Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints

This study investigates the influence of adding Sb on the microstructure and adhesive strength of the Sn3.5Ag solder. Both solidus and liquidus temperatures increase as Sb additions increase. Adding 1.5wt.%Sb leads to the narrowest range (6.6°C) between the solidus and liquidus temperature of the solder. Adding Sb decomposes the as-soldered ringlike microstructure of Sn3.5Ag and causes solid-solution hardening. The as-soldered hardness increases with increasing Sb addition. For long-term storage, adding Sb reduces the size of the rodlike Ag₃Sn compounds. The hardness also increases with increasing Sb addition. Adding Sb depresses the growth rate of interfacial intermetallic compounds (IMCs) layers, but the difference between 1% and 2% Sb is not distinct. For mechanical concern, adding Sb improves both adhesive strength and thermal resistance of Sn3.5Ag, where 1.5% Sb has the best result. However, adding Sb causes a variation in adhesive strength during thermal storage. The more Sb is added, the higher the variation reveals, and the shorter the storage time requires. This strength variation helps the solder joints to resist thermal storage.     

复合微多普勒效应中几种时频方法的比较

为了研究复合振动目标微多普勒信号中目标振动特征的提取问题,进行了激光微多普勒效应探测运动目标复合振动的实验研究,对实验结果的时频域的联合分析表明:时频分析方法能够较好地分析出运动目标复合振动的微多普勒特征。运用短时傅里叶变换(STFT)、Winger分布(WD)、Winger-Ville分布(WVD)和重排平滑伪Winger-Ville分布(RSPWVD)对微多普勒信号进行了时频分析,并对结果进行了比较。结果表明:重排平滑伪Winger-Ville分布(RSPWVD)能较好地揭示微多普勒信号的特征,是一种有效的时频分析方法。     

微热量热法测定纤维及树脂基复合材料的比热容

为研究利用微热量热法测定纤维及树脂基复合材料的比热容,用焦耳效应建立微热量热仪的灵敏度曲线,在该仪器上测定了30～150 ℃标准品α-氧化铝的比热容,在此温度范围内α-氧化 铝比热测量值与文献值的最大相对偏差为2.41%,该方法具有较高的测量精度。利用微热量热仪测定了碳纤维及3种树脂基复合材料的连续比热容数据,并对测试结果进行了分析。结果表明：微热量热仪能准确快捷的测定纤维及复合材料的连续比热数据,纤维及复合材料比热容随温度有规律的变化。     

Intermetallic compounds formed at the interface between liquid indium and copper substrates

The interfacial reactions between liquid In and Cu substrates at temperatures ranging from 175°C to 400°C are investigated for the applications in bonding recycled sputtering targets to their backing plates. Experimental results show that a scallop-shaped Cu₁₆In₉ intermetallic compound is found at the Cu/In interface after solder reactions at temperatures above 300°C. A double-layer structure of intermetallic compounds containing scallop-shaped Cu₁₁In₉ and continuous CuIn is observed after the Cu/In interfacial reaction at temperatures below 300°C. The growth of all these intermetallic compounds follows the parabolic law, which implies that the growth is diffusion-controlled. The activation energies for the growth of Cu₁₆In₉, Cu₁₁In₉, and CuIn intermetallic compounds calculated from the Arrhenius plot of growth reaction constants are 59.5, 16.9, and 23.5 kJ/mole, respectively.     

Zwitterionic Nanohydrogel Grafted PVDF Membranes with Comprehensive Antifouling Property and Superior Cycle Stability for Oil‐in‐Water Emulsion Separation

Fouling caused by oil and other pollutants is one of the most serious challenges for membranes used for oil/water separation. Aiming at improving the comprehensive antifouling property of membranes and thus achieving long‐term cyclic stability, it is reported in this work the design of a kind of zwitterionic nanosized hydrogels grafted poly(vinylidene fluoride) (PVDF) microfiltration membrane (ZNG‐g‐PVDF) with superior fouling‐tolerant property for oil‐in‐water emulsion separation. Sulfobetaine zwitterionic nanohydrogels with the diameter of ≈ 50 nm are synthesized by an inverse microemulsion polymerization process. They are then grafted onto the surface of PVDF microfiltration membrane, endowing the membrane a superhydrophilic and nearly zero oil adhesion property. This ZNG‐g‐PVDF membrane exhibits great tolerance and resistance to salts pH, especially an excellent antifouling property to oil‐in‐water emulsions containing various pollutants such as surfactants, proteins, and natural organic materials (e.g., humic acid). The comprehensive antifouling property of the membrane gives rise to the cyclic stability of the membrane greatly improved. A nearly 100% recovery ratio of permeating flux is achieved during several cycles of oil‐in‐water emulsion filtration. The ZNG‐g‐PVDF membrane shows great potential in treating practical oily wastewater containing complicated components in the effluent.     

