We undertook numerical and experimental studies to develop a better incineration method for the destruction of CC14. A phenomenological model for the turbulent reaction of CC14, including a flame inhibition feature, has been successfully incorporated into a commercial code, simulating the incineration
processes of this compound. The gaseous flow solution was obtained using SIMPLEST, a derivative of Patankar’s SIMPLE algorithm,
with a k-ε turbulence model. A modified fast chemistry turbulent reaction model was developed to describe the flame inhibition
due to the presence of CC14, considering the corresponding burning velocity data of these mixtures. An experiment was carried out on a 5.2 kW laboratory
scale, transportable, cavity-type incinerator, which warrants a sufficient residence time and effective turbulent mixing by
the formation of a strong recirculation region in a combustor. To this end, the specific configuration of the incinerator
was manufactured to consist of two opposing jets and a rearward facing step. The calculated data were in close agreement with
the experimental data for the concentrations of major species, such as CCI4 and HCl, together with the temperature profiles. The experimental test gave the desired DRE of above 99.99%. 相似文献
Surface modification of two types of fluorinated polyimide (FPI) films, either by plasma polymerization and deposition of 4‐vinylpyridine (4VP) or by UV‐induced graft copolymerization with 4VP under atmospheric conditions, was carried out for adhesion enhancement with the electrolessly deposited copper. X‐ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) results revealed that the pyridine groups in the plasma polymerized 4VP (pp‐4VP) layer could be preserved to a large extent under proper glow discharge conditions. The grafted 4VP layer with well‐preserved pyridine groups was used not only as the chemisorption sites for the palladium complexes (without the need for prior sensitization by SnCl2) during the electroless plating of copper, but also as an adhesion promotion layer for the electrolessly deposited copper. The T‐peel adhesion strength of the electrolessly deposited copper with both the 4VP plasma‐polymerized FPI (pp‐4VP‐FPI) film and the 4VP graft‐copolymerized FPI (4VP‐g‐FPI) film was much higher than that of the electrolessly deposited copper with the pristine or the Ar plasma‐treated FPI films. The high adhesion strength between the electrolessly deposited copper and the surface‐modified FPI film was attributed to the fact that the plasma‐polymerized and the UV graft‐copolymerized 4VP chains were covalently tethered on the FPI surfaces, as well as the fact that these grafted 4VP polymer chains were spatially and reactively distributed into the copper matrix.
The dissolution rate coefficients of Cr‐substituted (0‐20 at.% Cr) iron oxides viz. hematite and magnetite were determined by using an inverse cubic rate (ICR) law applicable for spherical particles as well as by a general kinetic equation (GKE) applicable for polydispersed particles. An attempt is made to compare both the treatments for different kinds of dissolution profiles obtained by employing oxides with narrow particle size distribution in V(II)‐EDTA and citric acid‐EDTA‐ascorbic acid formulations at 353±5K. The dissolution profiles could be classified into three types based on the nature of oxide and formulations. It is observed that both ICR and GKE treat the dissolution course as a function of decrease in fraction of undissolved mass, m/m0. The dissolution rate coefficients determined by ICR and GKE have shown the similar trend of decrease with increasing Cr content of the oxides and was ascribed to lattice stabilization. 相似文献