网卡绑定技术在音频工作站网络中的应用

本文介绍了网卡绑定技术在音频工作站网络中的应用和实施,解决了网络存在的现实问题,给进一步完善安全播出提供了新途径。     

退火温度对Ag/Cu层复合板分离强度的作用

对轧制复合的Ag Cu双金属薄板采用不同温度的退火处理 ,研究了结合面分离强度随退火温度变化的规律 ,讨论了影响分离强度的因素。结果表明 ,在 40 0℃以下随退火温度的升高 ,由于原子扩散及再结晶晶界的形成趋于充分而导致分离强度升高 ,40 0℃时分离强度达到最大值。当退火温度超过 40 0℃后 ,由于结合面的异类原子不等量对流而导致结合面形成空洞 ,从而使分离强度下降。 750℃退火时分离强度达到最低值。退火温度进一步上升到 80 0℃时可使结合面发生局部熔合 ,使分离强度又有小幅度回升     

Selective oxidation of Fe-30Ni alloy in a low-temperature range (433–473 K)

Fe-30Ni alloy specimens were oxidized for 10–240 min at 433–473 K in pure oxygen at a pressure of 1.33×10⁴ Pa. The thickness of oxide films was measured by a multiple-angle-of-incidence ellipsometer. The kinetics of film growth were found to obey a parabolic rate law. The depth-profiling of oxidized surfaces, performed with simultaneous use of Auger electron spectroscopy (AES) and argon-ion sputter-etching technique, reveals that iron component is selectively oxidized and an iron-depeletion zone is formed in the underlying alloy. The thickness of the iron depletion zone increases with increasing oxidation time or oxidation temperature. During surface oxidation of the alloy, the transport rate of iron component in the film is almost equal to the interdiffusion rate in the underlying alloy, indicating the establishment of a steady state. The values of the interdiffusion coefficient, , of the underlying alloy estimated from the depth-composition profiles are more than 10 orders of magnitude as large as the values extrapolated from the lattice diffusion data of the corresponding alloy obtained at high temperature. The enormously large values of may be explained in terms of the vacancy (monovacancy or divacancy)-enhanced lattice diffusion mechanism.     

高效焊管新工艺——金属管液相扩散焊

采用镍基非晶态箔带作中间层,在加压情况下(约几MPa)使之熔化、保温,进行了钢管瞬间液相 (TLP)扩散焊试验。结果表明,可以获得无夹杂的致密界面;接头过渡区的最终厚度显著变薄;焊后中间层主组元由焊前的Ni变为Fe;容易获得性能合格接头。值得指出的是,焊接时间约为3min,远低于手弧焊所需时间。     

Joining of metal bars by a new process of transformation-diffusion brazing

Within the bonded interface of metal bars joint produced by conventional solid state bonding process （ such as flash welding, resistance butt welding, friction welding and so on）, the inclusions are often present, which degrade the ductility of joint. A new process of transformation-diffusion brazing is proposed, in which an amorphous foil containing melting point depressant is preplaced between the interfaces to be joined, and the assembly is repeatedly heated/cooled without holding time at peak temperature. A low carbon steel bars, BNi-2 amorphous foil and resistance butt welding machine were used. The results show that surfuce contamination can be disrupted by the dissolution of base metal into molten interlayer in comparison with conventional process, and the ductility of joint can be improved by increasing the times of temperature cycles on line. In addition, transformation-diffusion brazing can be done with relatively simple and inexpensive system in comparison with transient liquid phase bonding.     

陶瓷/金属钎焊与扩散连接的研究现状

工程陶瓷由于具有优异的综合性能,在许多领域得到广泛应用,但其加工性能差,通常需要与金属组成复合结构.实现陶瓷与金属之间的可靠连接是推进陶瓷材料应用的关键,钎焊和扩散连接被认为是陶瓷/金属连接中较为适合的方法.文中对近年来国内外陶瓷/金属钎焊和扩散连接技术领域的研究现状进行了综述,认为活性金属钎焊和部分瞬间液相连接发展比较成熟,部分瞬间液相连接充分结合了活性钎焊和固相扩散连接两者的优点,将成为未来陶瓷/金属连接的发展方向.     

MGH956合金TLP连接机理及接头组织分析

MGH956合金是采用机械合金化方法制造的氧化物弥散强化高温合金，具有高温力学性能好、高温抗氧化和抗腐蚀性能好的综合优势。自行研制了中间层合金KCol进行MGH956合金过渡液相(TLP)扩散连接试验，分析了接头组织、成分和连接工艺的关系，确定了MGH956合金TLP扩散连接机理。同时，对MGH956合金焊接接头中产生的夹渣缺陷进行了深入的分析。结果表明：在连接温度1240℃、保温8h条件下，可以获得焊接缺陷少、完整连续的焊接接头。     

不锈钢复合板热疲劳性能分析

利用冷热疲劳试验机模拟分析了冷热循环对不锈钢复合板热疲劳性能的影响,并采用扫描电镜、电子探针和电子背散射衍射仪对热疲劳试样V形缺口及裂纹区域的形貌和成分进行了深入分析。结果表明,不锈钢复合板热疲劳试样经 20~550 ℃ 7 500次冷热循环后,结合界面处V形缺口区出现微裂纹,且微裂纹起裂于V形缺口尖端基层侧。随着冷热循环的继续进行,微裂纹向基层内扩展,但并非沿着结合界面处扩展,而是沿着基层侧扩展。此外,热疲劳裂纹的起裂和扩展与氧化和应力作用有关,微裂纹起裂于热疲劳试样 V 形缺口区域基层侧表层局部氧化孔洞,并在冷热循环的应力作用下向基层内扩展,同时加剧氧化。随着冷热循环的继续进行,晶界氧化逐渐加剧,导致微裂纹扩展成更为明显的裂纹。     

镁合金与钛合金的瞬间液相扩散焊

为实现镁合金AZ31B与钛合金Ti6A14V的可靠连接，研究了两者以Al为中间层的瞬间液相扩散焊接头的微观结构与连接强度。研究结果表明：当焊接时间为180min时，焊接温度是影响界面反应热力学与动力学的主要参数，其对接头的微观组织、接头界面新生相构成与连接强度有重要影响。保温温度低于450℃时，AZ3IB／AI界面无液相产生，无法实现AZ31B与Ti6A14V的可靠连接；保温温度在450℃～480℃变化时，温度对AZ31B／Al／Ti6A14V界面反应的动力学因素有明显影响，且直接决定了焊后接头新生相的构成与分布。470℃保温180min的接头剪切强度较高（72．4MPa），达到AZ31B母材（86MPa）的84．2％。     

Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds

Copper wire, serving as a cost-saving alternative to gold wire, has been used in many high-end thermosonic ball bonding applications. In this paper, the bond shear force, bond shear strength, and the ball bond diameter are adopted to evaluate the bonding quality. It is concluded that the ef/~cient ultrasonic power is needed to soften the ball to form the copper bonds with high bonding strength. However, excessive ultrasonic power would serve as a fatigue loading to weaken the bonding. Excessive or less bonding force would cause cratering in the silicon.