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11.
Ionically conductive polypyrrole films have been deposited at 295 K from anhydrous acetonitrile, acetonitrile/H2O and NaBF4 aqueous solutions onto platinum, mild steel and stainless steel discs, using cyclic voltammetry, potentiostatic and galvanostatic techniques. Cyclic voltammetry of the polymer films has been studied as a function of water content of the acetonitrile solvent, polypyrrole concentration and potential sweep rate. Potentiostatic growth of thicker (< 30 micron) films on stainless steel allowed free-standing polypyrrole membranes to be produced. Well adherent and conductive films were deposited at constant potential in stirred solutions from acetonitrile electrolytes containing 1% (v/v) of water. The membrane resistivity of the reduced films in 0.5 mol dm− 3 KCl(aq) at 295 K was ≈ 1 × 106 Ω cm, while the resistivity of the oxidised membrane was 2700 Ω cm. 相似文献
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本文通过炭黑(简称CB)用量、加工工艺、温度对PS/CB复合材料导电性能影响的探讨、复合导电材料亚微观结构的观察,研究了PS/CB复合材料的导电性能。结果表明,随着CB含量的增加,材料的电阻率呈非线性下降,当CB的质量分数在10%~40%的范围内时,电阻率下降明显,在此含量范围以后,体积电阻率变化不大;材料的导电性能与加工工艺有关,溶剂法的导电性能比混炼法好;电阻率随温度的升高均有上升的趋势。由复合材料的亚微观结构表明,随着CB含量的增加,CB由分散的单个颗粒逐渐连结在一起,最后与PS形成了一种相互交错式的结构 相似文献
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Y. Konishi 《Polymer》2006,47(15):5371-5391
A novel percolation phenomenon with inorganic nanoparticle loading in polyamide 6-carbon based nanoparticle hybrids was identified. Percolation threshold substantially shifts to lower carbon black (CB) volume fractions in the presence of optimum concentration of chemically modified montmorillonite (organoclay) while the effective organoclay concentration can be optimized to lower the slope of percolation curve maintaining electrical conductivity within static dissipative 10−6-10−9 S cm−1 range. Organoclay/CB ‘nano-unit’ morphology was found in polyamide 6 ternary hybrids. It is composed of stacked organo-montmorillonite platelets that deform to wrap partially around one or two primary CB aggregates. This elementary nano-unit structure induces CB network self-assembly within polyamide 6 matrices. The structure was found to be prevalent throughout the polymer matrix. This morphology remains robust under wide range of thermal-deformation histories due to the strong preferred organoclay/polyamide 6/CB interactions that partially blocks the electron conduction and hopping mechanisms with clay ‘walls’ thereby reducing the slope of the percolation curve. Organoclay can be used as a dispersion control agent in these polymer-carbon systems to induce self-assembly of CB network at low CB content, simultaneously, partial blocking the electron hopping pathways to level the slope of percolation curves. High order exfoliation and nano-scale dispersion of organoclay is essential to induce this advanced percolation phenomenon. 相似文献
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HDPE/炭黑导电复合材料的改性 总被引:1,自引:0,他引:1
本文研究了导电炭黑的品种、含量及其对高密度聚乙烯(HDPE)性能的影响,以及动态硫化对改善HDPE/导电炭黑复合材料物性的贡献。结果表明,HG-4型导电炭黑填充HDPE具有很好的导电性,复合材料力学性能较差;ACET炭黑导电性较差,复合材料力学性能最好。炭黑并用能有效地降低生产成本,而且保持了材料的性能。动态硫化法可以克服复合材料物性差的弱点,并能保持改性材料的高导电性。在HG-4型炭黑含量为7份时,材料的拉伸强度13MPa,断裂伸长率350%,体积电阻率为2.1Ω·cm。 相似文献
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The objective of this work was to demonstrate the utility of lignin-based resins designed for application as an adhesive in the production of particleboard. Bond qualities of lignin-phenol-formaldehyde resins, phenolated-lignin-formaldehyde resins and commercial phenol-formaldehyde (PF-com) resin were assessed by using an automatic bonding evaluation system, prior to production of particleboards. In order to evaluate the quality of lignin-based resins, particleboards were produced and physical and mechanical properties were investigated. These physical properties included internal bond, modules of rupture and modulus of elasticity. Thickness swell and water absorption properties of particleboards bonded with lignin-based resins were also determined. The lignin-based resins have been reported previously in Part I of this study. The results showed that particleboards bonded with phenolated-lignin formaldehyde resins (up to 30% lignin content) exhibited similar physical and mechanical properties when compared to particleboards bonded with PF-com. The work has indicated that phenolated-lignin formaldehyde resins (up to 30% substitution level) can be used successfully as a wood adhesive for constructing particleboard. The performance of these panels is comparable to those of boards made using PF-com resin. 相似文献
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Rosamaria W.C. Leonardo Jonas Yoshio Lilian R.F. 《Sensors and actuators. B, Chemical》2008,131(2):646-651
A novel poly(p-xylylene), PPX, derivative bearing alkoxyphenyl side groups was electrochemically synthesized in 87% yield. The polymer, poly(4′-hexyloxy-2,5-biphenyleneethylene) (PHBPE), presented a fraction (92%) soluble in common organic solvents. It showed to be thermally resistant up to 185 °C. UV–vis analysis revealed an Egap of 3.5 eV. Gas sensors made from thin films of 10-camphorsulfonic acid-doped PHBPE deposited on interdigitated electrodes exhibited significant changes in electrical conductance upon exposure to five VHOCs: 1,2-dichloroethane, bromochloromethane, trichloromethane, dichloromethane and tetrachloromethane. The conductance decreased after exposure to tetrachloromethane and increased after exposure to all the other VHOCs. Three-dimensional plots of relative response versus time of half response versus time of half recovery showed good discrimination between the five VHOCs tested. 相似文献