Nanotrenches Induced by Catalyst Particles on ZnSe Surfaces

Nanotrenches are induced by thermal annealing Au droplets on ZnSe surfaces. High-resolution scanning electron microscopy studies of the nanotrench structures reveal that the preferred migration directions of the catalyst droplets are along the direction family. On a ZnSe(111)B surface, each of the trenches is along one of the six directions while on a nonvicinal ZnSe(100) surface, the trenches are along a pair of antiparallel directions. Based on the results obtained from atomic force microscopy surface profiling and electron energy-loss spectroscopy chemical analysis techniques, a model is proposed to describe the possible formation mechanisms of the␣observed nanotrenches. The highly parallel nanotrenches induced on the Au/ZnSe(100) structure as revealed in this study are potentially useful as a template for in situ fabrication of ordered one-dimensional nanostructures (such as nanowires) of many materials.     

Study of wetting reaction between eutectic AuSn and Au foil

Wetting reactions between eutectic AuSn solder and Au foil have been studied. During the reflow process, Au foil dissolution occurred at the interface of AuSn/Au, which increases with temperature and time. The activation energy for Au dissolution in molten AuSn solder is determined to be 41.7 kJ/mol. Au₅Sn is the dominant interfacial compound phase formed at the interface. The activation energy for the growth of interfacial Au₅Sn phase layer is obtained to be 54.3 kJ/mol over the temperature range 360–440°C. The best wettability of molten AuSn solder balls on Au foils occurred at 390°C (wetting angle is about 25°). Above 390°C, the higher solder oxidation rate retarded the wetting of the molten AuSn solder.     

基于遗传算法的基因微阵列数据聚类

微阵列基因数据用以挖掘特定的生物信息,聚类分析对于研究基因功能和基因调控机制有重要意义.结合改进的遗传算法对基因微阵列数据进行聚类分析,并且通过实验与K均值聚类进行比较.仿真实验表明,该算法可以有效改进基因微阵列数据的聚类准确率.     

DNA-纳米颗粒共聚体在最大匹配问题中的应用

该文提出一种DNA计算模型,利用DNA-纳米金颗粒共聚体的自组装来解决图论中的一个NP完全问题——最大匹配问题。根据模型该文设计了能够基于一个具体的图进行自组装的特殊的DNA-纳米金颗粒共聚体,然后利用一系列的实验方法来获得最终的解。这种生物化学算法可以极大地降低求解最大匹配问题的复杂度,这将为DNA自组装计算模型提供一种切实可行的方法。     

干膜与阻焊油墨对化镍金厚度的影响

感光阻焊与干膜析出物,是化镍金表面工艺金、镍缸控制寿命的原因之一,旨在改善黑焊盘缺陷。由于阻焊、干膜种类繁多,且阻焊、干膜与化镍金药水属于不同公司或厂家,鉴于配方专利等原因,单方对其相互影响原理甚至现象鲜有研究,此方面文献更是屈指可数。本文简述了"黑焊盘"发生的基本原理,并利用干膜以及不同阻焊油墨进行试验,通过测量镍金层厚度评估干膜与油墨对化镍金工艺的影响。通过机理验证试验,验证阻焊油墨析出物抑制化镍反应,而非目前业界所认知的加速反应。本实验一则为PCB厂家提供经验数据,利于生产控制;二则抛砖引玉,促进阻焊油墨、干膜、化镍金药水及PCB厂家对其进一步研究。     

Au纳米颗粒对向列相液晶取向性能的影响

液晶分子的初始排列在液晶显示器中起着关键的作用。纳米粒子掺杂到液晶体系可扰乱液晶分子的排列,从而改变液晶的自组装特性,进而影响液晶的各项性能。将制备的Au八面体纳米颗粒掺杂到向列相液晶4-氰基-4′-正戊基联苯(5CB)中,灌入液晶盒后,通过使用偏光显微镜对液晶盒的观察发现,掺杂的八面体Au纳米颗粒诱导5CB液晶分子发生了垂直取向,而球形Au纳米颗粒不能诱导液晶分子垂直取向。这归因于八面体Au纳米颗粒的表面能比较小,液晶分子间的作用力比较大,使液晶分子易于垂直取向。随着O-Au NPs的浓度增大,液晶分子的取向效果先变好又逐渐变差。这是因为O-Au NPs的浓度越高,可诱导越多的液晶分子垂直取向排列,但随着纳米粒子浓度的增加,纳米粒子团聚,减少了与液晶分子的作用,使取向效果变差。动态过程实验显示,0.1%的八面体金纳米颗粒可诱导向列相液晶5CB在2 min内快速完成垂直取向,表明O-Au NPs具有优异的诱导5CB取向的动态效果。     

