Expansion of Plasma of Electrically Exploding Single Copper Wire Under 4.5kA～9.5kA/Wire

Abstract The experimental system for electrically exploding single metal wire has been de-signed and manufactured. Expansion of the dense plasma column formed from an electricallyexploding Cu wire of diameter 30 μm has been studied with a high-speed photographer to obtainthe time-dependent radius (R-t) curve. The experimental results demonstrate that the mean ex-pansion rate of the dense plasma column is 1.94 μm/ns, 2.6 μm/ns and 3.75 μm/ns according tothe peak pulse current 4.5 kA, 7 kA and 9.5 kA respectively. The results can be beneficial to givinga profound understanding of the early stage of wire-array Z-pinch physics and to improvement ontheir design.     

葫芦岛蒙脱土的特征与催化活性

研究了葫芦岛蒙脱土的某些特征与催化活性。该蒙脱石的离子交换能力与层间距分别是７５ｍｅｑ／１００ｇ和１．５２９ｎｍ，对偏三甲苯的歧化、异构化以及偏四甲苯的脱甲基、异构化都具有催化活性。这些数据表明葫芦岛蒙脱土是一种有用的催化材料。     

Windows应用程序界面设计的若干问题

界面设计是软件开发的重要组成部分，本文论述了实现美观、实用的用户界面必须注意的几个问题，如界面设计的美学原则、可用性设计的概念、当用户或系统出错时的用户交互形式、帮助使用的用户辅助模式以及为使应用程序运行于不同计算机的显示类型设计。     

Cu的清洁生产

简要介绍Cu的湿法冶金新技术,即Cu的浸出及Cu的萃取清洁生产新工艺.该技术近几年得到了迅猛的发展,它实现了Cu冶金的清洁生产,有利于环境保护,实现了社会效益和环境效益的统一.     

水平连铸引拉铸紫铜工艺的初探

探讨水平连铸拉铸紫铜熔炼、铸造的工艺特点，分析拉铸工艺参数对铸坯质量的影响．     

诺砂的特性及综合利用

在研究诺砂特性的基础上论述了诺砂综合利用的各种途径，给出了实际利用中应注意的问题．     

难选氧化铜矿的浮选试验研究

针对某难选氧化铜矿石氧化率和结合率高，原矿品位低，脉石矿以钙镁含量高的碳酸盐碱性为主的特点，考查了不同的捕收剂回收氧化铜的效果，表明采用提高磨矿细度。组合捕收剂，深化活度，强化连生体和细粒铜矿物的有效选别，在保证铜精矿品位波动不大的情况下，提高选矿回收率7．82％，选矿工艺流程简单易行，具有应用价值。     

界面改性对SiCp/Cu复合材料力学性能的影响

研究了界面改性对SiC颗粒增强Cu基复合材料力学性能和断裂机制的影响。结果表明：经过SiC颗粒表面涂层处理后，可在复合材料中获得干净、紧密的界面结合。通过复合材料界面优化，可在基体和增强物之间有效传递载荷，减少了拉伸变形时的界面脱粘，从而提高了复合材料的屈服强度、抗拉强度和断裂延伸率。     

硫化铜精矿焙烧的非等温动力学研究

采用DTA，TG结合X-射线衍射分析，对硫化铜精矿的焙烧的动力学进行了研究．发现硫化铜精矿焙烧可以分成两个阶段．在第一个阶段(673～857K)，铜的硫化物被氧化成硫酸盐；在第三个阶段(857～1073K)，生成的硫酸盐将分解为氧化物．其两个阶段都受界面化学反应所控制，表观活化能分别为159．5kJ／mol和242．2H／mol．     

Numerical Modeling of Grain Boundary Effects in the Diffusional Creep of Copper Interconnect Lines

We propose a numerical simulation technique to model the process of diffusional creep and stress relaxation that occurs in Cu-damascene interconnects of integrated circuit devices in processing stage. The mass flow problem is coupled to the stress analysis through vacancy flux and equilibrium vacancy concentration. The technique is implemented in a software package that seamlessly integrates the problem-oriented code with commercially available finite element program MSC.Marc. It is utilized to model the Coble creep phenomenon by introducing the nanoscale grain boundary region having the thickness on the order of several layers of atoms. As an illustration, the two-dimensional problem of stress relaxation in a single grain subjected to prescribed displacements and tractions is examined.