A Solder Alloy Filled Z-Axis Conductive Epoxy Adhesive

Epoxy adhesives filled with four different volume fractions of eutectic tin-bismuth solder alloy were prepared and the effect of filler content on the electrical and mechanical properties of these anisotropic electrically conductive adhesives was investigated. The results show that the adhesive containing the lowest amount of the filler alloy had the best combination of conductivity, insulation resistance and shear strength. The DSC-measurements suggested that the filler melts before the cure of the resin begins which allows the filler to wet and bond well to the conductors. This was verified by SEM/EPMA examinations. A temperature cycling test and high humidity, high temperature treatment were conducted on the best composite adhesive. The temperature variation had no effect on conductivity of the joints while humid and hot environment decreased the conductivity.     

Critical transistors nexus based circuit-level aging assessment and prediction

Accurate age modeling, and fast, yet robust reliability sign-off emerged as mandatory constraints in Integrated Circuits (ICs) design for advanced process technology nodes. In this paper we introduce a novel method to assess and predict the circuit reliability at design time as well as at run-time. The main goal of our proposal is to allow for: (i) design time reliability optimization; (ii) fine tuning of the run-time reliability assessment infrastructure, and (iii) run-time aging assessment. To this end, we propose to select a minimum-size kernel of critical transistors and based on them to assess and predict an IC End-Of-Life (EOL) via two methods: (i) as the sum of the critical transistors end-of-life values, weighted by fixed topology-dependent coefficients, and (ii) by a Markovian framework applied to the critical transistors, which takes into account the joint effects of process, environmental, and temporal variations. The former model exploits the aging dependence on the circuit topology to enable fast run-time reliability assessment with minimum aging sensors requirements. By allowing the performance boundary to vary in time such that both remnant and nonremnant variations are encompassed, and imposing a Markovian evolution, the probabilistic model can be better fitted to various real conditions, thus enabling at design-time appropriate guardbands selection and effective aging mitigation/compensation techniques. The proposed framework has been validated for different stress conditions, under process variations and aging effects, for the ISCAS-85 c499 circuit, in PTM 45 nm technology. From the total of 1526 transistors, we obtained a kernel of 15 critical transistors, for which the set of topology dependent weights were derived. Our simulation results for 15 critical transistors kernel indicate a small approximation error (i.e., mean smaller than 15% and standard deviation smaller than 6%) for the considered circuit estimated end-of-life (EOL), when comparing to the end-of-life values obtained from Cadence simulation, which quantitatively confirm the accuracy of the IC lifetime evaluation. Moreover, as the number of critical transistors determines the area overhead, we also investigated the implications of reducing their number on the reliability assessment accuracy. When only 5 transistors are included into the critical set instead of 15, which results in a 66% area overhead reduction, the EOL estimation accuracy diminished with 18%. This indicates that area vs. accuracy trade-offs are possible, while maintaining the aging prediction accuracy within reasonable bounds.     

一种不确定图中最可靠最大流问题的解决方案

最可靠最大流是不确定图中可靠性最高的最大流,它是传统最大流问题在不确定图上的自然延伸.现有的最可靠最大流算法SDBA时间复杂性较高,无法满足实际中不同应用的需求,为此,文中提出一种具有普遍适用性的最可靠最大流解决方案.该方案包含面向不同需求的3种算法:基于负权群落消去的NWCE算法、基于时间约束优先单环消去的SPEA-t算法和基于概率阈值约束优先单环消去的SPEA-p算法.其中,NWCE算法借鉴最小费用最大流的"流平移"思想并基于文中提出的负权群落概念,在辅助剩余图中不断地消去可使可靠性增加而流量不变的负权群落,可证当消去所有负权群落时对应的最大流即为最可靠最大流.根据负权群落中由单环组成的群落占很高比例且相对于多环组成的群落更易查找和消去的性质,同时考虑到NWCE算法为了获得最优解,往往为了消去最后少数几个对概率提高贡献很小的负权群落却花费了很长时间的现象,提出SPEA-t和SPEA-p两种快速近似算法,前者是以规定时间内尽可能逼近最优解为目标,后者是以最少时间达到预设的概率阈值为目标,它们都采用了优先消去概率-时间效益较好的单环群落的策略,加快对最优解的逼近速度,减少或放弃时间开销较大的多环群落的消去,以满足那些对算法时间性能要求很高而结果以近似最优即可的应用需求.实验表明,相对于SDBA算法,NWCE算法结合概率剪枝策略在时间性能上有了数量级的提高,而SPEA-t算法和SPEA-p算法则具有更高的性能和更好的适用性.     

