铜线键合Cu/Al界面金属间化合物微结构研究

由于铜线具有较高的热导率、卓越的电学性能以及较低的成本,被普遍认为将逐渐代替传统的金线而在IC封装的键合工艺中得到广泛的应用。铜线键合工艺中Cu/Al界面金属间化合物(IMC)与金线键合的Au/Al IMC生长情况有很大差别,本文针对球焊键合中键合点的Cu/Al界面,将金属间化合物生长理论与分析手段相结合,研究了Cu/Al界面IMC的生长行为及其微结构。文中采用SEM测试方法,观察了IMC的形貌特点,测量并得到了IMC厚度平方正比于热处理时间的关系,计算得到了生长速率和活化能数值,并采用TEM,EDS等测试手段,进一步研究了IMC界面的微结构、成分分布及其金相结构。     

Situational and personal characteristics associated with adverse weather encounters by pilots

Weather conditions are significant hazards impacting the safe and efficient operation of aircraft. In this study, a large number of pilots were surveyed regarding weather events, and the circumstances associated with those events. Pilots completed a web-based questionnaire containing demographic questions, a risk perception scale, a hazardous events scale, and a pilot judgment scale. The pilots who reported a flight in which they penetrated weather without authorization or were concerned about the weather also completed 53 questions regarding their weather encounter. Usable data were obtained for 364 participants: 144 who reported flying into weather, 114 who experienced a flight on which weather was a concern, and 106 who reported no flights on which weather was entered or was a major concern. Significant differences were evident between the three groups on the measures of pilot judgment, personal minimums, and hazardous events where pilots flying into weather recorded the poorest scores (least conservative minimums, most hazardous events, and poorest judgment). Significant differences were also noted between the two weather groups for a number of circumstances surrounding the events. Compared to the in-weather group, pilots in the near-weather group had acquired greater instrument hours, were older, and were more likely to have an instrument rating. Their aircraft were more likely to have an autopilot. More pilots in the in-weather group (28%) reported that they would be much more careful in the future regarding weather, compared to 17% of the near-weather group. The study provides data not previously obtained on both the situational and personal characteristics that are related to involvement in different degrees of weather-related encounters. These data should promote a better understanding of these individuals and the situations in which they are involved, and should inform future research and intervention efforts.     

Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization

This work summarizes the interfacial reaction between lead-free solder Sn-3.5Ag and electrolessly plated Ni-P metallization in terms of morphology and growth kinetics of the intermetallic compounds (IMC). Comparison with pure Ni metallization is made in order to clarify the role of P in the solder reaction. During reflow, the IMCs formed with the Ni-P under-bump metallization (UBM) exist in chunky crystal blocks and small crystal agglomerates, while the ones with the sputtered Ni UBM exhibit uniformly scallop grains with faceted surfaces. The IMC thickness increases with reflow time following approximately a t^1/3 power law for both systems. The IMC growth rate is higher with the Ni-P UBM than the Ni UBM. The thickness of the Ni₃Sn₄ layer increases linearly with the square root of thermal aging time, indicating that the growth of the IMCs is a diffusion-controlled process. The activation energy for Ni₃Sn₄ growth in solid-state reaction is found to be 110 kJ/mol and 91 kJ/mol for the Ni-P and sputtered Ni UBMs, respectively. Kirkendall voids are detected inside the Ni₃P layer in the Sn-3.5Ag/Ni-P system. No such voids are found in the Sn-3.5Ag/Ni system.     

内模PID在风力发电系统变桨距控制器中的应用

针对风力发电系统数学模型复杂、时变性强、参数间存在耦合及受外部干扰严重等特点,基于内模理论方法,分析提出了一种适用于风机变桨距控制,且仅需要对滤波时间常数整定即可设计系统控制器的简捷内模PID方法,使系统在设计上可以不依赖于被控对象的准确模型,并使控制方法的实现得到了简化.基于该理论设计了变桨距控制器,并通过Matlab对系统进行了仿真,结果表明:控制方案可行,且使风力发电机输出功率维持最佳,系统鲁棒性好,抗干扰性强,对工业过程的复杂控制系统设计提供了一种参考.     

Lead-Free Bumping Using an Alternating Electromagnetic Field

A novel lead-free bumping technique using an alternating electromagnetic field (AEF) was investigated. Lead-free solder bumps reflowed onto copper pads through AEF have been achieved. A comparison was conducted between the microstructures of the lead-free solder joints formed by the conventional thermal reflow and AEF reflow. Keeping the substrate temperature lower than that of the solder bumps, AEF reflow successfully created metallurgical bonding between the lead-free solders and metallizations through an interfacial intermetallic compound (IMC). The AEF reflow could be finished in several seconds, much faster than the conventional hot-air reflow. Considering the morphology of the interfacial Cu₆Sn₅ IMC, a shorter heating time above the melting point would be a better choice for solder joint reliability. The results show that AEF reflow is a promising localized heating soldering technique in electronic packaging.     

