A Solder Alloy Filled Z-Axis Conductive Epoxy Adhesive

Epoxy adhesives filled with four different volume fractions of eutectic tin-bismuth solder alloy were prepared and the effect of filler content on the electrical and mechanical properties of these anisotropic electrically conductive adhesives was investigated. The results show that the adhesive containing the lowest amount of the filler alloy had the best combination of conductivity, insulation resistance and shear strength. The DSC-measurements suggested that the filler melts before the cure of the resin begins which allows the filler to wet and bond well to the conductors. This was verified by SEM/EPMA examinations. A temperature cycling test and high humidity, high temperature treatment were conducted on the best composite adhesive. The temperature variation had no effect on conductivity of the joints while humid and hot environment decreased the conductivity.     

反相微乳液法制备高溶度ZrO2陶瓷墨水(Ⅰ)

尝试采用新颖的反相微乳液法制备陶瓷墨水，为了获得高溶度陶瓷墨水，对反相微乳液体系优选进行研究，着重就Triton x-100/醇／烷／水体系，采用目测法，分光光度法，电导率法和离心分离法，分别考察了不同醇，烷配伍时体系的稳定性和相关物理性质，根据这些性质是否突变以确定体系是否发生相变，给出了体系拟三元相图。实验表明，在20℃时Triton x-100／正己醇／环己烷／水反相微乳液体系表现优异，当Triton x-100与正醇的质量比为3：2时达到最大范围的反相微乳液区，最大溶水量时的最佳组成为Triton x-100:正己醇：环己烷：水＝19．1％：12．8％：23．7％：44．4％（质量比）。     

磁性油墨的研究进展

综述国内外磁性油墨的研究现状。分析了磁性油墨中的强磁性材料、连接料、填充料和添加料的各种分类、配比及各组分作用,探讨了磁性油墨的研究方向。首次指出:在今后的研究中应该采用纳米级的磁性颜料和复合磁性颜料,选用合成树脂作为连接料,并应重点研究添加料与磁性油墨性能的关系。     

填料并用对双组分室温硫化导热硅橡胶性能的影响

以α,ω-二羟基聚二甲基硅氧烷为基胶,Si3N4、AlN、Al2O3为导热填料,制备了填充型双组分室温硫化（RTV-2）导热硅橡胶.研究了填料Si3N4/Al2O3或AlN/Al2O3并用对RTV-2硅橡胶导热性能、工艺性能及力学性能的影响.结果表明,当填料的总体积分数为0.45时,对于Si3N4/Al2O3填充体系,随着体系中Al2O3体积分数的增加,RTV-2导热硅橡胶的热导率先升后降、拉伸强度先增后减,而扯断伸长率则呈逐渐升高的趋势,基料的粘度先减后增;当Al2O3的体积分数为0.14时,RTV-2导热硅橡胶的热导率最高、拉伸强度最大,基料的粘度最小,综合性能最佳.对于AlN/Al2O3填充体系,随着体系中Al2O3的体积分数的增加,RTV-2导热硅橡胶的热导率先升后降、拉伸强度及扯断伸长率先减后增,基料的粘度呈上升趋势;当Al2O3的体积分数为0.07时,RTV-2导热硅橡胶具有较好的导热性能和工艺性能,但力学性能偏低.     

积层线路板用液态感光成像油墨的应用研究

研究了积层线路板油墨的组成配方、制备和应用工艺,分析了不同预烘时间对油墨分辨率的影响以及过显和显影不足问题的形成,并从生产和实际操作的角度,提出了解决的方案。利用聚苯醚改性的环氧树脂,应用于油墨的配方中,改善了油墨固化后绝缘材料的耐热性、介电性等主要性能。油墨中改性环氧树脂的质量分数为13.0%时,固化后绝缘材料的玻璃化温度可达184.22℃,介电常数为3.19,介质耗损因数为0.019,可以作高频积层线路板的绝缘层。     

Glass powders and reactive silicone binder: Interactions and application to additive manufacturing of bioactive glass-ceramic scaffolds

