Electroless copper plating using Fe as a reducing agent

Although the electroless plating method is known to be an effective method for obtaining fine wiring in particular, 1 mol hydrogen gas is generated during 1 mol Cu deposition, and voids are generated in the wiring when electroless Cu plating is applied to fine wiring. To avoid the hydrogen evolution, the possibility of performing electroless Cu plating was confirmed using an inexpensive Fe^II compound as a reducing agent. The bath contains CuSO₄, FeSO₄, NaCl, ethylenediamine, sodium citrate, polyethylene glycol (PEG), and 2,2′-bipyridine. Under optimal conditions, over 1.7 μm of copper deposit with a smooth surface was obtained after 3 h of plating, which did not contain iron as an impurity. The electrical resistivity of the copper film is about 3-4 μΩ cm corresponding to that of electroplated copper films.     

选择性螯合滴定法测定电镀液和镀层中铜的含量

本法先用ＥＤＴＡ螯合Ｃｕ＾２＋和其他金属阳离子，然后加入ＤＬ－半胱氨酸作为释放剂分解Ｃｕ－ＥＤＴＡ释放出的ＥＤＴＡ用Ｐｂ＾２＋标准溶液返滴定，以ＸＯ－ＭＴＢ－ＣＰＢ为混合指示剂，滴定终点颜色变化敏锐，测定结果准确，并对多种金属离子的干扰进行了研究。     

Equilibrium and kinetic studies of the extraction of chelated copper(II) anions with Aliquat 336

The equilibrium and kinetics of solvent extraction of Cu²⁺ from aqueous solutions containing equimolar EDTA with Aliquat 336 in n‐decanol and kerosene at 298 K were investigated. The concentrations of Cu²⁺ (8–50 mol m^?3), Cl^? (5–60 mol m^?3), and Aliquat 336 (20–100 mol m^?3) were varied. A semi‐empirical model with three parameters was proposed to describe the equilibrium behavior, in which the non‐idealities in both aqueous and organic phases were considered. Over the ranges studied, the model agreed reasonably well with the experimental data (standard deviation, 15%). The forward and backward reaction rate constants were determined as (5.31 ± 0.16)×10^?6 m^9/4 mol^?3/4 s^?1 and (2.62 ± 0.09)×10^?7 s^?1, respectively, at 298 K. An interfacial reaction mechanism was proposed, which revealed that the reaction between the chelated anions and trimeric amine molecules at the interface was rate limiting. The derived rate laws were consistent with the experimental results. © 2002 Society of Chemical Industry     

230 kt/a烟气制酸系统的运行及改造情况

介绍230kt／a诺兰达炉铜冶炼烟气制酸装置的运行及技术改造。装置采用稀酸洗净化、ⅣⅠ-Ⅲ Ⅱ“3 1”两转两吸工艺流程，运行中发现板式酸冷却器堵塞、电除雾器腐蚀、气体换热器积酸和漏气等现象，通过更换为阳极保护管壳式酸冷却器、在电除雾器前增设湍冲洗涤器、调整换热管的喷铝成分等措施，收到良好的效果。     

FR-4敷铜板专用四溴双酚A环氧树脂生产工艺优化

介绍了FR 4敷铜板专用CYD 5 2 1 A 80四溴双酚A环氧树脂的性能、生产原理、工艺流程及生产工艺的再优化 ,使产品色度、粘度指标均达到FR 4敷铜板的高标准要求。产品质量稳定 ,为CYD 5 2 1 A 80产品国产化奠定了技术基础。     

Microstructural characterization of Cu/Al composites and effect of cooling rate at the Cu/Al interfacial region

Cu/Al composites are of vital importance in industrial applications because of their numerous advantages. The influence of bond-ing temperature and cooling rate on the microstructure and morphology of ...     

Leaching of a copper flotation concentrate with ammonium persulfate in an autoclave system

The leaching behavior of a copper flotation concentrate was investigated using ammonium persulfate （APS） in an autoclave systee. The decomposition products of APS, active oxygen, and acidic medium were used to extract metals from the concentrate. Leaching experiments were performed to compare the availability of APS as an oxidizing agent for leaching of the concentrate under atmospheric conditions and in an autoclave system. Leaching temperature and APS concentration were found to be important parameters in both leaching systems. Atmospheric leaching studies showed that the metal extractions increased with the increase in APS concentration and temperature （up to 333 K）. A similar tendency was determined in the autoclave studies up to 423 K. It was also determined that the metal extractions decreased at temperatures above 423 K due to the passivation of the particle surface by molten elemental sulfur. The results showed that higher copper extractions could be achieved using an autoclave system.     

铜参与的三氟甲硫化反应研究进展

由于三氟甲硫基强的吸电子作用、亲脂性和疏水性,三氟甲硫醚类化合物在生物、医药和农药等领域得到了广泛应用,其合成方法也逐渐成为有机化学领域的研究热点之一,其中铜试剂参与的三氟甲硫化反应发展迅速.按照参与三氟甲硫化反应底物的不同,主要综述了各种铜试剂参与的卤代烃、芳基硼酸、C-H键活化等方面的三氟甲硫化反应的研究进展.     

铜离子印迹改性壳聚糖海绵的制备及应用研究

以醋酸铜为模板,甲醇、氯仿为溶剂,2-乙烯吡啶、丙烯酰胺为功能单体,乙二醇二甲基丙烯酸酯为交联剂,采用本体聚合法制备铜离子印迹聚合物;然后掺入到壳聚糖海绵的制备中,使壳聚糖海绵对铜离子的吸附率由27．1％提高到72．3％。制备的铜离子印迹改性壳聚糖海绵需要2d达到吸附平衡,吸附-解吸5次后,性能稳定。     

宽厚板坯连铸结晶器铜板的热流密度分布与热分析

基于热电偶对邯钢宽厚板坯连铸结晶器铜板的温度实测,构建其有限元传热模型与非线性估算热流密度模型。采取模型反算的结果获得铜板的热流密度,并且与热平衡方法计算出的平均热流密度做对比,论证模型的有效性,确定铜板宽、窄面的热流密度公式,同时对铜板进行温度分布分析。铜板热面、冷面的温度曲线均呈波浪状分布,热面的温度变化较为平缓,冷面有最大29.4℃的温差。铜板的温度随至弯月面的距离的增大而减小,但在结晶器出口区域出现23℃的回温。