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

The effect of moderate electric current density (1 × 10³ to 3 × 10³ A/cm²) on the mechanical properties of Ni-P/Sn-3.5Ag/Ni-P and Ni/Sn-3.5Ag/Ni solder joints was investigated using a microtensile test. Thermal aging was carried out at 160°C for 100 h while the current was passed. The interfacial microstructure and intermetallic compound (IMC) growth were analyzed. It was found that, at these levels of current density, there were no observable voids or hillocks. Samples aged at 160°C without current stressing failed mostly inside the bulk solder with significant prior plastic deformation. The passage of current was found to cause brittle failure of the solder joints and this tendency for brittle failure increased with increasing current density. Fractographic analysis showed that, in most of the electrically stressed samples, fracture occurred at the interface region between the solder and the joining metals. The critical current density that caused brittle fracture was about 2 × 10³ A/cm². Once brittle fracture occurred, the tensile toughness, defined as the energy per unit fractured area, was usually lower than ~5 kJ/m², compared with the case of ductile fracture where this value was typically greater than ~9 kJ/m². When comparing the two types of joint, the brittle failure was found to be more severe with the Ni than with the Ni-P joint. This work also found that the passage of electric current affects the IMC growth rate more significantly in the Ni than in the Ni-P joint. In the case of the Ni joint, the Ni₃Sn₄ IMC at the anode side was appreciably thicker than that formed at the cathode side. However, in the case of electroless Ni-P metallization, this difference was much smaller.     

Nanotribological Characteristics of Cu<Subscript>6</Subscript>Sn<Subscript>5</Subscript>, Cu<Subscript>3</Subscript>Sn,and Ni<Subscript>3</Subscript>Sn<Subscript>4</Subscript> Intermetallic Compounds

Nanotribological characteristics, including the coefficient of friction, wear coefficient, and wear resistance, of Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄ intermetallic compounds developed by the annealing of Sn–Cu or Sn–Ni diffusion couples were investigated in this work. The scratch test conditions combined a constant normal load of 10 mN, 20 mN, or 30 mN and a scratch rate of 0.1 μm/s, 1 μm/s, or 10 μm/s. Experimental results indicated that, as the normal load increases, the pile-up grows taller and the scratch deepens, leading to a greater coefficient of friction and wear coefficient, and reduced wear resistance. Moreover, the scratch rate does not have a significant effect on the nanotribological characteristics except for those of Cu₆Sn₅ and Cu₃Sn under a normal load of 10 mN. Though the hardness of Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄ is similar, Ni₃Sn₄ appears to be more prone to wear damage.     

Measurement of excess enthalpies using a high-pressure flow microcalorimeter and determination of binary interaction parameters for thermodynamic models

While an equation of state (EOS) plays a critical role in estimating thermodynamic properties, employing it in the determination of binary interaction parameters is extremely important. In general, these parameters can be determined from phase equilibrium data. However, data collection from experiments is a time-consuming and tedious process. In this study, after measuring the excess enthalpies of binary systems containing CO₂ by high-pressure flow isothermal microcalorimetry (IMC), we determined the EOS binary interaction parameters, specifically, the Peng-Robinson EOS binary interaction parameters. These binary interaction parameters obtained by IMC were compared with those obtained by vapor-liquid equilibrium (VLE) experiments. Hence, high-pressure flow IMC appears to be an effective method for the determination of interaction parameters that are used in the estimation of thermodynamic properties. Further, the Flory-Huggins interaction parameters of a binary mixture CO₂ containing with various mole compositions were also estimated by employing high-pressure IMC.     

基于内模控制的滤波方法改进及参数优化实施

针对实际工业控制中出现的系统的随机噪声和量测噪声会严重影响现场生产的控制效果,传统的内模控制方式无法很有效地解决这一问题。将Kalman滤波器引入到传统的内模控制原理中,通过Kalman滤波器来减小甚至消除噪声对控制系统的影响,提高系统的控制精度。同时,利用NLJ算法在考察系统性能指标的情况下,对传统内模原理中的低通滤波器的滤波参数进行自动寻优。通过对滤波环节的改善,充分发挥Kalman滤波和NLJ自动寻优的特点,使得控制系统的鲁棒性和快速性都得到了提高。仿真结果表明提出的设计方法能较好解决单变量和多变量被控对象的实时性和时滞性,并且具有良好的抗噪性,该方法参数调节容易,易于实施。     

倒装芯片中凸点与凸点下金属层反应的研究现状

随着当代电子封装技术的飞速发展以及无铅化潮流的兴起,倒装芯片中凸点(Solder Bump)与凸点下金属层(UBM)之间的反应的研究成为当前研究的热点.综述了UBM与凸点反应研究的最新进展,总结了钎焊过程中的界面反应和元素扩散行为,分析了界面金属间化合物层(IMC)在长时间回流焊接过程中剥落的原因,进一步指出了凸点与UBM反应研究的趋势.