纳米MOS器件中的超浅结和相关离子掺杂新技术的发展

MOS器件特征尺寸进入纳米领域时如何形成超浅结是一个重要的挑战。文中讨论了纳米 MOS器件对超浅结离子束掺杂技术的特殊要求以及发展超浅结的主要途径 ,介绍了目前超浅结离子掺杂新技术的最新发展 ,并对其前景进行了展望。     

纳米电子束曝光

JEOL JBX- 5 0 0 0 L S是矢量扫描的电子束曝光机 .系统采用 L a B6 灯丝 ,可以工作在 2 5 k V和 5 0 k V的加速电压下 .对该系统的分辨率、稳定性、场拼接和套刻精度进行了系列研究 ,得到了分辨率为 30 nm的图形 ,图形的套刻精度也优于 4 0 nm.     

Measurement of the Waveguide Near—field Optical Spot

The characteristic of near-field spots is analyzed.The size of the near field and the heat response time of the hybrid record medium to overcome super paramagnetic effect are calculated based on the heat transfer theory.A novel measuring method for the diameter of near-field recording spot is also presented.Since the grain of the recording media is tiny enough,near-field optical lithography can be accomplished with the aid of atomic force microscope(AFM).The diameter of near-field recording sopt can be obtained by specifically designed computer.So the relationship between the near-field recording spot diameter and the probe size of near-field recording system,the near field recording distance coupling between head and disc can be got.     

X射线光刻掩模后烘过程的瞬态热分析

X射线光刻掩模是下一代光刻技术(NGL)中的X射线光刻技术的关键技术难点。在电子束直写后的掩模后烘过程中，掩模表面的温度场分布及温升的均匀性是影响掩模关键尺寸(CD)控制的重要因素，如果控制不当，会造成掩模表面的光刻胶烘烤不均匀，使掩模吸收体CD分布变坏。针对电子束直写后X射线光刻掩模的后烘过程建立了热模型，并采用有限元技术进行了瞬态温度场的计算。计算结果表明：采用背面后烘方式，在达到稳态时出现高温区和低温区，最大温差为10.19℃，容易造成光刻胶局部烘烤过度，而采用正面后烘方式，掩模达到稳态的时间短，温度分布均匀，烘烤效果好。     

全息片质量对原子全息光刻图形影响的模拟研究

全息片质量是影响原子全息光刻再现图形质量的关键因素，然而其制作工艺复杂，工序繁多，质量难以控制，模拟研究有助于把握全息片制作工艺中的关键环节，提高全息片的质量。详细模拟了全息片的三个主要质量指标：刻透率、分辨力以及薄膜厚度对再现像质的影响，结果表明：刻透率控制在90％左右即可满足要求，分辨率应优于0．1μm，膜层应尽量均匀。     

光学和电子束曝光系统之间的匹配与混合光刻技术

介绍如何实现光学和电子束曝光系统之间的匹配和混合光刻的技术，包括：(1）光学曝光系统与电子束曝光系统的匹配技术；(2）投影光刻和JBX-5000LS混合曝光技术；(3）接触式光刻机和JBX-5000LS混合曝光技术；(4）大小束流混合曝光技术或大小光阑混合曝光技术；(5）电子束与光学曝光系统混合光刻对准标记制作技术. 该技术已成功地应用于纳米器件和集成电路的研制工作，实现了20nm线条曝光，研制成功了27nm CMOS器件；进行了50nm单电子器件的演试；并广泛地用于100nm化合物器件和其他微/纳米结构的制造.     

深亚微米光学光刻设备制造技术

相对于其它“后光学”光刻技术 ,在 0 1 3μm甚至 0 1 3μm以下集成电路制造水平上 ,光学光刻仍然具有强大的吸引力。随着光学光刻极限分辨率的不断提高 ,当代光学光刻设备正面临着越来越严重的挑战。论述了深亚微米光学光刻设备的技术指标和面临的技术困难 ,对其中一些关键的技术解决方案进行了分析。     

Flexible thin-film transistors using multistep UV nanoimprint lithography

A multistep imprinting process is presented for the fabrication of a bottom-contact, bottom-gate thin-film transistor (TFT) on poly(ethylene naphthalate) (PEN) foil by patterning all layers of the metal–insulator–metal stack by UV nanoimprint lithography (UV NIL). The flexible TFTs were fabricated on a planarization layer, patterned in a novel way by UV NIL, on a foil reversibly glued to a Si carrier. This planarization step enhances the dimensional stability and flatness of the foil and thus results in a thinner and more homogeneous residual layer. The fabricated TFTs have been electrically characterized as demonstrators of the here developed fully UV NIL-based patterning process on PEN foil, and compared to TFTs made on Si with the same process. TFTs with channel lengths from 5 μm down to 250 nm have been fabricated on Si and PEN foil, showing channel length-dependent charge carrier mobilities, μ, in the range of 0.06–0.92 cm² V⁻¹ s⁻¹ on Si and of 0.16–0.56 cm² V⁻¹ s⁻¹ on PEN foil.     

Multicomponent Physical Vapor Deposited Films with Homogeneous Molecular Material Distribution Featuring Improved Resist Sensitivity

Each film preparation technique affects the physical properties of the resulting coating and thus defines its applicability in modern device construction. In this context solvent based spin coated and solvent‐free physical vapor deposited molecular glass photoresist films are systematically investigated for their dissolution behavior, sensitivity, and overall lithographic performance. These investigations demonstrate that the solvent‐free physical vapor deposition leads to a marked increase in sensitivity. This could be explained by the individual molecule by molecule deposition step producing a more homogeneous distribution of the multicomponent resist system, especially the photoacid generator. In addition, this assumption is supported by former published simulations focusing on aggregate formation within thin films. This work demonstrates that the lithographic sensitivity of multicomponent resist system is an intrinsic parameter to investigate molecular material distribution and indicates that the applied film preparation technique is crucial for the corresponding performance and applicability.     

Distributed feedback quantum cascade lasers operating in continuous-wave mode at λ≈7.6μm

正Distributed feedback(DFB) quantum cascade lasers(QCLs) in continuous-wave(CW) mode emitting atλ≈7.6μm are presented.Holographic lithography was used to fabricate the first-order distributed feedback grating. For a high-reflectivity-coated QCL with 14.5-μm-wide and 3-mm-long cavity,CW output powers of 300 mW at 85 K and still 10 mW at 270 K are obtained.Single-mode emission with a side-mode suppression ratio(SMSR) of about 30 dB and a wide tuning range of ~300 nm in the temperature range from 85 to 280 K is observed.