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111.
为精确控制超光滑表面抛光过程中抛光液的温度,根据温控基本原理设计温控装置结构.将用UG建立的温控装置模型导入GAMBIT中进行温度场分析.针对装置内部温度分布不均匀问题,对其结构进行优化:在装置内加入导热隔板将其分为工作区和调温区,制冷器被置于调温区内;将温控装置的外形结构加入过渡圆角.结果表明:优化后的温控装置形成内外环流,工作区温度波动范围为±0.01℃,温度分布均匀对称,满足高精度温控的恒温和匀温要求.  相似文献   
112.
In this paper,adaptive dynamic surface control(DSC) is developed for a class of nonlinear systems with unknown discrete and distributed time-varying delays and unknown dead-zone.Fuzzy logic systems are used to approximate the unknown nonlinear functions.Then,by combining the backstepping technique and the appropriate Lyapunov-Krasovskii functionals with the dynamic surface control approach,the adaptive fuzzy tracking controller is designed.Our development is able to eliminate the problem of "explosion of complexity" inherent in the existing backstepping-based methods.The main advantages of our approach include:1) for the n-th-order nonlinear systems,only one parameter needs to be adjusted online in the controller design procedure,which reduces the computation burden greatly.Moreover,the input of the dead-zone with only one adjusted parameter is much simpler than the ones in the existing results;2) the proposed control scheme does not need to know the time delays and their upper bounds.It is proven that the proposed design method is able to guarantee that all the signals in the closed-loop system are bounded and the tracking error is smaller than a prescribed error bound,Finally,simulation results demonstrate the effectiveness of the proposed approach.  相似文献   
113.
It has been suggested by Kayser that finite-size effects associated with capillary waves might play a significant role in some surface tension measurements; for capillary rise between plates a distance D apart, an effect varying as 1/D and apparently observable in measurements, was proposed. In reconsidering this problem, one must analyze the thermodynamics of finite-size corrections to surface tension. In particular, one sees that capillary rise between plates does not measure the interfacial free energy density but, rather, a derivative of the interfacial free energy with respect to a system dimension. The quantity needed to draw definite conclusions, the finite-size residual free energy, can be calculated within the harmonic or Gaussian capillary wave model in d spatial dimensions with the aid of Poisson summation techniques and should yield the correct leading asymptotic behavior. For d=3 and experimentally relevant parameter values, the results are independent of the short-wavelength cutoff needed in the model and can be checked against the theory of conformai covariance at two-dimensional critical points. It is found that the finite-size effects in capillary-rise measurements of surface tension vary as 1/D 2 (with a universal coefficient) but are too small to be seen in current experiments.Invited paper presented at the Tenth Symposium on Thermophysical Properties, June 20–23, 1988, Gaithersburg, Maryland, U.S.A.  相似文献   
114.
A three-parameter generalized equation is proposed for surface tension from the triple point to the critical point. This equation not only fits the data well but also is good for interpolation between the normal boiling point and the critical point. This equation is also good for extrapolation to the triple point. This equation has been tested using the surface tension of water from the triple point to the critical point. The constants of this equation obtained using orthobaric surface tensions are given for a number of compounds. The isobaric surface tensions determined at a pressure of 1 atm do not differ significantly from the orthobaric surface tensions. Such data also have been used in obtaining equations from the triple to the critical point.Nomenclature T c Critical temperature, K - T t Triple point, K - T m Melting point, K - T r Reduced temperature, K - X (T c-T)/T c - Surface tension, dyne · cm–1;10–3N · m–1 - m Surface tension at the melting point - f Surface tension at T r=0.9 - t Surface tension at the triple point - Relative deviation 100[ obsd calcd]/ obsd - Standard deviation [( obsd calcd)2/(No. points—No. parameters)]0.5  相似文献   
115.
A liquid-vapor interface in thermal equilibrium was considered, where the pressure tensor depends upon the density (z) and the position z. The surface tension coefficient results are parametrized with the bulk compressibility, liquid-vapor density difference, and interfacial width along the saturation curve. Previous results at the triple and critical points reported by other investigators are verified. Also included is a plot of the computed results using the parametric equation and experimental data for different substances.  相似文献   
116.
A method capable of estimating the hydrograph from a prescribed storm for a practical mild slope upstream catchment is proposed. This method makes use of two new characteristic parameters, andS, in conjunction with the kinematic wave equation to compute lateral inflows of the main stream of the catchment. The depth profile of overland flow at any instant within the catchment and hydrograph at any location can be easily found. Lag times for individual lateral inflows are then considered and are linearly combined to obtain the hydrograph at the outlet of the catchment or depth profile of the main stream at any instant. The validity of the excess rainfall-surface runoff linear relationship in this study has also been verified with Tatsunokuchiyama catchment, and it shows good results for this computed runoff.  相似文献   
117.
