跨流域水库联合供水调度研究

针对浙江省跨流域引调水工程的特点,提出了水库联合供水调度的并行调节法和聚合分解法,探讨了各方法的计算原理和引水原则。结合实例对两种方法进行了比较,并对联合供水调度使水库可供水量增加的原因进行了探析。研究表明,采用动态库容系数作为引水控制条件是合理的,联合调度计算较单库调度计算可以增加水库的可供水量。     

基于静力子结构技术对轮轴接触下车轮的强度分析

利用有限元分析中的静力子结构技术,在考虑轮轴过盈配合接触非线性情况下,利用有限计算资源,应用有限元方法快速完成车轮的强度分析。计算结果表明,采用此方法可以更加真实而准确地反映车轮在多载荷工况下的应力分布。     

弯曲应力状况下微型BGA封装可靠性比较

文中采用传统的表面贴装技术进行焊接,研讨μBGA的PCB装配及可靠性。弯曲循环试验（1000με～-1000με）,用不同的热因数（Qη）回流,研究μBGA、PBGA和CBGA封装的焊点疲劳失效问题。确定液相线上时间,测定温度,μBGA封装的疲劳寿命首先增大,接着随加热因数的增加而下降。当Qη接近500s·℃时,出现寿命最大值。最佳Qη范围在300s·℃～750s·℃之间,此范围如果装配是在氮气氛中回流,μBGA封装的寿命大于4500个循环。采用扫描电子显微镜（SEM）,来检查μBGA和PBGA封装在所有加热因数状况下焊点的失效。每个断裂接近并平行于PCB焊盘,在μBGA封装中裂纹总是出现在焊接点与PCB焊盘连接的尖角点,接着在Ni3Sn4金属间化合物（IMC）层和焊料之间延伸。CBGA封装可靠性试验中,失效为剥离现象,发生于陶瓷基体和金属化焊盘之间的界面处。     

基于杂波密度估计的联合概率数据互联算法

联合概率数据互联(JPDA)算法能很好地解决密集环境下的多目标跟踪问题。在该算法基础上,人们又提出了多传感器联合概率数据互联(MSJPDA)算法和一些基于JPDA的修正算法。在联合概率数据互联算法中,有一个很重要的参数就是杂波数密度(或波门内虚假量测期望数),然而在许多实际情况中,这个参数是很难获取的。针对这一问题,提出了一种修正的联合概率数据互联算法,该算法通过实时地调整这一参数来获得对目标较为准确的估计结果。最后,给出了算法的仿真分析。     

Application of an asymmetrical four point bend shear test to solder joints

The asymmetrical four-point bend shear (AFPB) test method was used to measure the shear strength and creep properties through the stress relaxation experiments using three different Pb-free solder joint compositions in an assolidified condition. Since it was difficult to shear the uniform specimens and the local bending usually occurs at the inner loading points, the notches were introduced at the joint line to preferentially weaken this region. The stress analysis by finite element modeling showed that the straight notches transform the parabolic shear stress distribution in the uniform specimen into a relatively uniform shear distribution along the bond line in the notched specimens. Therefore, the shear strength results from the notched specimens are expected to be much more accurate. Experiments showed that both the Sn-3.6Ag-1Cu (wt.%) and Sn-3.6Ag-1Cu-0.45Co joints have superior strength and creep properties as compared to the Sn-3.5Ag joint. However, there was no statistical difference between the shear strength of the Sn-3.6Ag-1Cu and Sn-3.6Ag-1Cu-0.45 Co joints. Moreover, the difference between the creep resistance of these two types of joints was small.     

发电机定子绕组接头焊接质量检测方法及判断标准

通过对鲁布革电厂发电机定子绕组接头焊接质量检测分析,探讨了接头焊接质量检测方法及判断标准。     

高强铝合金T型接头激光焊接的研究现状

分析总结了高强铝合金T型接头激光焊接存在的几个主要问题,从工艺的优劣性方面介绍了当前高强铝合金T型接头激光焊接常用的几种工艺,通过实验论证了采用填充粉末焊接高强铝合金T型接头焊接的可行性。并提出了激光加工专用粉末制粉工艺的一个新的研究方向。     

QFP焊点塑性应变的数值模拟

元素铅既对人体存在神经毒性也对环境产生重金属污染,因此,无铅焊料的研究倍受封装业的重视。文章采用温度循环下有限元数值模拟方法,针对4种焊料5种配比包括SnPb（60／40,10／90）、SnPbAg（5／92．5／2．5）、SnAg（96．5／3．5）和SnAgCu（95．5／3．8／0．7）,定量评估QFP焊点的塑性应变。给出焊料各参数对于焊点塑性应变的影响程度,第一主元分析显式为△Ps≈-2．56△（Q／R）,相应的Y向塑性应变均值降低为优化前的11％。所得的结果可为QFP封装时的焊料选择提供新的设计参考。     

Computing the k-error joint linear complexity of binary periodic multisequences

Complexity measures for multisequences over finite fields, such as the joint linear complexity and the k-error joint linear complexity, play an important role in cryptology. In this paper we study a fast algorithm, presented by Venkateswarlu A, to computer the k-error joint linear complexity of a binary periodic multisequence. In this paper, the aim is mainly to complement the theoretical derivation and proof of the existing algorithm. Moreover, our algorithm reduces computation.     

PCB设计对焊点强度及坑裂失效的影响

采用正交试验设计的方法,讨论了PCB基材的树脂禽餐、焊盘类型,以及焊盘大小对焊点强度和坑裂失效的影响。结果表明：在3个方面的因素中,PCB基材的树脂含量对焊点强度的影响程度最大。有阻焊膜限定的焊盘类型（SMD）要比无阻焊膜限定的焊盘类型（NSMD）的焊点强度要高,且不容易发生坑裂失效。