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61.
本文给出了复合地基应力比置换率设计的优化方法,讨论了复合地基中应力比的基本概念和影响因素,可供工程应用时参考。 相似文献
62.
SynthesisandSpectralPropertiesofMixedLigandComplexesofLanthanidePerchloratewithBis(phenylsulfinyl)ethaneandOrganicLewisBase... 相似文献
63.
64.
高层建筑损伤识别中的补偿算法 总被引:9,自引:3,他引:6
本文在已有研究工作的基础上,提出了处理激励测量信息不完备情况下的补偿算法。此方法主要针对高层建筑动力检测中强迫激励的情况,是一种基于时域的识别方法,该方法实际上是利用客观工程实际中结构系统激励所具有的物理持征作为识别计算的辅助条件,来解决测量信息的不完备性问题。算例分析表明了该方法的可行性。 相似文献
65.
66.
The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning
electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis
results indicate that Ag5Zn8 and AgZn3 become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations
gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure
when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure
of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these
solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%.
Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0%
to 3.0% 相似文献
67.
Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates
The morphologies of intermetallic compounds formed between Sn-Zn based solders and Cu substrates were investigated in this
study. The investigated solders were Sn-9Zn, Sn-8.55Zn-0.45Al, and Sn-8.55Zn-0.45Al-0.5Ag. The experimental results indicated
that the Sn-9Zn solder formed Cu5Zn8 and CuZn5 compounds on the Cu substrate, while the Al-containing solders formed the Al4.2Cu3.2Zn0.7 compound. The addition of Ag to the Sn-8.55Zn-0.45Al solder resulted in the formation of the AgZn3 compound at the interface between the Al4.2Cu3.2Zn0.7 compound and the solder. Furthermore, it was found that the cooling rate of the specimen after soldering had an effect on
the quantity of AgZn3 compound formed at the interface. The AgZn3 compound formed with an air-cooling condition exhibited a rougher surface and larger size than with a water-quenched condition.
It was believed that the formation of the AgZn3 compound at the interface occurs through heterogenous nucleation during solidification. 相似文献
68.
Electrochemical impedance spectroscopy was used for the study of two-component lipid membranes. Phosphatidylcholine (PC) and phosphatidylethanolamine (PE) were to be investigated, because of their presence in biological membranes. Capacitance values of pure components are 0.62 and 0.32 μF cm−2, respectively. The 1:1 complex was formed during formation of the PC-PE lipid membrane. Formation of the complex can explain the deviation from the additivity rule. This equilibrium was described by mathematical equations and was further verified experimentally. Adequate equations let us calculate such parameters as: capacitance of the complex molecule, area occupied by the complex molecule as well as the stability constant of the complex. 相似文献
69.
70.
ZhangBaoji WangXieqing 《中国炼油与石油化工》2003,(3):49-52
A Ti/Si complex zeolite has been prepared. X-ray diffraction and infrared spectrometry study has shown that two structures, namely the ZSM-5 and MCM-41, exist in the sample. BET tests have revealed that the complex zeolite contains regular mesopores of 2.6 nm. Ultraviolet spectrometry analysis has shown that the Ti species exist in the zeolite skeleton in the form of tetra-coordinate valence. The Ti/Si complex zeolite (TS-1/Ti-MCM-41) has apparently improved catalytic activity with respect to the macromolecular organic compound oxidation as compared to individual components of either Ti or Si containing zeolites (TS-1 and Ti-MCM-41). 相似文献