Evidence of thermally induced borehole elongation: a case study at Soultz, France

When they occur, borehole breakouts are considered strong markers of principal stress directions at depth. An innovative processing method for automatically identifying breakouts from ultrasonic borehole wall images has been developed. It has been applied to data sets from two deep, sub-vertical wells (GPK1 and GPK2) at the Soultz geothermal site in eastern France. In well GPK1, below 3 km depth, compression breakouts, with a 95°±7° azimuth, increasingly occur with depth. They result from time dependent compression failure at sub-critical stress levels and are indicators of the minimum horizontal principal stress orientation. However, in the uppermost logged section of well GPK2 (1.6–2.9 km depth), continuous borehole elongations share roughly the same azimuth with so called drilling-induced fractures (164°±18° and 175°±17° azimuth, respectively). Both features concomitantly vanish with depth, together with the amplitude of the thermal perturbation induced by drilling. It is proposed that these latter borehole elongations result from a pervasive, cooling-induced, tensile micro-cracking process prior to macroscopic failure localization. They are termed thermal elongations and are indicators of the maximum horizontal principal stress orientation. Had a simple logging caliper tool been used for this work, these thermal elongations might have been confused with classical compression breakouts. A simple criterion for differentiating compression breakouts from thermal elongation is proposed.     

环缝错边容器的有限元分析与容限探讨

采用有限元方法对 1台封头与筒体具有较大错边量的容器进行了应力分析 ,得到了错边区域的应力分布状况 ,并对其进行应力强度评定。结果表明 ,该容器错边部位的应力是满足应力分析准则的。通过对存在不同错边量的容器进行应力分析 ,探讨了容器的错边容限 ,对含有错边缺陷在役容器是否合乎使用的判断具有一定指导意义     

An investigation of crack closure and the propagation of semi-elliptical fatigue cracks in Q1N (HY80) pressure vessel steel

The results of an experimental investigation of the effect of crack closure on the propagation of semi-elliptical fatigue cracks are presented. Load-shedding fatigue threshold tests were carried out at stress ratios of 0.2, 0.35, 0.5 and 0.7. Crack closure was measured at the surface and depth positions using backface strain gauges, near-tip gauges, and a clip gauge. Differences between the surface and depth growth behaviour are explained by considerations of the effects of the transition from plane stress conditions at the surface to plane strain conditions at the depth. The effects of stress ratios are attributed largely to differences in the crack opening displacement, which result in asperities coming into contact to induce roughness-induced crack closure.     

Biologically active secondary metabolites of barley. IV. Hordenine production by different barley lines

Forty-three lines of barley, including ancestral (wild), landraces, Middle Eastern lines, and modern cultivars, were grown under two different sets of environmental conditions. Hordenine production in barley roots was determined at the one-leaf stage by HPLC analysis and, in two lines only, over a period of 35 days. Forty-two of the 43 lines produced significant amounts of hordenine, although there was no variation among groups. Middle Eastern lines had the highest production with 327 µg/g on a dry weight basis. Production was, however, determined more by environmental conditions during growth than by genetic factors. Hordenine production was up to seven times higher in plants grown under lower light intensities.     

Application of boundary element method to 3-D problems of coupled thermoelasticity

This paper deals with a new boundary element method for analysis of the quasistatic problems in coupled thermoelasticity. Through some mathematical manipulation of the Navier equation in elasticity, the heat conduction equation is transformed into a simpler form, similar to the uncoupled-type equation with the modified thermal conductivity which shows the coupling effects. This procedure enables us to treat the coupled thermoelastic problems as an uncoupled one, A few examples are computed by the proposed BEM, and the results obtained are compared with the analytical ones available in the literature, whereby the accuracy and versatility of the proposed method are demonstrated.     

Flow stress of high density polyethylene and nylon 66 at high rates of strain

Measurement of the flow stress of high density polyethylene (HDPE) and nylon 66 at strain rates of 10³ s^?1 using a split Hopkinson pressure bar technique is discussed. The flow stress at a strain of 10% has been determined for both polymers at 20°C. The intrinsic errors involved in this technique are briefly reviewed. The results indicate that the flow stress of HDPE and nylon 66 were 50MPa and 150MPa, respectively, at strain rates of about 10³s^?1.     

Some experimental findings in compression-after-impact (CAI) tests of CF/PEEK (APC-2) and conventional CF/epoxy flat plates

Compression-after-impact (CAI) tests have been conducted for quasi-isotropic thick plates with 48 plies by using the NASA method and on plates with 32 plies by using the SACMA method. Specimens are made of CF/PEEK (APC-2) and conventional CF/epoxy for the NASA plates and CF/epoxy for the SACMA plates. In the NASA CAI tests, the sequence of delamination buckling and its propagation is clearly revealed through various experimental techniques. One major technique is moiré topography, and the other is thermo-mechanical stress analysis with a high-accuracy infrared sensor. The arrest of delamination propagation just before catastrophic failure due to high fracture toughness is clearly captured by the moiré camera. This behavior provides good CAI values of CF/PEEK. The initial buckling properties of the delaminated region by the impact are then extensively discussed. Numerical predictions of initial buckling stress have been obtained by modelled geometry of the delaminated region simplified from its precise structure clarified by ultrasonic C-scanning. They agree fairly well with the experimental results. The in-plane stress distribution in the delaminated region before initial buckling is measured by an infrared stress graphic system. This compared favorably with finite element predictions. Two types of symmetric buckling modes with respect to the central plate surface, twin and single peak ones, are experimentally captured.     

Fatigue crack growth analysis of welded aluminium RHS T-joints with manipulated residual stress level

The fatigue life of a welded aluminium T‐joint made from beams with rectangular hollow section (RHS) has been predicted using a crack propagation analysis and compared with experimental results from joints with different residual stress levels. To include the effect of the residual stresses, the stress ratio was calculated at the weld toe and, via Walker's equation, introduced into the analysis. How to obtain the Walker exponent has been discussed in detail. The introduction of a stress ratio at the weld toe provides good agreement between the experimentally and analytically found S–N curves. The effect of the residual stress was successfully included in the analysis.     

Control of Titanium Alloy Thin Plate Welding Distortion by Trailing Peening

The technology of trailing peening is a kind of promisingly bran-new technology which can be used to control weldingstress and distortion of Ti alloy thin plate. Control of TC4 Ti alloy thn plate welding stress and distortion underthe condition of convent     

Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au

Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.