Surface Position-Resolved Thermophysical Properties for Metallic Alloys

Thermophysical properties are collective measures of a material to transport dynamical quantities of physical nature on its surface or through the bulk. As such, the exact nature of couplings between particles in a many-body assembly of building block atoms or molecules sensitively determines their values. The couplings between nearest neighbors are the product of the local elemental composition and the material phase. In this study, thermal cycling of a four-element Wood’s alloy specimen brings out cadmium-rich patches to the top surface of the specimen. An assembly of such patches leads to depth-dependent deviations of elemental composition from that of the bulk. Surface-layer atoms are driven to form a high temperature laser-produced plasma (LPP), and time-resolved spectroscopy of their emissions show the variability of elemental composition over surface positions as well as over depth from the surface. These thermal history-driven composition anomalies contribute to significant variability in the measured values of spectral emissivity and thermal diffusivity.     

Forecasting of Turkey's net electricity energy consumption on sectoral bases

In this study forecast of Turkey's net electricity energy consumption on sectoral basis until 2020 is explored. Artificial neural networks (ANN) is preferred as forecasting tool. The reasons behind choosing ANN are the ability of ANN to forecast future values of more than one variable at the same time and to model the nonlinear relation in the data structure. Founded forecast results by ANN are compared with official forecasts.     

速度密度 10m/s住宅

本文通过一次参加日本《新建筑》国际住宅竞赛的经历，就未来高密度城市环境中住宅的生存状态进行了探讨。并试图用以速度来定义密度的方式探索当私密性与公共交往之间出现不可调和的矛盾时一种新的解决之道。     

等离子体横向刻蚀硅的特性研究

研究了用SiO2 +Al作掩模 ,SF6 +O2 混合气体等离子体对Si的横向刻蚀 ,其结果表明 ,在SF6 +O2 等离子体气氛中 ,Al是很好的保护膜 ,可以在待悬浮器件下形成大的开孔。因此 ,预计用这种技术 ,可以在Si片上集成横向尺寸为数百微米 ,具有优良高频性能的MEMSRF/MW无源器件 ,如开关、传输线、电感和电容等。     

Transient Green’s Tensor for a Layered Solid Half-Space With Different Interface Conditions

Pulsed ultrasonic techniques can be and have been used to examine the interface conditions of a bonded structure. To provide a theoretical basis for such testing techniques we model the structure as a layer on top of a half-space, both of different elastic properties, with various interface bonding conditions. The exact dynamic Green’s tensor for such a structure is explicitly derived from the three-dimensional equations of motion. The final solution is a series. Each term of the series corresponds to a successive arrival of a “generalized ray” and each is a definite line integral along a fixed path which can be easily computed numerically. Willis’ method is used in the derivation. A new scheme of automatic generation of the arrivals and ray paths using combinatorial analysis, along with the summation of the corresponding products of reflection coefficients is presented. A FORTRAN code is developed for computation of the Green’s tensor when both the source and the detector are located on the top surface. The Green’s tensor is then used to simulate displacements due to pulsed ultrasonic point sources of known time waveform. Results show that the interface bonding conditions have a great influence on the transient displacements. For example, when the interface bonding conditions vary, some of the first few head waves and regular reflected rays change polarities and amplitudes. This phenomenon can be used to infer the quality of the interface bond of materials in ultrasonic nondestructive evaluation. In addition the results are useful in the study of acoustic microscopy probes, coatings, and geo-exploration.     

GAO Feng~1,LI Wei~2,TANG Zon

tific Experiment Center of Guangxi Medical University,Nanning 530021,China)Objective:To investigate the mutation pattern of adenomatous polyposis coli(APC),Kirsten-ras(K-ras) and p53 genes in sporadic colorectal cancer tissues.Meth     

Alternating,all-trans polyenynes: Model compounds for poly(diacetylene)s with defined conjugation length

The syntheses of polyenynes as model compounds for poly(diacetylene)s (PDAs) are described. Variation of properties (UV–VIS, Raman, NMR and bond geometries) as a function of the chain length was investigated. After extrapolation to infinite chain length these data were compared to those for PDAs. From UV–VIS spectra a value of λ = 551 nm (2.25 eV) was calculated corresponding to the electronic transition of a single polyenyne chain. This energy is located at the low energy end of a yellow PDA solution spectrum. From Raman scattering v_(C?C) = 2108–2128 cm^?1 and v_(C?C) = 1505–1532 cm^?1 were calculated after extrapolation. Similarly sp-C¹³C NMR data yielded a shift of δ = 100 ppm. These data are almost identical to data known for yellow PDA solutions. Bond geometries are almost identical to those of poly(diacetylene)s and theoretical data.     

SOLUBILISATION OF NITROGENOUS CONSTITUENTS OF BREWERS' SPENT GRAIN

The extraction of nitrogenous material from Brewers' spent grain (BSG) by solvents (water, sodium chloride solution, aqueous alcohol, acidic and alkaline solutions) commonly used to extract cereal proteins, resulted in the relatively low (0·2 to 8·5%) recovery of the total nitrogen. The recovery of nitrogenous material by the use of aqueous alkaline solutions was increased from 3–4% to 41% when the BSG was subjected to cellulase incubation prior to extraction. Approximately 75% of the nitrogen was solubilized with trifluoracetic acid. Detergent solutions (acid, neutral) solubilized more than 80% of the total nitrogen of the BSG. The low solubility of the nitrogenous constituents by conventional protein solvents could be the result of association between cellulosic material and protein.     

交联型聚醚聚氨酯的表征、力学性能及其碱金属盐络合物的导电性能

采用三羟甲基丙烷（ＴＭＰ）作交联剂与聚乙二醇（ＰＥＯ－１５４０）和甲苯二异氰酸酯（ＴＤＩ）反应，得到了具有较好力学性能的交联型聚醚聚氨酯（ＰＥＵ），该聚合物与ＬｉＣｌＯ４的结合物具有较高的室温电导率（σ３０℃＝１．８７×１０￣（－４）Ｓ／ｃｍ）。采用全反射红外光谱（ＡＴＲ－ＩＲ）对聚合物的结构进行了表征。对聚合物的组成、不同ＴＤＩ类型及络合盐浓度对聚合物力学性能及其络合物电导率的影响进行了探讨。低度交联聚合物的络合物，其电导率与温度的关系符合建立在自由体积理论上的ＶＴＦ方程，表明络合物中离子的传导主要是在无定形区域进行，与自由体积有关。     

LXT384接口芯片的几种环回形式

LXT384是一个用于SONET/SDH设备的八进制T1/E1/J1线路接口单元芯片。文中简述了该芯片在实际应用中进行自检的若干种不同的环回形式(包括：模拟环回、数字环回、运程环回等)，直观地指出了各种环回形式的特点和区别。