校园局域网的设计与实现

对校园局域网的设计原则、结构选择、网络连接及综合布线 ,分别进行了阐述。并结合一个校园局域网的实例说明了如何完成校园局域网的设计与实现     

电网调度自动化系统中遥信误动的分析与处理

介绍了利津供电公司SCADA系统的PTU分站系统从硬件结构改造和软件设计两方面对遥信误动的处理，同时编写出了“遥信误报判断”的程序，并与主系统程序连接。经反复修改、调试，达到了预期的目的。     

光纤复合架空地线(OPGW)的架线计算

提出了光纤复合架空地线架线计算的原则和架线计算中需要考虑的问题，通过工程实例说明如何进行光纤复合架空地线的弧垂调整。     

配网自动化、智能化配电开关

城乡配电自动化、智能化是城乡配电发展方向。文章介绍了城乡配电网一次接线、自动化控制模式，及国外智能化真空断路器、智能化GIS与智能化开关柜产品。还叙述了城乡配电自动化对配电开关的要求。     

印刷电路板自动布线系统

用ＰＡＳＣＡＬ语言开发的印刷电路板自动布线系统，该系统可自动配制各种模拟电子线路单面印刷电路板的布线及器件位五图形，并具有印字功能。     

硅基多层布线集成组装技术

本文叙述了多芯片组件和多层布线集成组装技术的研究和进展,介绍了硅基多层布线集成组装技术的特点和设计考虑,扼要地叙述了硅基多层布线的制造工艺,并讨论了工艺中所出现的问题。     

Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging

The system-on-a-package (SOP) paradigm proposes a package level integration of digital, RF/analog and opto-electronic functions to address future convergent microsystems. Two major components of SOP fabrication are sequential build-up of multiple layers (4–8) of conducting copper patterns with interlayer dielectrics on a board and multiple ICs flip-chip bonded on the top layer. A wide range of passives, wave-guides and other RF and opto-electronic components buried within the dielectric layers provide the multiple functions on a single microminiaturized platform.The routing of future nanoscale ICs with 10,000+ I/Os require multiple build-up layers of ultra fine board feature sizes of 10 m lines/space widths and 40 m pad diameters. Current FR4 boards cannot achieve this build-up technology because of dimensional instability during processing. These boards also undergo high warpage during the sequential build-up process which limits the fine-line lithography and also causes misalignment between the vias and their corresponding landing pads. In addition, the CTE mismatch between the silicon die and the board leads to IC-package interconnect reliability concerns, particularly in future fine-pitch assemblies where underfilling becomes complicated and expensive.This work reports experimental and analytical work comparing the performance of organic and novel ceramic boards for SOP requirements. The property requirements as deduced from these results indicate that a high stiffness and tailorable CTE from 2–4 ppm/C is required to enable SOP microminiaturized board fabrication and assembly without underfill. A novel ceramic board technology is proposed to address these requirements.     

对陕西电网规划中几个具体问题的思考

文章对陕西电网规划中的负荷预测、电源接入、短路电流、变电站主接线、导线截面选择及主变容量等具体问题进行了分析和探讨。针对这些问题,结合电网发展中的实际状况及不确定因素,给出了具体思路和初步设想,提出电网规划修订的重点,对工程设计有指导作用。     

Lead zirconate titanate thin film capacitors on electroless nickel coated copper foils for embedded passive applications

Lead zirconate titanate (PZT, 52/48) thin film capacitors were prepared on electroless Ni coated Cu foil by chemical solution deposition for printed wiring board embedded capacitor applications. Phase development, dielectric properties, and leakage characteristics of capacitors were investigated, in particular as a function of the process temperature. Dielectric properties of the capacitors were dependent on the crystallization temperature, and capacitance densities of more than 350 nF/cm² and loss tangent of less than 0.03 were measured for capacitors crystallized below 600 °C. Lowest leakage current densities (around 2 × 10^− 7 A/cm² at 10 V direct current (DC)) and highest breakdown fields could be obtained for capacitors crystallized at 650 °C.Capacitors with different thickness and a two-layer capacitor model were used in analyzing the interface layer between PZT and the underlying electroless Ni. From the capacitance and leakage measurements, it is suggested that the interface reaction layer has low permittivity (K around 30) and high defect concentration, which has an important effect on the electrical properties of capacitors. This interface is from the reaction of the electroless nickel layer with the adjacent PZT, and may specifically be moderated by the nickel phosphide (Ni-P) phase, transformed from amorphous Ni during the annealing step.The results have significant implications for embedded capacitors in printed wiring boards. They demonstrate that the process can be tuned to produce either voltage independent capacitors with low leakage and high breakdown fields (above 30 V DC), or the more usual hysteretic, switching, ferroelectric capacitors with higher capacitance densities.     

智能建筑中的综合布线

土木建筑百年大计,一次性投资很大。在当前国力尚不富裕的情况下,全面实现建筑智能化是有难度的,然而又不能等到资金全部到位,再去开工建设,因为这样会失去时间和机遇。对于每个高层建筑,一旦条件成熟需要改造升级为智能建筑,也是不容置疑的。这些可能是目前高层建筑普遍存在的一个突出矛盾。综合布线是解决将当前和未来统一这一矛盾的最佳途径。综合布线只是智能建筑的一部分。它犹如智能建筑内的一条高速公路,可以统一规划、统一设计,在建筑物建设阶段投资占整个建筑物资金的3%～5%,将连接线缆综合布线在建筑物内。至于楼内安装或增设什么应用系统,这就完全可以根据时间和需要、发展与可能来决定。只要有了综合布线这条信息高速公路,想跑什么＂车＂,想上什么应用系统,就变得非常简单了。尤其目前兴建的高大楼群如何与时代同步,如何能适应科技发展的需要,又不增加过多的投资,综合布线平台是最佳选择。否则,不仅为高层建筑将来的发展带来很多后遗症,并且一旦打算向智能建筑靠拢时,要花费更多的投资,这是十分不合理的。