电子产品研制阶段可靠性增长试验研究

结合工程实际经验,深入讨论了可靠性增长过程及实现途径,在保持试验条件和改进过程不变的条件下,实施了对具体型号电子产品的可靠性增长试验,达到了预期的可靠性增长目标,并且利用可靠性增长试验的数学模型(AMSAA模型)来评估产品的可靠性增长,对开展可靠性增长与可靠性增长试验工作具有重要的实际意义.     

微流控分析芯片制作中的低温键合技术

微流控分析芯片制作方法的研究是微流控分析的基础。制作性能良好的微流控分析芯片时,基片与盖片的键合技术十分重要。本文针对近年来发展迅速的低温键合技术,对各种方法进行了评价,并对其发展前景进行了展望。     

小井距开发现河油田低渗油藏可行性研究

认为注采井网井距大,水驱控制程度差,采收率偏低是影响胜利油田现河低渗透油藏开发的关键,通过井间密度与水驱控制程度和采收率的关系等分析,提出了现河低渗透油藏开发的合理的井网密度。     

堆石料与基岩面直剪试验

介绍了堆石料与基岩面的现场直剪试验方法，6个组次的直剪试验结果表明，堆石料与基岩面的抗剪强度指标随基岩面坚硬度的增大而增加，并随基岩面粗糙度的加大而加大。     

应用TEXTIO和MATLAB进行复杂数字系统仿真

在基于FPGA的复杂数字系统的仿真测试中,设计者常常面临各种挑战.以数字图像处理系统的仿真为例,如果采用完备性仿真测试方法,那么测试矢量的数量将是非常巨大的;如果采用常规方法,不仅效率不高,而且可能无法达到仿真测试的目的.针对这个难题,提出一种进行仿真测试的新方法,该方法应用TEXTIO和MATLAB来辅助仿真测试过程,使问题得到较好的解决.以电视图像实时多目标捕获单元的仿真测试为例,全面、细致地讨论这种新方法.     

玻璃纤维布内中空纤维丝的检测

介绍了玻璃纤维布内中空纤维丝的检测方法。     

基于Agilent-VEE平台的测试系统设计与应用

美国安捷伦公司(原惠普公司)的Agilent-VEE，NI公司的Lab VIEW和Lab Windows／CVI开发软件等是国际上公认的优秀的虚拟仪器开发平台软件，人们对以应用后两者开发测试系统比较了解，但对VEE在测试系统中的应用少有介绍。本文介绍基于Agilent-VEE平台和GPIB总线的实用测试系统的组成、特点及仪器控制方式。     

Optimization of Selective Epitaxial Growth of Silicon in LPCVD

Selective epitaxial growth (SEG) of silicon has attracted considerable attention for its good electrical properties and advantages in building microstructures in high‐density devices. However, SEG problems, such as an unclear process window, selectivity loss, and nonuniformity have often made application difficult. In our study, we derived processing diagrams for SEG from thermodynamics on gas‐phase reactions so that we could predict the SEG process zone for low pressure chemical vapor deposition. In addition, with the help of both the concept of the effective supersaturation ratio and three kinds of E‐beam patterns, we evaluated and controlled selectivity loss and nonuniformity in SEG, which is affected by the loading effect. To optimize the SEG process, we propose two practical methods: One deals with cleaning the wafer, and the other involves inserting dummy active patterns into the wide insulator to prevent the silicon from nucleating.     

Micro assembly injection moulding

Injection moulding is established as one of the most common manufacturing processes of thermoplastics due to its high degree of automation and the short cycle times. Micro injection moulding is a rapidly growing technology that allows for the efficient production of very complex micro parts in high series. The “Market Analysis for Microsystems II 2002–2005” of the Nexus Task Force anticipates a yearly growth in the field of micro system technology of about 20% (Wechsung et al. 2002). This study identifies in addition to the continuous miniaturization the growing use of polymers in micro systems (Schneider et al. 2001). No other material group offers this wide range of material properties and permits to choose processing parameters and application properties according to necessities (Gächter 2000). While the production processes of micro technical components are mainly controllable, the assembly of these components to hybrid micro systems is a bottleneck to the industrial large scale production. The assembly itself represents a large fraction of the added product value and gains in importance with growing complexity and miniaturization of the systems.