长垣东部深井井壁失稳及技术对策

大庆油田在长垣东部深层油气田勘探开发过程中存在井眼不稳定问题。在对深层失稳井段资料调研的基础上，开展了易塌地层泥页岩水化膨胀及分散特性评价以及比亲水量研究。通过泥页岩--试液模拟作用的化学位差反渗透实验以及压力传递实验等，探讨了不同条件下泥页岩水化应力变化规律。利用井壁稳定性模拟实验装置（SHM仪），评价了不同钻井液防塌效果。理论分析和实验表明，当使用水基钻井液在复杂泥页岩地层钻进时，如何控制泥页岩压力传递和流体侵入是解决泥页岩井壁不稳的技术关键。使用长垣东部深层泥页岩与硅酸盐钻井液作用的实验表明，硅酸盐钻井液能显著降低泥岩渗透率，阻止钻井液滤液与孔隙压力的传递，改善膜效率，有助于充分发挥化学位差诱导的反渗透防塌作用效果。     

Microstructure and thermal behavior of Sn-Zn-Ag solders

The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis results indicate that Ag₅Zn₈ and AgZn₃ become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0% to 3.0%     

Synthesis and characterization of novel diimide–dinaphthols and resulting poly(urethane–imide)s

Novel diols containing imide groups were prepared via condensation of aromatic dianhydrides with 5‐amino‐1‐naphthol. The diimide–dinaphthols prepared were characterized by conventional methods and used to synthesize new poly(urethane–imide)s (PUIs). All the polymers were characterized and their physical properties, such as solubility, solution viscosity, thermal stability, and thermal behaviour were studied. The polymers obtained showed more thermal stability than typical polyurethanes because of the presence of the imide groups. Copyright © 2003 Society of Chemical Industry     

On connections between 3-d microstructures and their 2-d images

The problem of recovery of three-dimensional microstructural parameters from two-dimensional images is addressed in its inverse form. Three-dimensional inhomogeneous solids with known microstructures are generated virtually and images of their cross-sections are analyzed. Three different types of randomly oriented microcracks and microcracks having preferential orientation with some scatter. Somewhat unexpected result is that, in all the cases considered, three-dimensional defect densities are very close to average values of corresponding two-dimensional parameters.     

Conducting composites of polythiophene and polyfuran with acetylene black

Conducting composites of polythiophene (PTP) and polyfuran (PF) with acetylene black (AB) were prepared via chemical oxidative polymerization of thiophene and furan in a suspension of AB in CHCl₃ at room temperature using anhydrous FeCl₃ as the oxidant. Formation of PTP and PF and their subsequent incorporation in PTP–AB and PF–AB composite systems were confirmed by FTIR analysis. Scanning electron microscope analysis showed the presence of compact clusters of particles in both composites. Transmission electron micrographs of PTP–AB and PF–AB composites showed formation of globular polymer encapsulated AB particles with average diameters of the order of ～100 nm in both systems. Thermogravimetric analysis revealed that the overall thermal stability varied in the order: AB > PTP–AB > PTP and AB > PF–AB > PF. DC conductivity values for the PTP–AB and PF–AB composites were of the order of 10^?2 and 10^?3 S cm^?1, respectively. Copyright © 2004 Society of Chemical Industry     

Dental amalgam – the effect of the technology of alloy powder preparation on the corrosion behaviour and the release of mercury

Dental amalgams are based on a broad spectrum of materials differing in their chemical composition, metallurgical treatment, and in the way the initial alloys powders are prepared. In addition to their chemical composition, amalgams based on various powders differ in both their microstructure and the amount of mercury needed for preparation. All these facts may affect electrochemical processes occurring during their interaction with oral fluids, and also mercury release. While verifying the effect of the technology used for the preparation of the high‐copper ternary alloy powder on the properties of resulting amalgams, this study aimed at the mechanism of their interaction with a model saliva solution as well as mercury release was included. Measurements were done in a model saliva solution using standard electrochemical methods and exposition measurements. The interaction of individual types of amalgams with artificial saliva did not reveal any significant differences. The free corrosion potential of all these amalgams in an aerated solution settled in the range of values in which tin oxidation, resulting in a layer of insoluble corrosion producsts, turned out to be the dominant anodic process. The rate of mercury release was the lowest for amalgams based on a gas‐atomized alloy. The highest rate of mercury release, and also its dependence on time, was exhibited by lathe‐cut powder based amalgam. In addition to different volume fraction of the Ag‐Hg phase and the level of its tin alloying, this different behaviour may be explained by differences in the rate at which a layer of tin corrosion products acting as a barrier to mercury release is formed.     

Effect of Processing Temperature on the Morphology of Silicon Carbide Whiskers

Two kinds of SiC whiskers were annealed at temperatures similar to those for the processing of ceramic matrix composites. The morphology and structure of the as-received and postannealed whiskers were investigated by SEM, TEM, and XRD, and the influence of processing temperature on the mechanical properties of ceramic matrix composites was discussed.     

Emulsifying Capacity and Emulsion Stability of Soy Proteins Compared with Corn Germ Protein Flour

Both emulsifying capacity (EC) and emulsion stability (ES) increased with increasing concentrations from 0.4% to 0.8% of soy flour (SF), soy concentrate (SC), soy isolate (SI) and corn germ protein flour (CGPF) when studied by response surface methodology. EC and ES increased as pH increased from 6 to 8 in all samples. Increasing incubation temperatures of protein solutions from 20–70°C or from 4–20°C did not affect EC or ES, respectively. SF had the highest EC, followd by SI, SC, and CGPF.     

Adhesive Dispensing Process Analysis: Steady-State Dispensing of One-Component Adhesives

The process of dispensing one-component heat-cure adhesives was investigated in order to understand current application processes and to guide new process development. Typical one-component adhesives exhibit non-Newtonian rheological behavior, and hence Newtonian fluid mechanics does not adequately describe the dispensing process. In the present study, the adhesives were modeled as Bingham fluids possessing a yield stress and a steady state viscosity. The model of the dispensing apparatus includes four major flow sections connected in a serial configuration. The fluid mechanics equations derived for Bingham fluids in the individual flow sections were solved by numerical methods in order to understand the interrelationships between the material variables (e.g. yield stress, viscosity, temperature dependencies) and process variables (e.g. pressure, flow geometry, temperature, output). The concept of the model is generic and the details of the model can be modified for any forced-flow adhesive application process.

The adhesive flow properties significantly influence the process output. Dispensing temperature, among the process variables, has the strongest effect on process output. A ± 1.0·C perturbation in the dispensing temperature can cause as much as a 14% variation in the bead size for the range of adhesives studied. Differences in flow characteristics result in differences in processability and non-linear temperature/pressure sensitivity. The non-linear sensitivity can be eliminated by operating the dispensing process isothermally. Finally, the process limits for one-component adhesives, which are susceptible to chemical instability induced by viscous heating during processing, are defined and discussed in terms of a modified Brinkman number that takes into account viscous dissipation, heat conduction and convection, and chemical stability of the material during processing.