0.15A1 0.05O₂材料本身存在充放电过程中容量衰减较快、倍率性能差和储存性能差等缺陷,影响了其进一步发展.本文以 LiNi 0.8Co 0.15A1 0.05O₂为研究对象,采用共沉淀法制备氢氧化物前驱体,在前驱体的表面包覆一层Ni 1/3Co 1/3 Mn 1/3(OH)₂,制备成具有核壳结构的正极材料.通过XRD、SEM、EDX、电化学测试等分析手段,系统地研究了其结构、形貌以及电化学性能.分析表明:包覆改性后,LiNi 0.8Co 0.15Al 0.05O₂正极材料在0.1、0.2、0.5、1 C倍率下,材料的首次充放电比容量分别为167.6,160.1,0.4,8.5 mAhg -1.由0.1到1 C,包覆改性前后的正极材料的放电比容量衰减量由34.7 mAhg -1降为29.1 mAhg -1,容量衰减百分比由22.1%降低到17.4%.综合性能分析认为,包覆改性后电化学性能有一定的改善.     

Experimental investigation on preparation and performance of clear asphalt

Abstract

Coloured micro-surfacing technology has become increasingly popular in pavement construction because of its economic benefit and ability to accept traffic quickly. The main goal of this study was to produce a clear asphalt with superior performance that can be easily emulsified. Two types of resin that are easy to emulsify and one kind of extract oil were used to synthesise the clear asphalt. The clear asphalt was mixed with a styrene butadiene styrene (SBS) modifier at different proportions using a mechanical agitator. The physical properties of the samples were determined via conventional bitumen tests and the optimum formula was obtained by changing the mixture ratio through orthogonal experimentation. The thin-film oven test evaluated the ageing property of the clear asphalt. The surface energy components corresponding to the advancing process and the receding process were determined using the Wilhelmy plate method. The surface free energy (SFE) of the aggregates was measured with a gravimetric sorption analyser. The adhesive bond energies between asphalt samples and aggregates were calculated using their SFE components to evaluate their properties of fracture and healing. Results show that depending on the amount and type of resin added, different synthetic clear asphalts can be obtained. Further, the clear asphalt mixed with SBS is capable of synthesising better properties at high or low temperature. The clear asphalt with aggregates had fracture and healing properties similar to common base asphalt.     

Performance of porous asphalt mixture with various additives

The objective of this study is to evaluate the approaches to improve the durability and strength of the porous asphalt through laboratory testing. Porous asphalt specimens were prepared using three types of binders: high-viscosity binder (HVB), PG76-22 and PG70-22. Various additives: fibre, hydrated lime and DBS polymer, were utilised in the porous asphalt. Comprehensive laboratory tests, including strength test, binder draindown test, Cantabro abrasion test, moisture susceptibility test, rutting test, thermal stress restrained sample test, and permeability test, were conducted. It is found that HVB significantly improved the overall performance of the porous asphalt; DBS additive improved its high-temperature performance, but lowered the cracking resistance at low temperature as well as the durability; fibre enhanced its durability and anti-cracking performance at low temperature; hydrated lime improved its moisture stability while weakening its durability. It is concluded that HVB and polyester fibre should be used in all porous asphalt; DBS additive is good for porous asphalt in high-temperature areas, and hydrated lime can be added to porous asphalt in rainy areas.     

Managing sequential ambidexterity in the electronics industry: roles of temporal switching capability and contingent factors

Researchers on organisational ambidexterity have proposed several solutions to address the potential conflicts between exploration activities and exploitation activities. Unlike simultaneous ambidexterity, sequential ambidexterity – defined as temporal switching between exploration and exploitation – has not been examined fully, and the conditions under which this temporal switching can be successful are unclear. This paper proposes the concept of temporal switching capability to better understand the process by which sequential ambidexterity is executed. In addition, we hypothesise that performance effects are contingent upon firm-specific factors: a firm’s business strategy and absorptive capacity. Utilising three sources of data – a secondary database, annual reports and a survey administered to 145 firms in the electronics industry with 10-year observations – we find support for our hypotheses. The results show that the temporal switching capability positively relates to new product performance and that business strategy type and absorptive capacity have moderating effects. The results are meaningful in both theory and practice.     

Formation of Cu Nanodots on Diamond Surface to Improve Heat Transfer in Cu/D Composites

Diamond‐dispersed copper matrix (Cu/D) composite materials with different interfacial configurations are fabricated through powder metallurgy and their thermal performances are evaluated. An innovative solution to chemically bond copper (Cu) to diamond (D) has been investigated and compared to the traditional Cu/D bonding process involving carbide‐forming additives such as boron (B) or chromium (Cr). The proposed solution consists of coating diamond reinforcements with Cu particles through a gas–solid nucleation and growth process. The Cu particle‐coating acts as a chemical bonding agent at the Cu–D interface during hot pressing, leading to cohesive and thermally conductive Cu/D composites with no carbide‐forming additives. Investigation of the microstructure of the Cu/D materials through scanning electron microscopy, transmission electron microscopy, and atomic force microscopy analyses is coupled with thermal performance evaluations through thermal diffusivity, dilatometry, and thermal cycling. Cu/D composites fabricated with 40 vol% of Cu‐coated diamonds exhibit a thermal conductivity of 475 W m^?1 K^?1 and a thermal expansion coefficient of 12 × 10^?6 °C^?1. These promising thermal performances are superior to that of B‐carbide‐bonded Cu/D composites and similar to that of Cr‐carbide‐bonded Cu/D composites fabricated in this study. Moreover, the Cu/D composites fabricated with Cu‐coated diamonds exhibit higher thermal cycling resistance than carbide‐bonded materials, which are affected by the brittleness of the carbide interphase upon repeated heating and cooling cycles. The as‐developed materials can be applicable as heat spreaders for thermal management of power electronic packages. The copper‐carbon chemical bonding solution proposed in this article may also be found interesting to other areas of electronic packaging, such as brazing solders, direct bonded copper substrates, and polymer coatings.