一种陶瓷复合吸波材料的表面分形表征及其性能研究

通过RCS(雷达截面)综合测试系统,对实验室自制的陶瓷复合吸波材料的吸波性能与材料表面形貌进行研究,结果表明:(1)陶瓷复合吸波材料表面存在分形的重要特征,所制3块材料的表面灰度分维数分别为2.3602、2.3907、2.6255;(2)实验频率范围内,陶瓷复合吸波材料的相对反射率与发射频率存在显著线性关系;(3)随着发射频率的升高,不同表面形貌的材料的相对反射率的升高速率不同;(4)陶瓷复合吸波材料的相对反射率随发射频率的变化速率(斜率)与材料表面分维数存在极其显著的线性相关性.     

基于PI迟滞模型的压电陶瓷复合控制算法研究

为减小压电陶瓷的迟滞非线性对系统跟踪精度的影响,该文采用经典的存在逆解析的PI迟滞模型对压电陶瓷的迟滞特性进行建模,将PI模型的逆模型用于压电陶瓷的前馈控制算法中,然后设计了神经元比例、积分、微分(PID)反馈控制算法,将前馈控制算法与神经元PID反馈控制算法结合得到了压电陶瓷的复合控制算法。将仅含前馈的控制算法和复合控制算法在压电陶瓷的控制器上执行,实验结果表明,仅含前馈的控制算法的跟踪误差为1.256μm,而复合控制算法的跟踪误差仅为0.092μm,该复合控制算法使跟踪精度提高了1.164μm。     

两种介质柱构成复式正方晶格的完全光子带隙

由一个正方介质柱和两个圆介质柱构造一个二维正方复式晶格的光子晶体.应用平面波展开的方法研究了光波在其中的传播规律.通过调节介质柱几何尺寸和介电常数,该结构产生了完全光子带隙.     

Co/BaTiO3纳米复合薄膜的PLD法制备及其Raman光谱

采用脉冲激光气相沉积（PLD）技术在MgO（100）衬底上生长了Co/BaTiO₃纳米复合薄膜,利用原子力显微镜、透射电镜、X射线衍射（XRD）及Raman光谱等测试分析手段对Co/BaTiO₃纳米复合薄膜进行测试分析。结果表明：薄膜表面均匀、致密,具有原子尺度的光滑性;Co纳米晶粒呈单分散、均匀分散在沿C轴呈单取向生长的BaTiO3单晶基体中;随着掺杂Co含量的增高,BaTiO3的Raman峰的峰强随之增大。     

Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints

The shear strength of ball-grid-array (BGA) solder joints on Cu bond pads was studied for Sn-Cu solder containing 0, 1.5, and 2.5 wt.% Cu, focusing on the effect of the microstructural changes of the bulk solder and the growth of intermetallic (IMC) layers during soldering at 270°C and aging at 150°C. The Cu additions in Sn solder enhanced both the IMC layer growth and the solder/IMC interface roughness during soldering but had insignificant effects during aging. Rapid Cu dissolution from the pad during reflow soldering resulted in a fine dispersion of Cu₆Sn₅ particles throughout the bulk solder in as-soldered joints even for the case of pure Sn solder, giving rise to a precipitation hardening of the bulk solder. The increased strength of the bulk solder caused the fracture mode of as-soldered joints to shift from the bulk solder to the solder/IMC layer as the IMC layer grew over a critical thickness about 1.2 m for all solders. The bulk solder strength decreased rapidly as the fine Cu₆Sn₅ precipitates coarsened during aging. As a consequence, regardless of the IMC layer thickness and the Cu content of the solders, the shear strength of BGA solder joints degraded significantly after 1 day of aging at 150°C and the shear fracture of aged joints occurred in the bulk solder. This suggests that small additions of Cu in Sn-based solders have an insignificant effect on the shear strength of BGA solderjoints, especially during system use at high temperatures.