基于材料补偿的线性色散组合棱镜研究

作为传统的分光器件,棱镜的非线性色散缺陷限制了其在精密光谱仪器中的应用。从分析棱镜非线性色散产生的本质出发,建立了材料的色散模型,提出了一种线性色散组合棱镜设计方法。使用非线性系数T1和T2相近、线性系数V相异的两种材料,通过控制组合棱镜的参数和光线入射角可获得线性色散。最后通过建立线性色散组合棱镜的评价指标,对设计结果进行了科学、合理的评价,验证了设计理论的正确性。研究发现,组合棱镜能够有效改善棱镜的非线性色散缺陷,其改善程度依赖于两种材料的绝对非线性系数P。当P<0.01时,组合棱镜可获得线性色散,其色散曲线的非线性(Nonlinear, NL)优于5%。     

光子晶体直接耦合结构双波长THz波调制器

THz波调制器是太赫兹波通信系统中的关键器件之一。提出了一种基于复式晶格光子晶体直接耦合结构的双波长THz波调制器。该调制器通过在一个点缺陷中引入非线性材料GaAs(砷化镓),可实现仅通过一个点缺陷对双波长THz波的光控调制。仿真结果表明:当两个不同的THz波入射时,调制器插入损耗小、消光比高、调制速率快。与同类侧耦合结构调制器相比,该调制器具有更高的消光比。     

复合轴精跟踪系统伺服带宽的优化设计

复合轴精跟踪系统决定了空间光通信APT系统最终的控制精度,需要很高的伺服带宽、伺服刚度和控制精度。针对该要求,根据精跟踪系统的性能指标和各频段的作用建立对应的期望传输特性和精跟踪系统的频率特性测试系统,对输出数据进行多项式预测滤波,采用递推最小二乘法辨识被控对象传递函数的各个参数,最终得到补偿校正函数,为精跟踪系统带宽的全频段优化设计探索出一种简便有效的设计方法。实验分析表明:精跟踪伺服带宽达到300 Hz以上,系统稳定且响应快速,测试跟踪误差约为±2μrad,各项性能指标均满足精跟踪系统的应用需求。     

Interfacial reactions between liquid indium and Au-deposited substrates

The morphology and growth kinetics of intermetallic compounds formed during the soldering reactions of liquid indium on Au-deposited substrates in the temperature range of 225°C and 350°C have been investigated. The results show that two types of AuIn₂ intermetallic compounds make their appearance: the continuous-wavy-crystalline type, and the floating-island type. The growth of this intermetallic compound follows the parabolic law, which indicates that the growth is diffusion-controlled. The activation energy of the reaction calculated form the Arrhenius plot of growth reaction constants is 39.42 kJ/mol. Also, the wettability of liquid indium on the surface of the gold-deposited substrate is determined from contact angle measurements. Finally, a mechanism for the interpretation of the wetting behavior of the said Au/In system is proposed, which can be ascertained by SEM observations.     

双电机消隙技术在某火炮随动系统中的应用

文中以某火炮随动系统的研制为背景,为了进一步提高系统精度,首先介绍了复合控制系统模型及分区PID算法,另外详细论述了双电机消隙的原理及动力系统结构,并建立了仿真模型。最后,通过matlab仿真表明同时运用分区PID算法和双电机消隙技术,能够在保证系统稳定的情况下,很大程度地提高伺服系统跟踪精度。     

桥梁防船撞主动预警系统设计及实验研究

水运交通的发展和桥梁的增多,导致越来越多的船桥相撞事故发生。针对现有的船舶交通管理系统及被动防船撞装置在内河通航桥梁防船撞上的局限性,提出了桥梁防船撞主动预警系统方案。该系统基于红外和可见光成像探测的互补性,利用红外/可见光/激光复合探测及多源信息融合开展桥梁防船撞主动预警。设计了系统的总体方案及相应的硬、软件方案,并开展了初步的实验研究和性能分析。系统最终可以实现全天候、全天时、全自动、稳定可靠地对有撞桥趋势的船舶提前进行声光告警,有效减少船撞桥事故发生,保护桥梁和船舶的安全。     

elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging

In flip chip technology, Al/Ni(V)/Cu under-bump metallization (UBM) is currently applicable for Pb-free solder, and Sn−Ag−Cu solder is a promising candidate to replace the conventional Sn−Pb solder. In this study, Sn-3.0Ag-(0.5 or 1.5)Cu solder bumps with Al/Ni(V)/Cu UBM after assembly and aging at 150°C were employed to investigate the elemental redistribution, and reaction mechanism between solders and UBMs. During assembly, the Cu layer in the Sn-3.0Ag-0.5Cu joint was completely dissolved into solders, while Ni(V) layer was dissolved and reacted with solders to form (Cu_1−y,Ni_y)₆Sn₅ intermetallic compound (IMC). The (Cu_1−y,Ni_y)₆Sn₅ IMC gradually grew with the rate constant of 4.63 × 10⁻⁸ cm/sec^0.5 before 500 h aging had passed. After 500 h aging, the (Cu_1−y,Ni_y)₆Sn₅ IMC dissolved with aging time. In contrast, for the Sn-3.0Ag-1.5Cu joint, only fractions of Cu layer were dissolved during assembly, and the remaining Cu layer reacted with solders to form Cu₆Sn₅ IMC. It was revealed that Ni in the Ni(V) layer was incorporated into the Cu₆Sn₅ IMC through slow solid-state diffusion, with most of the Ni(V) layer preserved. During the period of 2,000 h aging, the growth rate constant of (Cu_1−y,Ni_y)₆Sn₅ IMC was down to 1.74 × 10⁻⁸ cm/sec^0.5 in, the Sn-3.0Ag-1.5Cu joints. On the basis of metallurgical interaction, IMC morphology evolution, growth behavior of IMC, and Sn−Ag−Cu ternary isotherm, the interfacial reaction mechanism between Sn-3.0Ag-(0.5 or 1.5)Cu solder bump and Al/Ni(V)/Cu UBM was discussed and proposed.     

铜线键合Cu/Al界面金属间化合物微结构研究

由于铜线具有较高的热导率、卓越的电学性能以及较低的成本,被普遍认为将逐渐代替传统的金线而在IC封装的键合工艺中得到广泛的应用。铜线键合工艺中Cu/Al界面金属间化合物(IMC)与金线键合的Au/Al IMC生长情况有很大差别,本文针对球焊键合中键合点的Cu/Al界面,将金属间化合物生长理论与分析手段相结合,研究了Cu/Al界面IMC的生长行为及其微结构。文中采用SEM测试方法,观察了IMC的形貌特点,测量并得到了IMC厚度平方正比于热处理时间的关系,计算得到了生长速率和活化能数值,并采用TEM,EDS等测试手段,进一步研究了IMC界面的微结构、成分分布及其金相结构。     

星载光电复合轴跟踪控制技术研究

将两轴光电跟踪仪搭载于卫星平台对空间运动目标进行持续跟踪监视正在成为一个研究热点,目前这类系统有天基空间目标监视系统(SBSS)、空间跟踪与监视系统(STSS)和持续跟踪与监视系统(PTSS)。为了解决天基目标监视中星载动基座情况下的光轴稳定跟踪控制技术,首先简化了星载光电跟踪控制系统的物理模型,然后求解了太阳同步轨道附近两卫星的相对运动角速度和角加速度大小,接着分析了基于光电复合轴方式的主动稳定跟踪控制方案和原理,最后建立了单轴系的星载光电复合轴跟踪控制系统仿真模型,计算结果为:对相对机动范围内(37.68 ()/s、47.33 ()/s2)的空间目标和相对低匀速范围内(0.1 ()/s)的空间卫星的稳定跟踪精度为2.5。     

光子晶体太赫兹双波长滤波器的设计

这里提出一种新型的光子晶体太赫兹（THz）双波长滤波器,应用平面波法（PWM）分析其带隙结构,应用时域有限差分法（FDTD）研究THz波在该滤波器中的传输特性。结果表明,采用复式正方晶格结构的太赫兹滤波器,可以通过一个点缺陷实现两个波长的选择,通过选择合适半径的点缺陷,并在点缺陷处填充非线性介质砷化镓（GaAs）和增大某些介质柱的半径,可使该滤波器实现高耦合效率的单信道双频率选频滤波功能。