塑封半导体器件的可靠性增长分析

应用ＥＤＲＩＣ可靠性模型对彩电配套用塑封整流二极管进行了增长分析,讨论了该器件的失效模式、失效机理及增长对策,使该器件的可靠性得到了较大的增长。     

The effect of electroplating parameters and substrate material on tin whisker formation

Electroplated tin finishes are widely used in the electronics industry due to their excellent solderability, electrical conductivity and corrosion resistance. However, the spontaneous growth of tin whiskers during service can result in localised electrical shorting or other harmful effects. Until recently, the growth of tin whiskers was successfully mitigated by alloying the tin with lead. However, restriction in the use of lead in electronics as a result of EU legislation (RoHS) has led to renewed interest in finding a successful alternative mitigation strategy.Whisker formation has been investigated for a bright tin electrodeposit to determine whether whisker growth can, at least partially, be mitigated by control of electroplating parameters such as deposition current density and deposit thickness. The influence of substrate material and storage at 55 °C/85% humidity on whisker growth have also been investigated.Whisker growth studies indicate that deposition parameters have a significant effect on both whisker density and whisker morphology. As deposition current density is increased there is a reduction in whisker density and a transition towards the formation of large eruptions rather than potentially more harmful filament whiskers. Increasing the tin coating thickness also results in a reduction in whisker density. Results demonstrate that whisker growth is most prolific from tin deposits on brass, whilst that from tin deposits on rolled silver is greater than that observed for tin deposits on copper.     

Effects of deposition rate on the size of self-assembled InP islands formed on GaInP/GaAs(100) surfaces

Utilizing the Stranski-Krastanov growth mode, three-dimensional InP islands are formed on a GalnP/GaAs surface using metalorganic chemical vapor deposition. The islands have been investigated with atomic force microscopy, and the effect of the deposition rate on the shape of the islands has been quantified. The height of the islands varies with deposition rate, whereas the basediameters are nearly constant around 1260 ± 35Å. The island height is 290 ± 12 Å at a high (2.6 ML/s) deposition rate and decreases to approximately 250 ± 16 Å for low (0.1 ML/ s) and moderate (0.8 ML/s) deposition rates.     

单分散尺寸可控的SiO_2胶体微球的制备

采用改进的Stber方法-种子颗粒生长法合成高单分散性、尺寸可控的SiO2微球,该方法克服了Stber方法中SiO2胶体微球成核迅速、对反应条件敏感使最终微球粒径难以控制的缺点,在控制超细颗粒形貌和粒径方面具有显著的优越性。通过精细调制正硅酸乙酯(TEOS)、氨水和去离子水的浓度,探索了在最优条件下制备单分散度较高的SiO2微球的工艺技术,制备出23.4～471.3 nm不同尺寸的SiO2微球。结果表明,SiO2颗粒越小,其形貌越不规则;SiO2颗粒越大,其表面越光滑,单分散性越好。     

Arsenic incorporation in MBE grown Hg1−xCdxTe

The p-type doping of Hg_1−xCd_xTe (MCT) has proven to be a significant challenge in present day MCT-based detector technology. One of the most promising acceptor candidates, arsenic, behaves as an amphoteric dopant which can be activated as an acceptor during Hg-rich, low temperature annealing of as-grown molecular beam epitaxy (MBE) samples. This study focuses on developing an understanding of the microscopic behavior of arsenic incorporation during MBE growth. In particular, the question of whether arsenic incorporates as individual As atoms, as As₂ dimers, or as As₄ tetramers is addressed for MBE growth with an As₄ source. A quasithermodynamical model is employed to describe the MCT growth and As incorporation, with parameters fitted to an extensive database of samples grown at the Microphysics Laboratory. The best fits for growth temperatures between 175 and 185°C are obtained for arsenic incorporation as As₄ or possibly as As₄ clusters, with lower probabilities for As₂ and individual As atoms. Based on these results, we investigate the relaxed atomic configurations of As₄ and As₂ in bulk HgTe by ab initio total energy calculations. The calculations are performed in the pseudopotential density-functional framework within the local density approximation, employing supercells with periodic boundary conditions. The lattice distortions due to As₄ and As₂ in bulk HgTe are predicted to be modest due to the small size of these arsenic clusters.     

