考虑光学邻近效应的详细布线算法

提出了一种考虑光学邻近效应的详细布线算法.该算法在布线过程中,充分考虑了线网走线相对位置及布线线形对其光学邻近效应的影响,通过相应的光刻模拟模型定义了用于估计光学邻近效应(optical proximity effect,OPE)的OPE费用函数,并采用OPE费用阈值控制Steiner树的生长方向和走线路径的选择,同时兼顾线网长度.为提高算法效率,避免布线过程中反复调用光学模拟程序带来的算法运行速度慢的问题,对可能的走线模式建立了计算OPE费用所需的光强查找表格,使算法的运行速度大大提高.在实际的工业用例上的实验结果表明,本文所提出的详细布线算法使布线结果中的OPE问题得到很大程度的改善,有利于后处理过程中的光学邻近效应校正技术的运用,算法的运行时间是可以接受的.     

Enhancement of adhesion strength of Cu layer with low dielectric constant SiC:H liners in Cu interconnects

One of the primary candidates for the liner/etch stop layer in damascene process is silicon nitride (Si₃N₄). However, silicon nitride has a high dielectric constant of 7.0. To reduce the effective dielectric constant in Copper (Cu) damascene structure, dielectric SiC:H (prepared by plasma enhanced chemical vapor deposition (PECVD) using trimethylsilane source) as the Cu diffusion barrier was studied. The dielectric constant of SiC:H used is 4.2. A systematic study was made on the properties of liner material and electro-chemically plated (ECP) Cu to enhance the adhesion strength in Cu/low-dielectric constant (k) multilevel interconnects. Though the effects of as Si₃N₄ the liner have been much studied in the past, less is known about the relation between adhesion strength of ECP Cu layer and physical vapor deposited (PVD) Cu seeds, with seed thickness below 1000 Å. The annealing of Cu seed layer was carried out at 200 °C in N₂ ambient for 30 min was carried out to study the impact on adhesion strength and the microstructure evolution on the adhesion between ECP Cu and its barrier layer. In the study, our claim that SiC:H barrier/etch stop layer is essential for replacing conventional Si₃N₄ layer in enhancing adhesion strength and interfacial bonding between Cu/dielectric interconnects.     

密集型色散管理模式中DM孤子传输特性分析

本文以经典色散管理孤子的传输特性为参照,研究了单信道40Gbit/s密集型色散管理系统内色散管理孤子的诸多传输特性,证实了密集型色散管理模式相对于经典色散管理模式的优势所在,同时给出了系统最佳传输性能与入射功率、分段数、以及脉冲初始宽度等因素的数值关系。     

GaN基量子阱激子结合能和激子光跃迁强度

采用变分法,计算了GaN基量子阱中激子结合能和激子光跃选强度。计算结果表明,GaN基量子阱中激子结合能为10－55meV,大于体材料中激子结合能,并随着阱宽减小而增加,在临界阱宽处达到最大。结间带阶同样对激子结合能有着较大的影响,更大带阶对应更大的结合能。同时量子限制效应增加了电子空穴波函数空间重叠,因此加强了激子光跃迁振子强度,导致GaN/AlN量子阱中激子光吸收明显强于体材料中激子光吸收。     

片式电阻保护浆料的制备

通过与日本样进行对比试验,研究了片式电阻保护浆料的制备工艺及要求。分析了玻璃组成和浆料配方对元件电阻值漂移的影响,并对其保护机理进行了探讨。制备的浆料达到日本样技术指标的要求。利用4号玻璃组分的1MΩ片电阻的阻值漂移率最小为0.9%     

表面活化处理在激光局部键合中的应用

为了研究低热应力键合工艺,提出了一种将表面活化直接键合与激光局部键合相结合的键合技术。首先采用RCA溶液对键合片进行表面亲水活化处理,并在室温下成功地完成了预键合。然后在不使用任何夹具施加外力辅助的情况下,利用波长1064nm、光斑直径500μm、功率70W的Nd:YAG连续式激光器,实现了激光局部键合,并取得了6.3MPa~6.8MPa的键合强度。结果表明,这种以表面活化预键合代替加压的激光局部键合技术克服了传统激光键合存在的激光对焦困难,以及压力不匀易损害键合片和玻璃盖板等缺点,同时缩短了表面活化直接键合的退火时间,提高了键合效率。     

Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints

The shear strength of ball-grid-array (BGA) solder joints on Cu bond pads was studied for Sn-Cu solder containing 0, 1.5, and 2.5 wt.% Cu, focusing on the effect of the microstructural changes of the bulk solder and the growth of intermetallic (IMC) layers during soldering at 270°C and aging at 150°C. The Cu additions in Sn solder enhanced both the IMC layer growth and the solder/IMC interface roughness during soldering but had insignificant effects during aging. Rapid Cu dissolution from the pad during reflow soldering resulted in a fine dispersion of Cu₆Sn₅ particles throughout the bulk solder in as-soldered joints even for the case of pure Sn solder, giving rise to a precipitation hardening of the bulk solder. The increased strength of the bulk solder caused the fracture mode of as-soldered joints to shift from the bulk solder to the solder/IMC layer as the IMC layer grew over a critical thickness about 1.2 m for all solders. The bulk solder strength decreased rapidly as the fine Cu₆Sn₅ precipitates coarsened during aging. As a consequence, regardless of the IMC layer thickness and the Cu content of the solders, the shear strength of BGA solder joints degraded significantly after 1 day of aging at 150°C and the shear fracture of aged joints occurred in the bulk solder. This suggests that small additions of Cu in Sn-based solders have an insignificant effect on the shear strength of BGA solderjoints, especially during system use at high temperatures.     

薄膜金属化低温共烧陶瓷基板的阻碍层对共晶焊的影响

讨论了低温共烧陶瓷基板薄膜金属化技术中,有效阻碍层的选择对基板共晶焊的剪切强度、互连阻抗、可焊性的影响。试验结果表明,Ti / Ni是一种高可靠性的阻碍层,且Ti / Ni / Au也是一种较理想的低温共烧陶瓷基板薄膜金属化结构。     

小型无线场强探测传感器研究

近年来,微波加热因其高效性和清洁无污染等优点广泛应用于各个领域.然而,微波加热的不均匀性限制了微波作为高效加热能源的应用.通过测量和分析加热腔中的电场分布情况可以帮助设计人员改进微波加热腔体设计,提高微波加热的均匀性.现有的场强测量设备均为有线设备,应用场景极为有限.因此,本文提出了一种由探头、接收机和上位机三部分组成...