校园网宿舍网络管理模式的探讨

讨论了高校学生宿舍区网络的特点，结合天津商学院校园网的实践，讨论了校园网宿舍网络管理的模式。     

Fe3O4/PSt/TiO2多层包覆电磁响应微球的制备

首先采用分散聚合法将自制的Fe3O4磁流体和苯乙烯反应合成有磁核的Fe3O4/PSt磁性聚合物微球，然后，用非均匀成核水解反应在Fe3O4/PSt微球外包覆无定形二氧化钛，获得Fe3O4/PSt/TiO2复合微粒。用红外光谱、扫描电镜和热分析对粒子的形貌和结构进行了表征。并测试了微粒的介电性能和磁性，结果表明，所制得复合微粒有良好的电、磁响应性。     

镍铬合金在酸性CuCl2溶液中反应机理

对铜在酸性CuCl_2溶液中蚀刻反应机理论述,利用氧化-还原电动势原理,详细论述了Ni80Cr20合金在酸性CuCl_2溶液中化学蚀刻反应机理,以及影响蚀刻速度的因素,并对溶液中金属离子的存在形式作了验证。     

Atomic layer chemical vapour deposition of copper

Copper films with (1 1 1) texture are of crucial importance in integrated circuit interconnects. We have deposited strongly (1 1 1)-textured thin films of copper by atomic layer deposition (ALD) using [2,2,6,6-tetramethyl-3,5-heptadionato] Cu(II), Cu(thd)₂, as the precursor. The dependence of the microstructure of the films on ALD conditions, such as the number of ALD cycles and the deposition temperature was studied by X-ray diffraction, scanning electron microscopy (SEM), and transmission electron microscopy. Analysis of (1 1 1)-textured films shows the presence of twin planes in the copper grains throughout the films. SEM shows a labyrinthine structure of highly connected, large grains developing as film thickness increases. This leads to low resistivity and suggests high resistance to electromigration.     

二氧化锡溅射工艺研究

SnO2 是最早使用也是目前使用最广泛的一种气敏材料 ,使用该材料设计制作的气敏传感器具有许多优点。在简要介绍溅射镀膜的成膜过程和特点的基础上 ,着重介绍了SnO2 膜的制备流程 ,分析了功率和温度变化对成膜质量的影响     

在二(2-乙基己基)磷酸钠的微乳液中金属萃合物对水增溶的影响

测算了由二（2－乙基己基）磷酸钠，金属盐（CoSO4,NiSO4,ZnSO4,MgCl2或Cr(NO3)3)水溶液，正辛醇和正辛烷组成的微乳液中正辛醇从连续油相到界面的ΔGo→i^o和水的极限增容量φ'H2O。用金属萃取络合物反胶束的形成及其亲油性解释了金属离子对φ'H2O和ΔGo→i^o的影响。     

大功率CO2激光器脉冲电源研究

本文论述了直流高压与高频脉冲电源相叠加，构成高频、高压脉冲电源，并使其对CO2激光器进行放电实验，研究了同条件下的放电参数与功率。     

Preparation and properties of nano-sized SnO2 powder

1　INTRODUCTIONSnO2isoneofthemainmaterialsusedingassensor.Becauseofthehumidityandgassensingfunction,itattractsmoreandmoreattentions.Butthepresentproblemishowtoimprovethestabilityandsensibilityofgassensor.Researchershavetakenmanymeasurestoresolvethisproble…     

Characterization and optimization of copper chemical mechanical planarization

The feature scale planarization of the copper chemical mechanical planarization (CMP) process has been characterized for two copper processes using Hitachi 430-TU/Hitachi T605 and Cabot 5001/Arch Cu10K consumables. The first process is an example of an abrasive-free polish with a high-selectivity barrier slurry, while the second is an example of a conventional abrasive slurry with a low-selectivity barrier slurry. Copper fill planarization has been characterized for structures with conformal deposition as well as with bumps resulting from bottom-up fill. Dishing and erosion were characterized for several structures after clearing. The abrasive-free polish resulted in low sensitivity to overpolish and low saturation levels for dishing and erosion. Consequently, this demonstrated superior performance when compared to the International Technology Roadmap for Semiconductors (ITRS) 2000 roadmap targets for planarization. While the conventional slurry could achieve the 0.13-μm technology node requirements, the abrasive-free polish met the planarization requirements beyond the 0.10-μm technology node.     

Dissolved organic carbon dynamics in the upper rhone: The influence of side-arms?

Dissolved organic carbon (DOC) dynamics were investigated over a two year period in the Upper Rhǒne River to examine the role of side-arms in providing DOC to the main channel in relation to discharge fluctuations, especially floods. Concentrations of DOC are shown to remain low in space and in time (average 1.5 mg ^?1) and to be more related to global hydrological events (precipitation) than to any local flushing for backwaters during floods. The results do not support the general assumption that side-arms are the providers of DOC to the main channel.