套保稠油油田火烧油层可行性分析

从火烧油层的筛选标准、实际地质条件及室内物理模拟实验入手，对该油田火烧可行性进行了分析。分析结果认为，套保油田进行火烧总体上是可行的，在实际火烧时应避开底水的影响，火烧区域应选在构造高部位或仅烧其主力层。     

水煤浆燃烧技术及其发展

分析了水煤浆雾化燃烧的技术状况、应用方向和存在问题，介绍了水煤浆流化—悬浮高效洁净燃烧新技术及其优点，结合实践应用情况，分析了发展水煤浆流化—悬浮燃烧技术的意义和应用前景。     

Synthesis and luminescence of Sr2CeO4 fine particles

Fine particles of a blue emission phosphor Sr₂CeO₄ have been synthesized using a chemical co-precipitation technique, and the textual and luminescent properties were compared with the one synthesized by the conventional solid-state reaction method. Particle size and distribution of the Sr₂CeO₄ fine powder prepared by the co-precipitation process were smaller and narrower than those obtained by the samples prepared from the conventional one. The emission intensity of the fine particles was equal to that of the larger particles prepared from the solid-state reaction, on the contrary to the general tendency that emission intensity decrease with particle size reduction. Although no Ce³⁺ peaks were observed in EPR measurements, X-ray photoelectron spectra of the samples clearly elucidated the existence of Ce³⁺ only on the surface of Sr₂CeO₄.     

Microchemical Engineering: Components,Plant Concepts User Acceptance – Part I

Over the last five years, many activities have focused on the unexploited field of carrying out reactions on small scales. Due to the rapid development of new components, this paper deals with recent developments only in a compressed form. An important point is the analysis of possible plant concepts for microreactors and whether these are a sensible option. Due to the enormous difference in size between the microchannels and the fluid periphera of possible components this is not just a technical question. It touches on the microtechnology concept as a whole. The direction in which the field should be developed and which measures can be taken to influence its development are questions that are addressed here with respect to the big industrial interest in microreactors.     

Investigation into polishing process of CVD diamond films

A new technique used for polishing chemical vapor deposition (CVD) diamond films has been investigated, by which rough polishing of the CVD diamond films can be achieved efficiently. A CVD diamond film is coated with a thin layer of electrically conductive material in advance, and then electro-discharge machining (EDM) is used to machine the coated surface. As a result, peaks on the surface of the diamond film are removed rapidly. During machining, graphitization of diamond enables the EDM process to continue. The single pulse discharge shows that the material of the coated layer evidently affects removal behavior of the CVD diamond films. Compared with the machining of ordinary metal materials, the process of EDM CVD diamond films possesses a quite different characteristic. The removal mechanism of the CVD diamond films is discussed.     

Characterization and optimization of copper chemical mechanical planarization

The feature scale planarization of the copper chemical mechanical planarization (CMP) process has been characterized for two copper processes using Hitachi 430-TU/Hitachi T605 and Cabot 5001/Arch Cu10K consumables. The first process is an example of an abrasive-free polish with a high-selectivity barrier slurry, while the second is an example of a conventional abrasive slurry with a low-selectivity barrier slurry. Copper fill planarization has been characterized for structures with conformal deposition as well as with bumps resulting from bottom-up fill. Dishing and erosion were characterized for several structures after clearing. The abrasive-free polish resulted in low sensitivity to overpolish and low saturation levels for dishing and erosion. Consequently, this demonstrated superior performance when compared to the International Technology Roadmap for Semiconductors (ITRS) 2000 roadmap targets for planarization. While the conventional slurry could achieve the 0.13-μm technology node requirements, the abrasive-free polish met the planarization requirements beyond the 0.10-μm technology node.     

锰铜基高阻尼合金中锌量的测定──硫氰酸盐萃取分离络合滴定法

基于甲基异丁基甲酮于稀盐酸介质中定量地萃取Ｚｎ￣（２＋）与ＣＮＳ￣－形成的络阴离子。从而达到与共存的锰、镍、铝、铬的完全分离。在有氟化物、硫脲存在时Ｆｅ￣（３＋）、Ｃｎ￣（２＋）和Ａｇ￣＋也不被萃取。有机相中的锌于ＰＨ５．５“六胺”缓冲介质中返萃取回水相，用ＥＤＴＡ滴定。在文中给定的条件下锌的一次被萃取率可达９９％以上，成功地解决了锰铜基高阻尼合金中共存离子对锌量测定的干扰问题。     

冶金过程中复杂夹杂物和钢液化学平衡计算

本文提出一个同温冶炼过程中预测非金属夹杂物沉淀的计算机程序。本研究中，多元硅酸盐溶体的Ｇｉｂｂｓ自由能由基于统计热力学的晶胞模型来计算，该晶胞模型按照氧与周围的阳离子构成的对称和非对称晶胞来描述硅酸盐熔体结构，假定高温冶炼时认与非金属夹杂物平衡，钢液中氧化物元素的活度由Ｗａｇｎｅｒ交互作用系数来计算，利用本程序可以估计炼钢时沉淀的非金属氧化物的成分，为调整冶炼工艺和提高产品质量提供指导，进一步可计     

ATMOSPHERIC DEPOSITION OF CHEMICAL SPECIES TO POLAR SNOW

Particles and gases can deposit from the atmosphere to polar snow by several mechanisms. Dry deposition can be considered to consist of three steps: aerodynamic transport from the free atmosphere to the viscous sublayer near the surface, boundary layer transport across the sublayer, and interactions with the surface. The particle dry deposition mass flux is dominated by the largest particles present in a size distribution. Wet deposition includes in-cloud and below-cloud scavenging, where the former refers to uptake of particles during nucleation of cloudwater as well as scavenging of particles and gases by existing droplets and ice crystals. Of all the wet deposition mechanisms, nucleation scavenging is often the most important mechanism for particles in the polar regions. Finally, incorporation of particles and gases into fog droplets and subsequent settling of the fog to the snow surface can be an important removal process in regions of frequent fog. For Summit, Greenland, the total deposition of MSA, SO₄^2-, Na⁺, K⁺, and Ca²⁺ during May 24-July 13, 1993 was dominated by wet deposition: this mechanism accounted for an average of 62% of the total deposition for these species. Fog and dry deposition accounted for 21% and 17% of the total, respectively. These results suggest that all three mechanisms may need to be considered when estimating total deposition of certain chemical species to polar snow.