Thermophysical properties of molten semiconductors are reviewed. Published data for viscosity, thermal conductivity, surface tension, and other properties are presented. Several measurement methods often used for molten semiconductors are described. Recommended values of thermophysical properties are tabulated for Si, Ge, GaAs, InP, InSb, GaSb, and other compounds. This review shows that further measurements of thermophysical properties of GaAs and InP in the molten state are required. It is also indicated that a very limited amount of data on emissivity is available. Space experiments relating to thermophysical property measurements are described briefly.Nomenclature Density - C p Specific heat - Kinematic viscosity - Dynamic viscosity= - Thermal diffusivity - Thermal conductivity=Cp - Volumetric thermal expansion coefficient - Surface tension - d/dT Temperature coefficient of surface tension - g Gravitational acceleration - T Temperature - T Temperature difference - L Characteristic dimension  相似文献   
118.
We used a dielectric resonator technique for highly sensitive measurements of the temperature dependence of the microwave surface resistanceR s of 1×1 cm2 superconducting films at 18.7 GHz. It consists of a sapphire disc positioned on the film under investigation within a copper cavity which is acting as a radiation shield. In the TE01 oscillation mode the highly reproducible quality factor of about 105 results in a sensitivity of ±50 forR s measurements. The temperature dependence ofR s can be measured up to values as high as 1 . We have investigated several YBa2Cu3O7 thin films prepared by high oxygen pressure d.c. sputtering on LaAlO3 and NdGaO3. Our best films exhibit a pronounced nonlinear behavior of the d.c. resistivity(T) with(300K)/(100K) values of about 3.7. Those films show, besides the initial fall-off just belowT c , a further strong decrease ofR s at low temperatures. This was observed both at 18.7 GHz and 87 GHz, as measured by a conventional cavity end plate replacement technique. ForTTc/2 these films exhibit an exp (–T c/T) dependence ofR s with-values around 0.4. These observations may be explained by a superconducting energy gap with 2/kT c0.8 for charge carriers localized in the CuO chains for YBa2Cu3O7.  相似文献   
119.
文章从表面贴装技术(SMT)现状及特点开始,介绍多品种小批量电子产品中使用表面贴装技术存在的问题。针对这一情况对表面贴装过程仿真系统的需求进行了分析,并详细论述了仿真系统的文件预处理、仿真以及数据库维护三大主要模块设计,主要介绍采用OpenGL实现仿真模块的方法,同时展示仿真系统实现结果。最后总结了仿真系统的特点。  相似文献   
120.
The knowledge of the thermal accommodation coefficient for gases on well-controlled surfaces as a function of temperature is imperative to understanding the mechanism of interphase heat transfer on the microscopic level. With this goal in view, a heat transfer column instrument is designed, fabricated, assembled, and tested for the specific case a argon—tungsten system. With 99.9999%, pure argon, six sets of data are taken in the rarefied gas region in the maximum temperature range of 500–1500 K. Four sets of these measurements are in the temperature-jump region and are analyzed by the constant-power method to compute the thermal accommodation coefficient of argon on a controlled tungsten surface. The other two sets are taken under free-molecular flow conditions and are interpreted in accordance with the man-free-path kinetic theory for the low-pressure regime. These data are compared and discussed in the context of reported data in the literature and interpreted in the light of the surface condition and finish of the tungsten wire.Nomenclature A area of the solid surface - C j constants in Eq. (3); j=0, 1, 2, 3, and 4 - E i incident energy flux - E r reflected energy flux - E s reflected energy flux when the interaction between the gas and the solid atoms is complete - g temperature-jump distance - L half-length of the metal wire - M molecular weight of the gas - P gas pressure - Q H total thermal energy conducted by the gas per unit time from the hot surface - QKT total thermal energy conducted by the gas per unit time if the striking gas molecules were to attain thermal equilibrium with the hot surface - R molar gas constant - r radial coordinate - r f radius of the hot wire - S sticking coefficient - So initial sticking coefficient - T temperature - T e linearly extrapolated gas temperature on the hot-wire surface - T g temperature of the impinging gas molecules - T H temperature of the hot surface - T i temperature of the incident gas stream - T r temperature of the gas molecules receding after collision with the solid surface - T s temperature of the solid surface Greek Symbols thermal accommodation coefficient for the gas—solid surface - resistivity of the metal wire - gas coverage on the solid surface For an explanation of symbols, see Nomenclature.  相似文献   
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