基于SPA联系数的同异反定量推理路径选择

基于集对分析（ＳＡＰ）的同异返定量推理已在学生成绩推算中得到应用。文章侧重研讨基于ＳＰＡ联系同异反定量推理路径的选择,给出其一般规则,并举例说明其应用。     

铝液对石墨润湿过程的研究

铝-石墨复合材料制造中的突出问题是铝液与石墨的润湿能力很差,为此大多在工艺上采取措施,如石墨表面喷涂Ti-B,Ni或Cu涂层,或采用流变铸造等。然而这些措施使得工艺复杂、成本提高,因而推广应用受到限制。为改善铝液与石墨的润湿能力,有必要深入研究铝液对石墨的润湿过程。国内外这方面报道甚少,而且所报道的结果差别较大。我们通过长时间的保温试验,仔细地研究了不同温度下铝液对石墨的润湿过程,发现了一些新的现象。     

自聚焦共焦探测系统轴向分辨率的影响因素

从微小内尺度测量角度出发，研究了针孔尺寸、探测器位置、透镜的数值孔径、放大倍率和杂散光等对自聚焦共焦式探测系统轴向分辨率的影响。结果表明，为提高系统的轴向分辨率，需将有效针孔尺寸控制在≤2.5；探测器需配以精密微调整装置以实现横向精确定位；选用差动共焦光路及大数值孔径和大放大倍率的自聚焦透镜，同时，偏振光路的使用将有效的提高系统的信噪比。     

Mechanically Programmable Dip Molding of High Aspect Ratio Soft Actuator Arrays

This work presents multiple methods of creating high aspect ratio fluidic soft actuators that can be formed individually or in large arrays via dip coating. Within this methodology, four strategies are provided to mechanically program the motion of these actuators, including the use of fiber inclusions, gravity, surface tension, and electric fields. The modular nature of this dip coating fabrication technique is inexpensive, easy to modify, and scalable. These techniques are used to demonstrate the fabrication of soft actuators with aspect ratios up to 200:1 and integrated arrays of up to 256 actuators. Furthermore, these methods have the potential to achieve higher aspect ratios and larger array sizes. Operating pressure, curvature, and curling strength tests reveal the design space in which fabrication parameters can be selected to tune the input and output parameters of soft bending actuators. An individual bending actuator made with these methods weighs between 0.15 and 0.5 g, can hold up to 2 N, and can be designed to work in groups to increase curling strength with distributed contact forces. Arrays of these actuators may be useful in atypical grasping and manipulation tasks, fluid manipulation, and locomotion.     

Tuning Interfacial Properties by Spontaneously Generated Organic Interlayers in Top‐Contact‐Structured Organic Transistors

Controlling the interfacial properties between the electrode and active layer in organic field‐effect transistors (OFETs) can significantly affect their contact properties, resulting in improvements in device performance. However, it is difficult to apply to top‐contact‐structured OFETs (one of the most useful device structures) because of serious damage to the organic active layer by exposing solvent. Here, a spontaneously controlled approach is explored for optimizing the interface between the top‐contacted source/drain electrode and the polymer active layer to improve the contact resistance (R_C). To achieve this goal, a small amount of interface‐functionalizing species is blended with the p‐type polymer semiconductor and functionalized at the interface region at once through a thermal process. The R_C values dramatically decrease after introduction of the interfacial functionalization to 15.9 kΩ cm, compared to the 113.4 kΩ cm for the pristine case. In addition, the average field‐effect mobilities of the OFET devices increase more than three times, to a maximum value of 0.25 cm² V^?1 s^?1 compared to the pristine case (0.041 cm² V^?1 s^?1), and the threshold voltages also converge to zero. This study overcomes all the shortcomings observed in the existing results related to controlling the interface of top‐contact OFETs by solving the discomfort of the interface optimization process.     