二维多层次的云服务可靠性评估方法研究

针对云服务业务流程管理的特点, 给出了云服务的组合实现框架; 依据随机Petri网的建模理论, 探讨了组合云服务流程网模型的细粒度建模方法; 根据动态多变的用户需求, 设计了二维多层次的云服务组合可靠性动态评估框架, 并给出了马尔可夫过程和等值约简的两种可靠性计算方法。应用示例分析结果表明, 该方法具有较好的动态适应性和灵活性, 能有效满足云服务的可靠性评估需求。     

锅炉控制系统采用WinCC冗余的可靠性研究

锅炉做为能量转换的压力容器,其工作过程涉及许多参数,是典型的多入多出(MIMO)系统,控制系统容错能力的高低、可靠性的强弱直接影响锅炉运行过程的安全。冗余容错技术是改善控制系统可靠性的有效途径,以WinCC自带的软件冗余功能实现服务器硬件的热备,避免控制系统的瘫痪和崩溃,高性价比的提升了运行操作的可靠性,在锅炉控制领域有较强的推广和借鉴意义。     

分布式系统可靠性研究的问题和挑战

分布式系统中软件可靠性是应用软件的发布者和用户关心的重要问题。针对大规模分布式应用,包括电子政务、电子商务、多媒体服务和端到端的自动化解决方案,已经产生了各种各样的模型来评价或预测其可靠性,但是这些系统的可靠性问题依然存在。相反,为了确保分布式系统的可靠性,要求在预测或评价整个系统可靠性之前,检查与企业分布式应用相关的每一个单个构件或因素的可靠性,且实现透明的错误检测和错误恢复机制为用户提供无缝交互。因此,文章从检查单个构件可靠性的角度,提出了在分布式系统上运行的应用软件可靠性的问题和挑战。     

薄壁内压容器静强度的模糊可靠度与安全系数

应用基于模糊数学与常规可靠性理论相结合的模糊可靠性设计方法,讨论钢制薄壁内压容器模糊静强度在不同工况时,有关标准可接受的模糊可靠度范围;对钢制薄壁内压容器静强度的模糊可靠度范围与安全系数的关系进行研究。分析认为容器静强度在满足最小模糊可靠度要求的前提下,可取屈服安全系数ns≥1.55与抗拉安全系数nb≥1.95。     

基于虚通道故障粒度划分的3D NoC容错路由器设计

深亚微米工艺下,路由器受制于制造缺陷及运行时的脆弱性,易发生虚通道(virtual channel,VC)永久性故障,从而引起通信故障,影响系统功能和性能.为了能够有效地容忍虚通道故障、保证系统性能及充分利用可用资源,将虚通道故障类型细分为粗粒度故障和细粒度故障,提出SVS(single VC sharing)路由器架构,通过将路由器端口两两分组,组内端口间实现单虚通道共享.当发生虚通道粗粒度故障时,使用组内相邻端口共享虚通道容错.当发生细粒度故障时,根据Slot State Table信息配置虚通道读/写指针的值,从而跳过故障Buffer槽实现容错.在无粗粒度故障情况下,共享虚通道还可用于负载平衡及容忍路由计算模块故障.实验结果表明:较其他已有的虚通道路由器,SVS路由器在3种不同的故障情况下均较大地降低了延时,提高了吞吐量.这表明SVS路由器可有效提高系统可靠性,保证了系统性能,充分利用了可用资源.     

基于NHPP类软件可靠性通用模型研究与应用

对现有NHPP类软件可靠性模型进行分析总结,指明了已有NHPP类软件可靠性模型存在的不足及缺陷。综合考虑缺陷探测率、软件运行覆盖率、排除错误时的错误引入率等软件故障数的影响因素,提出了一种通用的NHPP类软件可靠性模型,最后对通用模型中的泛函数取特殊值后,求得期望故障数及软件可靠度,并对其进行分析,证明了所提模型的有效性。     

一种应用于复杂组合软件的可靠性测试模型

当前复杂的组合型软件可靠性测试一直是一个难点,主要原因是无法多多种差异性较大的软件特征建立可约束的检测分析模型,一旦软件数量过多,模型会迅速陷入不收敛。为了解决这一问题,提出一种复杂组合差异性软件的可靠性分析模型。对组合软件以一种分解的思想对其进行建模。对分解后的软件特征进行重新分区建模。形成多个可测试的子服务特征。运用一种稳定概率统计的观点,对模型进行分析,分析不同区域组合后的稳定概率,进而代表组合后的可靠性结果。仿真实验结果表明,该种模型能改对较多软件组成的、差异性较大的大型软件可靠性进行更为合理的分析,模型鲁棒性较好,能较好完成可靠性分析的工作。