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141.
Hwa-Teng Lee Ming-Hung Chen Huei-Mei Jao Chin-Jui Hsu 《Journal of Electronic Materials》2004,33(9):1048-1054
This study investigates the influence of adding Sb on the microstructure and adhesive strength of the Sn3.5Ag solder. Both
solidus and liquidus temperatures increase as Sb additions increase. Adding 1.5wt.%Sb leads to the narrowest range (6.6°C)
between the solidus and liquidus temperature of the solder. Adding Sb decomposes the as-soldered ringlike microstructure of
Sn3.5Ag and causes solid-solution hardening. The as-soldered hardness increases with increasing Sb addition. For long-term
storage, adding Sb reduces the size of the rodlike Ag3Sn compounds. The hardness also increases with increasing Sb addition. Adding Sb depresses the growth rate of interfacial
intermetallic compounds (IMCs) layers, but the difference between 1% and 2% Sb is not distinct. For mechanical concern, adding
Sb improves both adhesive strength and thermal resistance of Sn3.5Ag, where 1.5% Sb has the best result. However, adding Sb
causes a variation in adhesive strength during thermal storage. The more Sb is added, the higher the variation reveals, and
the shorter the storage time requires. This strength variation helps the solder joints to resist thermal storage. 相似文献
142.
Chiang-Ming Chuang Hui-Tzu Hung Pei-Chi Liu Kwang-Lung Lin 《Journal of Electronic Materials》2004,33(1):7-13
The interfacial interaction between the Sn-8.55Zn-0.5Ag-0.5Ga-0.1Al solder and three kinds of metallized substrates (Cu, Cu/Au,
and Cu/Ni-P/Au) does not form the Cu-Sn intermetallic compound (IMC). Continuous Cu-Zn and discontinuous Ag-Zn interfacial
IMC layers formed between the Cu and Sn-Zn-Ag-Ga-Al solder, while Cu-Zn and Au-Al-Zn IMCs formed on the Cu/Au substrate. Only
the Au-Al-Zn IMC formed at the interface when the electroless Ni-P deposit was the diffusion barrier between Cu and the Au
surface layer. 相似文献
143.
144.
HASL及其应用焊料前景 总被引:1,自引:0,他引:1
目前,HASL因含铅的存在,许多人认为其工艺不久将被淘汰、取代。本文从PCB的生产实际出发,阐述了HASL未来存在的背景、趋势及其用焊料的变化,介绍了其未来用焊料的选取原则、范围及其发展前景。 相似文献
145.
146.
To investigate the effect of stand-off height (SOH) on the microstructure and mechanical behavior of certain solder joints,
Cu/Sn9Zn/Cu solder joints with a SOH of 100 μm, 50 μm, 20 μm, and 10 μm were prepared and studied. It was found that, as the SOH is reduced, the Zn content in the solder bulk experiences a rapid
decrease due to consumption by metallurgical reaction in the reflow process; hence, the microstructure of the solder bulk
is changed significantly from a Sn-Zn eutectic structure to a hypoeutectic structure. By contrast, Cu content in the solder
bulk experiences a rapid increase with reducing SOH, and this leads to more dissociative intermetallic compounds (IMCs) in
the solder bulk. These compositional and microstructural changes induced by reducing the SOH correlate closely with the mechanical
properties of the solder joints. In our study it is found that, as SOH is reduced, the tensile strength of the solder joints
decreases, the fracture path of the solder joint transfers from the solder bulk into the interface between the IMC layer and
the solder bulk, and the fracture mode tends to change from ductile to brittle. These findings point to a probable way to
improve the mechanical properties of miniaturized solder joints by controlling the composition and dissociative IMCs in the
solder bulk. 相似文献
147.
尽管电子设计类软件已相当先进和方便,而且更新速度也很快,但是仍然无法满足各个层次的设计人员的需求,特别是适合各种元素封装形式的焊盘设计库并不能让设计和制造者满意,为了在此方面对PCB设计有所帮助,从印制电路板焊盘的设计方法入手,针对表面组装工艺技术特点,分析了PCB焊盘对PCA可靠性的影响因素,并根据相关的质量要求提出了较为简便的设计方案。 相似文献
148.
The reaction between the Sn-Ag-Cu solders and Ni at 250°C for 10 min and 25 h was studied. Nine different Sn-Ag-Cu solders,
with the Ag concentration fixed at 3.9 wt.% and Cu concentrations varied between 0.0–3.0 wt.%, were used. When the reaction
time was 10 min, the reactions strongly depended on the Cu concentration. At low-Cu concentrations (≦0.2 wt.%), only a continuous
(Ni1−xCux)3Sn4 layer formed at the interface. When the Cu concentration increased to 0.4 wt.%, a continuous (Ni1−xCux)3Sn4 layer and a small amount of discontinuous (Cu1−yNiy)6Sn5 particles formed at the interface. When the Cu concentration increased to 0.5 wt.%, the amount of (Cu1−yNiy)6Sn5 increased and (Cu1−yNi6)6Sn5 became a continuous layer. Beneath this (Cu1−yNiy)6Sn5 layer was a very thin but continuous layer of (Ni1−xCux)3Sn4. At higher Cu concentrations (0.6–3.0 wt.%), (Ni1−xCux)3Sn4 disappeared, and only (Cu1−yNiy)6Sn5 was present. The reactions at 25 h also depended strongly on the Cu concentration, proving that the strong concentration
dependence was not a transient phenomenon limited to a short reaction time. The findings of this study were rationalized using
the Cu-Ni-Sn isotherm. This study shows that precise control over the Cu concentration in solders is needed to produce consistent
results. 相似文献
149.
钛合金具有优越的抗腐蚀性能,被广泛地用作波峰焊机的炉胆材质。但是在使用有铅钎料进行波峰焊接时,常出现穿孔现象。通过采用DES、XRD和SEM等分析手段对其进行了深入地分析,研究了在有铅钎料的使用过程中钛合金的腐蚀机理。 相似文献
150.