Influence of transient flow and solder bump resistance on underfill process

The underfill flow process is one of the important steps in Microsystems technology. One of the best known examples of such a process is with the flip-chip packaging technology which has great impact on the reliability of electronic devices. For optimization of the design and process parameters or real-time feedback control, it is necessary to have a dynamic model of the process that is computationally efficient yet reasonably accurate. The development of such a model involves identifying any factors that can be neglected with negligible loss of accuracy. In this paper, we present a study of flow transient behavior and flow resistance due to the presence of an array of solder bumps in the gap. We conclude (1) that the assumption of steady flow in the modeling of the flow behavior of fluids in the flip-chip packaging technology is reasonable, and (2) the solder bump resistance to the flow can not be neglected when the clearance between any two solder bumps is less than 60-70 μm. We subsequently present a new model, which extends the one proposed by Han and Wang in 1997 by considering the solder bump resistance to the flow.     

CdTe/CdS thin film solar cells grown in substrate configuration

The ability to grow efficient CdTe/CdS solar cells in substrate configuration would not only allow for the use of non‐transparent and flexible substrates but also enable a better control of junction formation. Yet, the problems of barrier formation at the back contact as well as the formation of a p–n junction with reduced recombination losses have to be solved. In this work, CdTe/CdS solar cells in substrate configuration were developed, and the results on different combinations of back contact materials are presented. The Cu content in the electrical back contact was found to be a crucial parameter for the optimal CdCl₂‐treatment procedure. For Cu‐free cells, two activation treatments were applied, whereas Cu‐containing cells were only treated once after the CdTe deposition. A recrystallization behavior of the CdTe layer upon its activation similar to superstrate configuration was found; however, no CdTe–CdS intermixing could be observed when the layers were treated consecutively. Remarkably high V_OC and fill factor of 768 mV and 68.6%, respectively, were achieved using a combination of MoO₃, Te, and Cu as back contact buffer layer resulting in 11.3% conversion efficiency. With a Cu‐free MoO₃/Te buffer material, a V_OC of 733 mV, a fill factor of 62.3%, and an efficiency of 10.0% were obtained. Copyright © 2012 John Wiley & Sons, Ltd.     

融合地址簿系统关键技术研究

融合地址簿系统是对位于多种终端的多种用户地址进行综合管理的业务新技术,其显著优点是当任一联系人的信息改变时能够对所有本地地址簿进行及时更新,有效地解决地址数据的失效问题。本文研究了融合地址簿系统中数据同步更新和订阅的关键实现技术,给出了系统架构,并给出了系统的仿真测试。     

Improved performance of inverted polymer solar cells by utilizing alcohol-soluble oligofluorenes as efficient cathode interlayers

Two star-shaped oligofluorenes with hexakis(fluoren-2-yl)benzene as core are designed and synthesized, namely Tn0 and Tn1. Diethylamino groups are attached to the side chain of fluorene units of Tn0 and Tn1 and enable them alcohol solubility, additional hydrophobic nhexyl chains are grafted on the π-extended fluorene arms of Tn1. Power conversion efficiency (PCE) as high as 8.62% and 8.80% are achieved when utilizing Tn0 and Tn1 as cathode interlayers in inverted polymer solar cells, respectively. The work function of ITO effectively decreased by introducing interlayer, resulting in high Voc of the device, besides, the wetting properties of the interlayers can be tuned by modifying the oligofluorenes with π-extended structure, and the more hydrophobic interlayer will benefit the device performance with enhanced Jsc and FF.     

考虑动态接触参数的某型导弹发射动力学分析

为研究某型号反坦克导弹系统的发射动力学特性,基于弹性理论计算了接触变形模型的动态接触参数,通过多体系统动力学软件ADAMS对该模型进行了仿真分析,并重点讨论了温度、初始方位瞄准角、阻尼特性以及地面接触参数对初始扰动的影响.仿真结果表明,它们对初始扰动均有影响,低温发射下的初始扰动大,阻尼器阻尼系数以大于300N.s/rad为佳,增大地面接触参数有利于减小初始扰动.