现代电子工业Cpk评价中的特殊问题

现代电子工业生产具有许多新的特点，如果不针对具体情况，均采用传统工业生产中广泛使用的常规方法计算其工序能力指数，评价生产工艺水平，将可能导致错误的结论。总结了电子工业生产中工艺参数的典型特点，并讨论了工序能力指数的正确计算方法。     

电荷耦合器件积分时间对微型成像系统成像质量的影响

在光圈固定的情况下，确定合适的积分时间对于提高微型电荷耦合器件(CCD)成像系统的成像质量，增强微型飞行器的侦察能力具有十分重要的意义。本文讨论了决定CCD积分时间的各种因素，重点研究了适用于微型飞行器的CCD成像系统的积分时间与像移的关系，并进一步推导了计算像移量的相关数学模型。利用该模型对不同积分时间内采集的运动图像进行了像质评价，结果表明，在保证曝光量的前提下，当像移量被限制在1个像素内时，可以获得相对理想的运动图像像质。     

正确选择气顶油藏高效开发模式

通过对不同类型气顶油藏的油气水分布特征及气顶和边水能量的研究分析，计算水侵量与边水体积及合理的弹性产率。提出适合气顶油藏特点的开发模式是先开采油区后开采气顶，并以唐家河油田港深18—2断块为例，证明采用该模式可以高效开发气顶油藏。图3表1参6     

Investigation into polishing process of CVD diamond films

A new technique used for polishing chemical vapor deposition (CVD) diamond films has been investigated, by which rough polishing of the CVD diamond films can be achieved efficiently. A CVD diamond film is coated with a thin layer of electrically conductive material in advance, and then electro-discharge machining (EDM) is used to machine the coated surface. As a result, peaks on the surface of the diamond film are removed rapidly. During machining, graphitization of diamond enables the EDM process to continue. The single pulse discharge shows that the material of the coated layer evidently affects removal behavior of the CVD diamond films. Compared with the machining of ordinary metal materials, the process of EDM CVD diamond films possesses a quite different characteristic. The removal mechanism of the CVD diamond films is discussed.     

Characterization and optimization of copper chemical mechanical planarization

The feature scale planarization of the copper chemical mechanical planarization (CMP) process has been characterized for two copper processes using Hitachi 430-TU/Hitachi T605 and Cabot 5001/Arch Cu10K consumables. The first process is an example of an abrasive-free polish with a high-selectivity barrier slurry, while the second is an example of a conventional abrasive slurry with a low-selectivity barrier slurry. Copper fill planarization has been characterized for structures with conformal deposition as well as with bumps resulting from bottom-up fill. Dishing and erosion were characterized for several structures after clearing. The abrasive-free polish resulted in low sensitivity to overpolish and low saturation levels for dishing and erosion. Consequently, this demonstrated superior performance when compared to the International Technology Roadmap for Semiconductors (ITRS) 2000 roadmap targets for planarization. While the conventional slurry could achieve the 0.13-μm technology node requirements, the abrasive-free polish met the planarization requirements beyond the 0.10-μm technology node.     

烧结NdFeB合金中的夹杂物

使用金相显微镜、扫描电镜及Ｘ射线能谱和波谱观察并分析了ＮｄＦｅＢ烧结材料中夹杂物的形态、数量和组成。磁粉制备后立即烧结的ＮｄＦｅＢ磁体中的夹杂物是氧化钕；而在不同环境条件下放置后的ＮｄＦｅＢ粉再烧结的材料中发现，除了氧化钕的夹杂物外，还有钕的氮化物及钕的氮氧复合夹杂物。同时还论讨了这些夹杂物对于ＮｄＦｅＢ材料磁性能的影响。     

Development of a recurrent Sigma-Pi neural network rainfall forecasting system in Hong Kong

At the moment, weather forecasting is still an art — the experience and intuition of forecasters play a significant role in determining the quality of forecasting. This paper describes the development of a new approach to rainfall forecasting using neural networks. It deals with the extraction of information from radar images and an evaluation of past rain gauge records to provide shortterm rainfall forecasting. All of the meteorological data were provided by the Royal Observatory of Hong Kong (ROHK). Preprocessing procedures were essential for this neural network rainfall forecasting. The forecast of the rainfall was performed every half an hour so that a storm warning signal can be delivered to the public in advance. The network architecture is based on a recurrent Sigma-Pi network. The results are very promising, and this neural-based rainfall forecasting system is capable of providing a rain storm warning signal to the Hong Kong public one hour ahead.     

烧结工艺对液相合成（SrPb）TiO3基陶瓷热敏特性影响的研究

本文在液相合成（ＳｒＰｂ）ＴｉＯ３粉的基础上，研究了升温速率、保温时间、烧结温度及降温方式对（ＳｒＰｂ）ＴｉＯ３基陶瓷的Ｖ型ＰＴＣ热敏特性的影响。实验表明：升温速率对其热敏特性影响不大，保温时间和烧结温度的作用是一致的，具有一最佳范围。而降浊方式对材料的热敏特性影响较大。综合各因素的影响，本配方中，样品的烧结制度定为：以２００℃／ｈ的速率升温，在１２５０℃保温１ｈ，炉冷至９５０℃，保温０．５ｈ，再     

PP／SiO2／SBS共混复合材料性能的研究

通过加入增强剂、增韧剂、抗氧剂等添国剂可改善聚丙烯力学性能。以ＳｉＯ２为填料，丁苯橡胶（ＳＢＳ）为增韧剂，探讨ＳｉＯ２、丁苯橡胶含量对共混体系强度、韧性的影响，结果表明，在ＳＢＳ含量大于５％、ＳｉＯ２一小于１０％的范围内，可使ＰＰ／ＳｉＯ２／ＳＢＳ复合的拉伸弹性模量和冲击强度明显提高，其力学性能均为均衡。     

基于信息的智能控制理论研究

本文介绍的基于信息的智能控制理论的发展过程，主要分为智能控制的信息指标和智能控制的信息结构分析两部分，文中在最后对这套理论可能的发展方向进行了探讨。