Highly Stable Au Nanoparticles with Tunable Spacing and Their Potential Application in Surface Plasmon Resonance Biosensors

Colloidal Au‐amplified surface plasmon resonance (SPR), like traditional SPR, is typically used to detect binding events on a thin noble metal film. The two major concerns in developing colloidal Au‐amplified SPR lie in 1) the instability, manifested as a change in morphology following immersion in organic solvents and aqueous solutions, and 2) the uncontrollable interparticle distance, determining probe spacing and inducing steric hindrance between neighboring probe molecules. This may introduce uncertainties into such detecting techniques, degrade the sensitivity, and become the barricade hampering colloidal Au‐based transducers from applications in sensing. In this paper, colloidal Au‐amplified SPR transducers are produced by using ultrathin Au/Al₂O₃ nanocomposite films via a radio frequency magnetron co‐sputtering method. Deposited Au/Al₂O₃ nanocomposite films exhibit superior stability, and average interparticle distances between Au nanoparticles with similar average sizes can be tuned by changing surface coverage. These characteristics are ascribed to the spacer function and rim confinement of dielectric Al₂O₃ and highlight their advantages for application in optimal nanoparticle‐amplified SPR, especially when the probe size is smaller than the target molecule size. This importance is demonstrated here for the binding of protein (streptavidin) targets to the probe (biotin) surface. In this case, the dielectric matrix Al₂O₃ is a main contributor, behaving as a spacer, tuning the concentration of Au nanoparticles, and manipulating the average interparticle distance, and thus guaranteeing an appropriate number of biotin molecules and expected near‐field coupling to obtain optimal sensing performance.     

Nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process

The nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process was investigated. The nano-scale mold was fabricated; the anti-adhesion property of nanometer-size Si-mold was improved and the surface free energy was calculated with the contact angle measurement. The ∼150 nm width Au nano-wires were successfully fabricated on Si and on flexible polyimide substrate with the proposed process. The PMMA thickness dependent trend with reversal imprinting and Au nano-wires lift-off results were also investigated by SEM analysis.     

Study on the failure temperature of Ti/Pt/Au and Pt5Si2-Ti/Pt/Au metallization systems

The Ti/Pt/Au metallization system has an advantage of resisting KOH or TMAH solution etching. To form a good ohmic contact, the Ti/Pt/Au metallization system must be alloyed at 400℃. However, the process temperatures of typical MEMS packaging technologies, such as anodic bonding, glass solder bonding and eutectic bonding, generally exceed 400℃. It is puzzling if the Ti/Pt/Au system is destroyed during the subsequent packaging process. In the present work, the resistance of doped polysilicon resistors contacted by the Ti/Pt/Au metallization system that have undergone different temperatures and time are measured. The experimental results show that the ohmic contacts will be destroyed if heated to 500℃. But if a 20 nm Pt film is sputtered on heavily doped polysilicon and alloyed at 700℃ before sputtering Ti/Pt/Au films, the Pt₅Si₂-Ti/Pt/Au metallization system has a higher service temperature of 500℃, which exceeds process temperatures of most typical MEMS packaging technologies.     

相似性度量在基因表达聚类分析中的应用研究

聚类分析是基因表达数据分析研究的主要技术之一,其算法的基本出发点在于根据对象间相似度将对象划分为不同的类,选择适当的相似性度量准则是获得有效聚类结果的关键。采用预处理过的基因数据集在不同相似性度量准则下进行的不同聚类算法的聚类分析,并得到聚类结果评价。其中算法本身的缺陷及距离相似性度量的局限性都是影响结果评价的因素,为了获得更有效的聚类结果,改进相关聚类算法并提出了一种比例相似性度量准则。