Structural integrity in electronics

With continuing miniaturisation, increased performance demands and the requirement to remove lead from solder alloys, the challenges to structural integrity and reliability of electronic equipment are substantial and increasing. This paper outlines typical features in electronic equipment of which the structural integrity community may be generally unaware. Potential failure modes in service are described, and the problems of scale and material characteristics are considered. Progress in the application of fracture mechanics to the life prediction of interconnections is reviewed. The limited evidence available suggests that the crack growth resistance of silver‐containing lead‐free solders is superior to that of the traditional Sn‐37Pb under cycle‐controlled conditions but there is no difference when time‐dependent conditions prevail. In several respects, it is contended that the electronics sector is faced with challenges at least equivalent to those encountered in gas turbines and nuclear power generation.     

Dynamic stiffness vibration analysis using a high‐order beam model

This work presents the derivation of the exact dynamic stiffness matrix for a high‐order beam element. The terms are found directly from the solutions of the differential equations that describe the deformations of the cross‐section according to the high‐order theory, which include cubic variation of the axial displacements over the cross‐section of the beam. The model has six degrees of freedom at the two ends, one transverse displacement and two rotations, and the end forces are a shear force and two end moments. Using the dynamic stiffness matrix exact vibration frequencies for beams with various combinations of boundary conditions are tabulated and compared with results from the Bernoulli–Euler and Timoshenko beam models. Copyright © 2003 John Wiley & Sons, Ltd.     

隧道受震破壞調查分析與修復管理案例

就隧道震後之災損模式進行統計與災損原因研判,並利用數值分析方法研判安全性,就結構加固等改善措施之設計考量作詳細說明;另由於隧道結構物的損壞範圍大,且修復經費受限,必須藉由定期檢测進行長期維護管理,以防範意外發生。於此,利用Vidco-GIS自動化影像地理资訊系統之e化新技術,以動態及靜態影像紀錄隧道災損狀況,同時亦整合建置前期設計、施工圖及定期維護等資料,相關成果以資料庫方式纳入日常維護管理,以有限人力有效率地進行維護管理紀錄並随時掌握現況供作決策之明確參考。     

初论带状光纤缆结构设计

推导出了成叠带状光纤在松套管中余长的两个计算公式，此两公式是带状光纤缆结构设计需要用到的基本公式。此外，还对带状光纤缆结构设计作了初步讨论。     

玻璃包装改进及经济效益分析

论述了平板玻璃包装技术改进对提高包装质量和企业经济效益的影响,介绍了平板玻璃包装箱(架)的性能,简述了计算机辅助设计及计算机辅助管理在玻璃包装结构设计及包装质量管理中的效用。     

分析恒载效应的有限元方法

本文在Takabatake关于恒载对梁静、动力影响的研究工作的基础上,导出了梁考虑恒载效应的动力分析有限元公式,提出了荷载影响刚度矩阵的概念。分析了分布和集中两种恒载型式对简支梁和悬臂梁自振特性的影响。计算结果表明,用本文方法与Takabatake应用Galerkin方法和近似闭合解方法的结果吻合良好。同时由于本文采用了矩阵形式,不仅便于编制计算机程序,且使方法有更广泛的适用性和灵活性,可更方便地用于各种不同的构造和边界条件下的实际结构。     

对遂昌金矿采场结构参数的探讨

对于遂昌金矿合理的采场结构参数，目前没有理想的确定方法。本文联系上盘围岩的构造裂隙，矿房的支护形式等提出采场稳定跨度判断指标。经４０个采场的检验，值信度达９７．５％。     

三维结构可靠度对随机变量的敏感性研究

本文基于三维随机有限元提出了结构点可靠度、失效模式的可靠度及整个结构体系的可靠度分别对随机变量的＂分布参数＂和＂极限状态方程参数＂的敏感性计算方法，并以一典型重力坝为例进行了计算，得出了若干有益的结论。     

结构粘结剂的试验研究

粘结剂是粘钢加固技术的关键材料,通过对粘结剂的试验研究,得到了粘结剂的拉压试验曲线与材料力学指标以及粘附于各种标号混凝土时,粘结层的抗剪强度;并且还进行了粘结剂的短期流变试验。     

可调链式切皂机的结构设计

阐述了可调链式切皂机的设计思想、工作原理、结构特点、机械特性及设计注意事项。