国外太阳能电池铸锭及切片设备概况

光伏产业涵盖了太阳光能转化为电能的一系列过程,而设备是贯穿整个产业链的基础,光伏产业链的每一个环节都离不开相应的生产设备。主要介绍几种国外太阳能光伏行业领先的多晶硅铸锭生长系统和硅片切割系统的设备概况。     

LED用非极性GaN外延膜的制备技术进展

GaN是实现白光LED的关键材料。GaN外延膜通常沿极性c轴生长,基于极性GaN的LED有源层量子阱中由于强内建电场的存在而导致器件发光效率降低,而沿非极性面生长的GaN外延膜可以改善或消除极化效应导致的辐射复合效率降低和发光波长蓝移等问题。文章总结了非极性GaN外延膜的制备技术及研究进展,包括平面外延技术和横向外延过生长技术,指出开发非极性GaN自支撑衬底、发展非极性GaN的横向外延生长技术是制备低位错密度非极性GaN的研究方向。     

Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

Long-term, solid-state intermetallic compound (IMC) layer growth was examined in 95.5Sn-3.9Ag-0.6Cu (wt.%)/copper (Cu) couples. Aging temperatures and times ranged from 70°C to 205°C and from 1 day to 400 days, respectively. The IMC layer thicknesses and compositions were compared to those investigated in 96.5Sn-3.5Ag/Cu, 95.5Sn-0.5Ag-4.0Cu/Cu, and 100Sn/Cu couples. The nominal Cu₃Sn and Cu₆Sn₅ stoichiometries were observed. The Cu₃Sn layer accounted for 0.4–0.6 of the total IMC layer thickness. The 95.5Sn-3.9Ag-0.6Cu/Cu couples exhibited porosity development at the Cu₃Sn/Cu interface and in the Cu₃Sn layer as well as localized “plumes” of accelerated Cu₃Sn growth into the Cu substrate when aged at 205°C and t>150 days. An excess of 3–5at.%Cu in the near-interface solder field likely contributed to IMC layer growth. The growth kinetics of the IMC layer in 95.5Sn-3.9Ag-0.6Cu/Cu couples were described by the equation x=x_o+Atⁿexp [−ΔH/RT]. The time exponents, n, were 0.56±0.06, 0.54±0.07, and 0.58±0.07 for the Cu₃Sn layer, the Cu₆Sn₅, and the total layer, respectively, indicating a diffusion-based mechanism. The apparent-activation energies (ΔH) were Cu₃Sn layer: 50±6 kJ/mol; Cu₆Sn₅ layer: 44±4 kJ/mol; and total layer: 50±4 kJ/mol, which suggested a fast-diffusion path along grain boundaries. The kinetics of Cu₃Sn growth were sensitive to the Pb-free solder composition while those of Cu₆Sn₅ layer growth were not so.     

Addressable growth of oriented organic semiconductor ultra-thin films on hydrophobic surface by direct dip-coating

Oriented organic field-effect transistor (OFET) stripe arrays on hydrophobic substrates were fabricated by fast dip-coating technique. The addressable growth was achieved by decreasing surface energy of the channel areas with respect to the electrodes via hydrophobic treatment. The higher surface energy of the electrodes allows solution to adhere and then organic semiconductors nucleate and bridge the channels after evaporation of the solvent. Area-selective behaviour can be controlled by adjusting surface property of transistor channel, geometry features of the gold electrodes, pulling speed and evaporation atmosphere. The mechanism behind is the competition between receding of the solution and evaporating of the solvent that generate the organic semiconductor films on the substrate. The patterned bottom-contact transistor arrays exhibit carrier mobility of 2.0 × 10⁻³ cm² V⁻¹ s⁻¹, while no field-effect characteristics can be detected for bottom-contact arrays without hydrophobic treatment. Such reliable, fast and solution-based patterned OFET arrays are highly desirable for large-scale and low-cost production.     

镁合金微弧氧化膜表面层与致密层界面组织的研究

研究镁合金微弧氧化膜的表面层与致密层界面处的组织形态。在磷酸盐碱性电解液(5～20g/LNaH2PO4,1～5g/LNaOH,5～8g/LKF,0.5～2g/LNa3C6H5O7,0.5～2g/LEDTA)中,以AZ91镁合金为基体制备出微弧氧化陶瓷薄膜,制备时采用恒电流控制模式,电流密度为10～30A/dm2。采用透射电镜(TEM)和扫描电镜(SEM)研究氧化薄膜界面及附近区域的微观结构。结果表明:微弧氧化膜的表面层靠近表面层与致密层界面处的组织以微晶和纳米晶为主,含有少量非晶态物质;微弧氧化膜的表面层与致密层界面处的组织以非晶态物质为主;微弧氧化膜的致密层靠近表面层与致密层界面处的组织为混晶组织,主要为MgO晶粒,少量为MgAlO4晶粒,并含有少量非晶态物质。