基于复多相滤波器组的信道化接收机

本文讨论了多相滤波器实现信道化接收机的原理,并结合复解析滤波器具有负频率分量为零、冲激响应函数实部和虚部有90°相移的特点,给出一种基于复解析滤波器组的信道化接收机的实现方案。最后通过Matlab对调幅(AM)信号的解调仿真验证了该接收机设计的正确性和可行性。     

HPLC法测定复方托吡卡胺滴眼液中苯扎氯铵的含量

目的：建立超高效液相色谱法测定复方托吡卡胺滴眼液中苯扎氯铵的含量测定方法。方法：色谱柱为Alltech Alltima -CN（250cm ×4．6mm ,5μm）,流动相为0．1mol?L -1醋酸钠溶液（用冰醋酸调节pH值至5．0）-乙腈（60：40）,检测波长254nm ,流速为2．0ml?min -1,柱温30℃,进样体积50μL。结果：苯扎氯铵在0．02至0．5mg?mL -1浓度范围内线性关系良好（r＝0．9999）;平均回收率为98．91％,RSD＝0．44％（n＝9）。结论：该方法准确、简便、快速、可靠,能有效控制复方托吡卡胺滴眼液中苯扎氯铵的含量。     

环氧树脂对环氧模塑料(EMC)的性能影响分析

在环氧模塑料中,环氧树脂是环氧模塑料的基体树脂,也是环氧模塑料的主要原材料,起着将其他组分交联结合到一起的重要作用。环氧树脂作为环氧模塑料的胶粘剂,具有粘合性高、固化收缩率小、耐化学介质稳定性好、电绝缘性优良、工艺性能良好等特点。因此环氧树脂类型的选择及其性能对环氧模塑料的性能都有很大的影响。文章简单介绍了环氧树脂的分类、结构、作用及特点,主要探讨了不同结构环氧树脂对环氧模塑料的粘接性、稳定性、收缩率、电性能及机械性能等的影响。     

基于复合预测误差差值和互补嵌入的可逆数据隐藏

提出一种基于分块复合预测的误差差值和互补嵌入的彩色图像可逆数据隐藏算法。利用色彩分量之间的相关性和预测误差之间的关系减小差值,以增加差值直方图的峰值。采用双重嵌入方法提高嵌入容量,两次嵌入过程中像素值沿相反的方向扩展,部分像素值扩展量相互抵消,在图像分块的基础上选择最佳的预测方式组合,以增加扩展量抵消的机会,从而减小二次嵌入时图像质量的下降幅度。实验结果表明,本文算法在保证图像质量的同时大幅提高嵌入容量,算法的整体性能比其它同类算法更高。     

Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package

The effect of displacement rate and intermetallic compound (IMC) growth on the shear strength of electroplated Sn-2.5Ag (in wt.%) flip chip solder with Cu under-bump metallization (UBM) were investigated after multiple reflows. Cu₆Sn₅ IMC was formed at the interface after one reflow. After five reflows, two different IMC layers, consisting of a scallop-shaped Cu₆Sn₅ phase and a planar Cu₃Sn phase, and their thicknesses increased with increasing reflow number up to 10. The shear strengths peaked after four reflows, and then decreased with increasing reflow number. Increasing displacement rate increased the shear force. The tendency toward brittle fracture characteristics was intensified with increasing displacement rate and reflow number.     

人小肠粘膜免疫酶的定位研究—光镜和电镜免疫组织化学染色法

本文对免疫酶组织化学的样品制备程序和染色方法做了详细的阐述。用直接法、间接法和ABC法,对人小肠免疫酶的定位,进行了光镜和电镜的观察,染色阳性反应显著,获得了满意的效果。并对染色技巧做了分析和探讨。     

用复射线展开法分析目标的雷达截面

本文根据复射线分析和场的高斯波束展开,提出了一种计算复杂目标电磁散射特性的简便方法。由于复射线法不受目标形状的限制,因此该方法可用于任意形状的目标。本文以矩形进气道为例,进行了雷达截面分析计算,并将计算值与测试值比较,结果表明这种方法是可行的。     

Steady-state analysis of a complex adaptive notch filter using modified gradient algorithm

Based on power spectral density (PSD) analytical technique, mean square error (MSE) (or variance) of the frequency estimate of a first-order complex adaptive IIR notch filter (ANF) using modified complex plain gradient (MCPG) algorithm is investigated in this paper. The steady-state expression for MSE is derived in closed form. A quantitative analysis for the estimation MSE has been carried out. It has been revealed that the MSE of frequency estimate is independent of an input frequency of a complex sinusoid. In addition, computer simulations are treated to corroborate the theoretical analysis and the relationships between MSE and system parameters are shown.     

空空导弹制导技术发展趋势

介绍了应用在空空导弹的激光制导、红外复合制导、毫米波成像制导、多模复合制导技术的发展趋势,同时介绍了视觉仿生成像、网络中心等制导新技术。应用新的制导技术,可显著提高空空导弹的制导精度,提高武器的作战效能。     

Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging

The effects of isothermal aging on the microstructure and shear strength of Sn37Pb/Cu solder joints were investigated. Single-lap shear solder joints of eutectic Sn37Pb solder were aged for 1–10 days at 120 °C and 170 °C, respectively, and then loaded to failure in shear with a constant loading speed of 5 × 10⁻³ mm/s. The growth of the interfacial Cu–Sn intermetallic compounds (IMC) layer (Cu₆Sn₅ + Cu₃Sn) of Sn37Pb/Cu solder joints subjected to isothermal aging exhibited a linear function of the square root of aging time, indicating that the formation of Cu–Sn IMC was mainly controlled by the diffusion mechanism. And the diffusion coefficient (D) values of IMC layer were 1.07 × 10⁻¹⁷ and 3.72 × 10⁻¹⁷ m²/s for aged solder joints at 120 °C and 170 °C, respectively. Shear tests results revealed that as-reflowed solder joint had better shear strength than the aged solder joints and the shear strength of all aged solder joints decreased with increasing aging time. The presence of elongated dimple-like structures on the fracture surfaces of these as-reflowed or aged for short time solder joints were indicative of a ductile failure mode. As aging time further increased, the solder joints fractured in the mixed solder/IMC mode at the solder/IMC interface.