微重力落塔电磁悬吊、释放技术研究

论述了微重力落塔电磁悬吊、释放、提升机构的关键技术,电磁释放过程的特性分析以及微重力落塔实际试验的情况。分析说明:悬吊、释放性能的好坏决定了试验落舱的微重力水平,也是微重力落塔试验能否成功的关键技术。     

Studies on Catalytic Side-Chain Oxidation of Nitroaromatics to Aldehydes with Oxygen

The side-chain oxidation of 2-nitrotoluene in liquid phase in the presence of catalytic amount of manganese sulfate and stoichiometric amount of potassium hydroxide with oxygen was studied. In the most favorable conditions, over 80% of conversion of 2-nitrotoluene and 50% of selectivity to 2-nitrobenzaldehyde was achieved. Effects of the reaction parameters on the conversion of the reactant and the selectivity of the product were examined. These results, together with EPR spectroscopic study, show that a benzyl anion was formed in the early stage of the reaction, which was then converted to the final product via a free radical mechanism.     

盛钢桶铝锆碳滑板的研究与生产

通过研究,在盛钢桶用铝锆碳滑板的生产过程中,调整了ZrO2的加入量,添加了复合抗氧化剂,使滑板具用较高的强度和抗氧化性能,提高了滑板的使用寿命.     

NdBO_3和 Nd(BO_2)_3的标准生成自由能

用 CaF_2单晶和 ZrO_2(+MgO)为固体电解质分别构成原电池:■和 Pt,B_((s)),NdBO_(3(s)),Nd(BO_2)_(3(s))|ZrO_2|Cr_2O_(3(s)),Cr_((s)),Pt联合测了 NdBO_3和 Nd(BO_2)_3的标准生成自由能:ΔG~0_(NdBO_3)=-1757+3.8×10~(-1)TΔG~0_(Nd)(BO_2)_3=-3435+8.8×10~(-1)T由此求出由氧化物生成 NdBO_3及 Nd((BO_2)_3)的反应的标准生成自由能变化:1/2Nd_2O_(3(s))+1/2B_2O_(3■)=NdBO_(3(s))ΔG~0_(NdBO_3)=-242+1.4×10~(-1)T和 1/2Nd_2O_(3(s))+3/2B_2O_(3(s))=Nd(BO_2)_(3■)ΔG~0′_(NdBO_2)3=-693+4.6×10~(-1)T     

PVC四通管注射模设计

介绍了PVC四通管注射模设计 ,阐述了弯型芯的旋转抽芯过程以及模具顶出、回程及冷却系统设计。实践证明 ,该模具结构合理 ,生产的塑件可以满足设计要求     

高层建筑损伤识别中的补偿算法

本文在已有研究工作的基础上，提出了处理激励测量信息不完备情况下的补偿算法。此方法主要针对高层建筑动力检测中强迫激励的情况，是一种基于时域的识别方法，该方法实际上是利用客观工程实际中结构系统激励所具有的物理持征作为识别计算的辅助条件，来解决测量信息的不完备性问题。算例分析表明了该方法的可行性。     

1,4,5,8-四氮杂氢化萘（2,3,-6,7）并双呋咱衍生物的合成

由1，4，5，8—四氮杂氢化萘(2，3，-6，7)并双呋咱经羟甲基化、酰化、硝化和叠氮化等反应合成出一系列热稳定的呋咱含能衍生物，并以^1HNMR、IR、MS、元素分析鉴定了其结构。     

Implicit integration and consistent tangent modulus of a time‐dependent non‐unified constitutive model

This paper describes the implicit integration and consistent tangent modulus of an inelastic constitutive model with transient and steady strain rates, both of which are time‐ and temperature‐dependent; the transient rate is influenced by the evolution of back stress decomposed into parts, while the steady rate depends only on applied stress and temperature. Such a non‐unified model is useful for high‐temperature structural analysis and is practical owing to the ease in determining material constants. The implicit integration is shown to result in two scalar‐valued coupled equations, and the consistent tangent modulus is derived in a quite versatile form by introducing a set of fourth‐rank constitutive parameters into the discretized evolution rule of back stress. The constitutive model is, then, implemented in a finite element program and applied to a lead‐free solder joint analysis. It is demonstrated that the implicit integration is very accurate if the multilinear kinematic hardening model of Ohno and Wang is employed, and that the consistent tangent modulus certainly affords quadratic convergence to the Newton–Raphson iteration in solving nodal force equilibrium equations. Copyright © 2003 John Wiley & Sons, Ltd.     

喇曼自由电子激光器辐射谱的测量

本文报道了利用微波栅摄谱仪测量在超辐射工作条件下的喇曼自由电子激光器辐射谱的初步结果。观察到了毫米波自由电子激光器的调谐特性。实验结果表明,辐射谱的中心频率随波荡场强度的增加而减小,这与考虑波导模影响的集体制式自由电子激光的有关理论预言相符。     

Microstructure and thermal behavior of Sn-Zn-Ag solders

The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis results indicate that Ag₅Zn₈ and AgZn₃ become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0% to 3.0%