A novel concept for the additive manufacturing of three-dimensional glass-ceramic scaffolds, to be used for tissue engineering applications, was based on fine glass powders mixed with a reactive binder, in the form of a commercial silicone. The powders consisted of ‘silica-defective glass’ specifically designed to react, upon firing in air, with the amorphous silica yielded by the binder. By silica incorporation, the glass was intended to reach the composition of an already known CaONa₂OB₂O₃SiO₂ system. Silica from the binder provided up to 15 wt% of the total silica. With the same overall formulation, silicone-glass powder mixtures led to nearly the same phase assemblage formed by the reference system, crystallizing into wollastonite (CaSiO₃) and Ca-borate (CaB₂O₄). Samples from silicone-glass powder mixtures exhibited an excellent shape retention after firing, which was later exploited in highly porous reticulated scaffolds, obtained by means of direct ink writing (DIW).     

Contraction stress build‐up of anisotropic conductive films (ACFs) for flip‐chip interconnection: Effect of thermal and mechanical properties of ACFs

The important mechanical mechanism for the electrical conduction of anisotropic conductive films (ACFs) is the joint clamping force after the curing and cooling processes of ACFs. In this study, the mechanism of shrinkage and contraction stress and the relationship between these mechanisms and the thermomechanical properties of ACFs were investigated in detail. Both thickness shrinkages and modulus changes of four kinds of ACFs with different thermomechanical properties were experimentally investigated with thermomechanical and dynamic mechanical analysis. Based on the incremental approach to linear elasticity, contraction stresses of ACFs developed along the thickness direction were estimated. Contraction stresses in ACFs were found to be significantly developed by the cooling process from the glass‐transition temperature to room temperature. Moreover, electrical characteristics of ACF contact during the cooling process indicate that the electrical conduction of ACF joint is robustly maintained by substantial contraction stress below T_g. The increasing rate of contraction stresses below T_g was strongly dependent on both thermal expansion coefficient (CTE) and elastic modulus (E) of ACFs. A linear relationship between the experimental increasing rate and E × CTE reveals that the build‐up behavior of contraction stress is closely correlated with the ACF material properties: thermal expansion coefficient, glassy modulus, and T_g. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 2634–2641, 2004     

聚苯胺/涤纶导电织物再掺杂及洗涤性能的研究

采用现场吸附聚合法制备了聚苯胺 /涤纶导电织物 ,采用不同种类的酸对其进行再掺杂 ,研究了酸的种类对织物导电性能的影响 ,并对导电织物进行了洗涤实验及洗涤牢度实验。结果表明 :无机酸对导电织物的掺杂效果优于大多数有机酸。导电涤纶织物的导电性能受洗涤液酸碱度的影响 ,其中碱性洗涤液使导电性能降低 2个数量级 ,酸性洗涤液使导电性能下降 1个数量级 ,而且聚苯胺在涤纶织物表面具有良好的附着性     

LDPE/石墨导电复合材料的研究

为了制备具有低渗滤阈值的导电复合材料，通过溶液插层法，选用三种不同的导电填料（石墨，膨胀石墨，膨化石墨），引入马来酸酐接枝聚乙烯。制备低密度聚乙烯/石墨导电复合材料，导电填料的结构对复合材料的电性能和力学性能有很大的影响，其中膨化石墨可使复合体系具有较低的导电渗滤阈值，但复合材料的力学性能较差。     

临界组成区域的热敏导电材料加工工艺

研究了开炼，密炼及双螺杆挤出３种不同塑炼方式及采用压制，注射，单螺杆挤出３种不同成型方法对临界组成区域的热敏导电材料电性能及力学性能的影响规律，并对开炼，密炼两种工艺的混炼条件，加料方式及加料顺序进行了考察，结果表明，采用密炼工艺，炭黑（ＣＢ）粒子能得到均匀分布，电阻率较低，拉伸强度及断裂伸长率高，适中的剪切速率及温度有利于ＣＢ粒子分散，采用压制成型法所得样品各向同性。