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101.
A. Chaudhry R. Kleiman K. D. Carlson 《Journal of the American Oil Chemists' Society》1990,67(11):863-866
Routine analysis of fatty ester fractions ofLesquerella fendleri oil suggested the presence of epoxy compounds and other minor components. By a combination of open silica column and high
performance liquid chromatography (HPLC) fractionations of the methyl esters prepared from the oil, these constitutents were
isolated and then characterized by thin-layer chromatography-mass spectrometry (GC-MS—electron ionization, EI, and chemical
ionization, CI) and nuclear magnetic resonance (NMR—1H and13C). Three epoxy acids, 15,16-epoxy-9,12-octadecadienoic, 9,10-epoxy-12-octadecenoic and 9,10-epoxy-octadecanoic, were found.
Hydroxy acids present included a C-22 homologue of lesquerolic acid (16-hydroxy-12-docosenoic acid) and 14,15-dihydroxy-tricosanoic
acid. Other minor ocmponents included four sterols, brassicasterol, campesterol, β-sitosterol and stigmasterol, and a series
of saturated and unsaturated fatty acids up to C30.
Visiting postdoctoral scientist sponsored by the government of India. 相似文献
102.
玻璃钢复合材料基体树脂的发展现状 总被引:8,自引:4,他引:8
本文主要介绍玻璃钢复合材料基体树脂近几年发展情况,介绍基体树脂改性和应用,主要包括:不饱和聚酯树脂、环氧树脂、乙烯基酯树脂、酚醛树脂,还简单介绍了热塑性基体树脂及应用。 相似文献
103.
An aromatic rich, amine cured epoxy network (initial glass transition temperature 250 °C), was irradiated in air (pressure 0.22 MPa), at 30 and 120 °C, by gamma rays with two dose rates 2 and 20 kGy/h, for doses upto 70 MGy. The following characteristics were recorded, thickness of oxidised layer (TOL) from IR microspectrophotometry, flexural strength σR, toughness KIC and glass transition temperature Tg. σR decreases from 120 MPa to about 40 MPa in the most degraded samples. This decrease is sharply linked to TOL showing the key role of the oxidised layer in crack initiation. KIC decreases from 0.7 to 0.55 MPa m1/2. Data are too much scattered to allow a kinetic study but it appears that, in the early period of exposure, KIC decreases more rapidly at 120 °C than at 30 °C. Tg decreases from 250 to 140 °C in the most degraded samples, and the decrease is faster at 30 °C than at 120 °C. The decrease of Tg is attributed to a predominant chain scission process. The decrease of KIC can be attributed to a combination of chain scission and physical ageing or chain scission and crosslinking. A relationship between Tg and the number of chain scissions, derived from the Di Marzio's theory, is proposed. 相似文献
104.
105.
An epoxy–cardanol resin was developed using epichlorohydrin, bisphenol-A and cardanol. On evaluation it was found that epoxy–cardanol resin exhibits better properties as compared to epoxy resin in terms of increase in tensile strength, elongation, bond with steel and lowering of water vapour transmission of the film. The improvement in these properties indicated that the paints based on modified resin would be more durable than the epoxy based paints. Accordingly, paints were formulated using the developed resin and their performance were compared with their counterparts made with unmodified epoxy resin. Zinc powder, zinc phosphate, micaceous iron oxide and synthetic iron oxide were used as pigments along with fillers, additives and an aromatic polyamine adduct hardener. For both types of paints similar doses of pigments and additives were used. Physico-mechanical properties, chemical resistance and corrosion protection efficiency of the formulated paints were determined. It was found that the anticorrosive properties of epoxy–cardanol resin based paints are superior to that of the paints formulated with the unmodified epoxy resin. Micaceous iron oxide based paints in epoxy–cardanol resin showed the best performance followed by zinc phosphate based paints. It is concluded that the developed resin is a better binder media for the formulation of paints. 相似文献
106.
107.
108.
C. K. W. Ip C. K. Kwong H. Bai Y. C. Tsim 《The International Journal of Advanced Manufacturing Technology》2003,22(5-6):417-423
Epoxy dispensing is a popular way to perform microchip encapsulation for chip-on-board (COB) packages. However, the determination of the proper process parameters setting for a satisfactory encapsulation quality is difficult due to the complex behaviour of the encapsulant during the dispensing process and the inherent fuzziness of epoxy dispensing systems. Sometimes, the observed values from the process may be irregular. In conventional regression models, deviations between the observed values and the estimated values are supposed to have a probability distribution. However, when data is scattered, the obtained regression model has too wide of a possibility range. These deviations in processes such as epoxy dispensing can be regarded as system fuzziness that can be dealt with satisfactorily using a fuzzy regression method. In this paper, the fuzzy linear regression concept with fuzzy intervals and its application to the process modelling of epoxy dispensing for microchip encapsulation are described. Two fuzzy regression models, expressing the correlation between various process parameters and the two quality characteristics, respectively, were developed. Validation experiments were performed to demonstrate the effectiveness of the method for process modelling. 相似文献
109.
110.
聚氨酯改性环氧树脂光学结构胶的研制 总被引:5,自引:1,他引:5
采用自制的端异氰酸基聚醚型聚氨酯预聚体对环氧树脂进行改性,对其添加量对改性树脂的性能的影响进行了考察,并与A-12胶黏剂的性能做了综合对比。结果表明环氧树脂增韧改性后对多种材料都具有良好的粘接性能,其中冲击强度由未改性时的12.1kJ/m^2提高到24.4kJ/m^2,剥离强度由1.4kN/m提高到3.4kN/m,断裂伸长率由5.2%提高到14.8%;其耐高低温交变性能好,-60~100℃循环5次玻璃未炸裂,并具有优异的耐介质性能。 相似文献