Indoline-based donor molecule for efficient co-evaporated organic photovoltaics

We demonstrated the use of an asymmetrical donor–acceptor-type indoline dye—D131, developed for dye-sensitized solar cells, as an electron donor and fullerene C₇₀ as an electron acceptor for thermal co-evaporated bulk-heterojunction organic solar cells (OSCs). In spite of the presence of intermolecular hydrogen bonds among D131 molecules, they can be thermally evaporated in high vacuum at a relatively low temperature of 220 °C. The blend ratio and thickness of the active layer of D131/C₇₀ blend films in OSCs were optimized to achieve a maximum power-conversion efficiency of 4.5% with a short-circuit current of 9.1 mA cm^?2, an open-circuit voltage of 0.89 V, and a fill factor of 0.56 under AM 1.5G solar illumination (100 mW cm^?2), which is the best value reported so far for OSCs based on indoline-based donor materials.     

MEMS封装技术及设备

概述了进入后摩尔时代的MEMS技术,通过TSV技术整合MEMS与CMOS制程,使得半导体与MEMS产业的发展由于技术的整合而出现新的商机。主要介绍了MEMS器件封装所面临的挑战及相应的封装设备。     

In-situ cleaning and passivation of oxidized Cu surfaces by alkanethiols and its application to wire bonding

The treatment of oxidized Cu surfaces using an alkanethiol as a reducing agent has been investigated. Exposure to a dilute solution of 1-decanethiol resulted in the complete removal and/or conversion of CuO and subsequent formation of a passivating thiolate film, a so-called self-assembled monolayer (SAM), on the underlying Cu/Cu₂O surface as evidenced by x-ray photoelectron spectroscopy (XPS) analysis. Morphological changes, monitored by scanning electron microscopy (SEM) and atomic force microscopy (AFM), revealed transformation of the rough, porous CuO layer into a comparatively smooth Cu/Cu₂O surface. Experiments performed on integrated circuit back-end-of-line (BEOL) die structures, comprising Cu/SiO₂ bond pads used as substrates for Cu wire bonding, demonstrate the potential application of a thiol-based in-situ cleaning-passivation procedure in microelectronics.     

飞机复合材料搭接结构导电性研究

分析了复合材料的组成、导电特性,以及与复合材料导电性相关的因素.介绍了航空设备中部分复合材料结构件的装配工艺方法,描述了这种方法可能对其电性能和EMC性能的影响,并结合试验结果给出了工艺指导意见.     

浅谈带散热片产品的封装

带散热片封装的产品主要是功率器件,其产品在使用过程中会产生热能,主要借助散热片来释放,其产生的热能对散热片上的焊线质量提出了更大的挑战。带散热片封装的集成电路分为两种,一种是散热片上打线的集成电路,一种是散热片不打线的集成电路。本文主要讨论了对散热片打线集成电路的散热和工艺方面的改进。     

分立IGBT的封装技术研究

文章通过对单器件的分立IGBT的封装结构进行分析,针对其结构特点和封装技术要求,特别是封装关键工艺芯片切割的影响,对装片、焊接方面进行工艺研究。并通过试验分析解决实际生产所出现的技术问题,由此形成一套适应于大批量封装生产的IGBT封装工艺技术,成功地应用于分立IGBT器件的批量生产,保证了产品的可靠性,取得了很好的生产效益。     

表面特性对PBGA软金丝键合点可焊性的影响

一级封装中最流行的互连技术仍为丝焊。引线键合的效率主要依赖于受表面特性影响的键合点的可焊性。在最近的研究中,我们调查了表面特性对金-金超声压焊系统的影响。表面特性包括金层厚度,表面硬度和粗糙度、有机物杂质及金属杂质。对两个样本间的不同特性进行比较。确定金表面特性的粗糙度依赖于镍层的外形结构。焊料掩膜逸出气体对可焊性具有负面影响,等离子清洗能够有效地去除有机物杂质。金层中的杂质将导致不良的可焊性。     

Brine Refrigerants for Low-cost,Safe Aqueous Supercapacitors with Ultra-long Stable Operation at Low Temperatures

Traditional aqueous energy storage devices are difficult to operate at low temperatures owing to the poor ionic conductivity and sluggish interfacial dynamics in frozen electrolytes. Herein, the low-cost brine refrigerants for food freezing and preservation as electrolytes, and unexpectedly realize high ionic conductivity and stable operation of an aqueous storage device at low temperatures are demonstrated. A CaCl₂ brine refrigerant electrolyte (BRE) with a low freezing point −55 °C and high ionic conductivity (10.1 mS cm⁻¹ at −50 °C) is developed for supercapacitors (SCs), which retains 80% of the room temperature capacity at −50 °C and exhibits ultra-long cycle life with excellent capacity retention of 92% over 98,500 cycles, outperforming the other SCs which can be operated below −40 °C in literature. Moreover, the SCs with MgCl₂ and NaCl BREs can also be operated successfully with excellent cycle stability and high-capacity retention at low temperatures of −30 and −20 °C, respectively. Fundamental correlation between various cations and their effect on the freezing point reduction of aqueous electrolytes is revealed via Raman investigation and molecular dynamics simulations. This study provides a rational design strategy for green, inexpensive, and safe low-temperature aqueous electrolytes for energy storage devices.     

金属键合技术及其在光电器件中的应用

系统阐述了金属键合的发展概况、基本工艺和方法、表征技术及其在光电器件中的应用.金属键合制备光电器件的一般工艺流程分为三步:蒸镀金属薄膜、键合、腐蚀去除衬底,列举了常用的金属键合方法及其工艺条件;并着重论述了该技术在光电器件特别是垂直腔面发射激光器(VCSEL)器件结构制作中的应用.金属键合可以实现衬底倒扣和改善器件热学性能,而对器件原有的光学性质影响不大.     

一种用于扩散连接的金浆料

研制了一种用于扩散连接的金浆料。这种浆料主要由金粉和有机载体组成。浆料的烧成特性和粘度对扩散连接强度影响较大。金粉的分散性、表面形态和颗粒尺寸会影响浆料的烧成特性和粘度。载体会影响浆料的粘度。金浆料中掺入片状金颗粒能改善扩散连接强度