大口径管道带水抢修

包头地区1996年5月3日发生6.4级强烈地震,给包钢生产造成重大损失,地震发生后,包钢生产用动力系统发生多起事故.本文针对4#高炉工业回水管道(φ1220×10)震后发生断裂,如何在保证不停止生产的前提下,采取什么措施进行管道带水抢修进行了阐述,本文是经过现场抢修过程总结而来,对今后大口径管道带水抢修提供了宝贵的经验.     

不锈钢网架(壳)技术及其应用

本文总结了多年来不锈钢网架的研究成果 ,并介绍了部分不锈钢网架的工程应用     

Ti-23Al-14Nb-3V合金氩弧焊接头的显微组织及其力学性能

研究了预热对Ｔｉ－２３Ａｌ－１４Ｎｂ－３Ｖ合金焊接性，特别是对消除氩弧焊冷裂纹的作用以及对接头显微组织和力学性能的影响。结果表明，焊前预热可有效降低该合金的冷裂倾向。经预热处理后，焊缝区的结晶层状线消失，热影响区的硬度峰得到缓和，整个焊缝的显微硬度分布趋于均匀，但焊缝区的枝晶发生粗化，热影响区有所扩大。焊件接头的拉伸试验表明，预热可使焊缝区的接头强度系数增加，但无论预热与否，接头强度均低于母材强度，且不显示宏观塑性。     

Intermolecular interactions and formation of the hydration sphere in phosphonic acid model systems as an approach to the description of vinyl phosphonic acid based polymers

Molecular model systems based on propyl phosphonic acid (ppa) were studied by means of density functional theory calculations in order to describe the acid-acid interaction and the formation of the hydration sphere. The formation of ppa dimers is reported and the energetic difference between two dimer structures is presented. The hydration sphere of ppa was represented by model systems ppa(H₂O)_n, for which the system with n=4 formed the first hydration sphere (h¹), while n=7 can be considered a good approximation to the complete inner hydration sphere around the phosphonic acid group. The study of the ppa-H⁺ (H₂O)_n model systems showed an interesting structural behavior comparatively to the ppa(H₂O)_n systems. The protonated acids exhibited equivalent phosphorous-oxygen bonds and a general molecular structure is proposed to represent these protonated species.     

三峡永久船闸结构缝渗漏处理技术

在三峡永久船闸结构缝处理过程中，认真分析了结构缝渗漏的原因，通过止水检查槽进行压水检查，确定了渗漏部位。结合渗漏具体情况，采取了结构缝表面嵌填止水材料和廊道周边止水检查槽灌浆相结合的处理方法。在实施过程中，采用了多种新材料和新工艺，取得了良好的效果。     

Implicit integration and consistent tangent modulus of a time‐dependent non‐unified constitutive model

This paper describes the implicit integration and consistent tangent modulus of an inelastic constitutive model with transient and steady strain rates, both of which are time‐ and temperature‐dependent; the transient rate is influenced by the evolution of back stress decomposed into parts, while the steady rate depends only on applied stress and temperature. Such a non‐unified model is useful for high‐temperature structural analysis and is practical owing to the ease in determining material constants. The implicit integration is shown to result in two scalar‐valued coupled equations, and the consistent tangent modulus is derived in a quite versatile form by introducing a set of fourth‐rank constitutive parameters into the discretized evolution rule of back stress. The constitutive model is, then, implemented in a finite element program and applied to a lead‐free solder joint analysis. It is demonstrated that the implicit integration is very accurate if the multilinear kinematic hardening model of Ohno and Wang is employed, and that the consistent tangent modulus certainly affords quadratic convergence to the Newton–Raphson iteration in solving nodal force equilibrium equations. Copyright © 2003 John Wiley & Sons, Ltd.     

Ni_(2.5)Mo_6S_(6.7)在有机电解液中的充放电特性

利用循环伏安法、交流阻抗法和充放电曲线等方法测定了Ni_(2.5)Mo_6S_(6.7)电极在1M LiClO_4,PC DME(1:1)有机电解质溶液中的可充电性。结果表明,该材料具有高的可充电性,有可能用作二次锂电池的正极材料。     

玻璃钢缓弯弯头模具的设计和制作

本文详细叙述了φ２００×９０°玻璃钢弯头模具的设计和制作方法。     

论校园文化和德育目标的一致性

中系统介绍了校园化和德育目标的关系，并找准两之间的结合点，通过分析两的一致性和辩证统一关系，达到育人目的。     

Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints

Addressing the potential for drop impact failure of Pb-free interconnects, the shear ductility after extensive aging of Sn-Ag-Cu (SAC) solders has been improved radically by Co or Fe modifications. Several other SAC+X candidates (X=Mn, Ni, Ge, Ti, Si, Cr, and Zn) now have been tested. Solder joint microstructures and shear strength results show that new SAC+X alloys also suppress void formation and coalescence at the Cu (substrate)/Cu₃Sn interface (and embrittlement) after aging at 150°C for up to 1,000 h. Microprobe measurements of 1,000 h aged samples suggest that Cu substitution by X is usually accentuated in the intermetallic layers, consistent with X=Co and Fe results.