Oscillatory crack tip triangular elements for finite element analysis of interface cracks

In this paper a special crack tip element has been developed in which displacements and stresses have the same behaviour as those of bi‐material interface cracks with open tips. The element degenerates into a traditional triangular quarter point element in cases of homogeneous cracks. An isoparametric co‐ordinate system (ρ, t) is defined in this study, and numerical techniques using these co‐ordinates to evaluate Jacobian matrices, shape function derivatives, and element stiffness matrices are developed. Also, equations calculating the complex stress intensity factor using displacements are obtained in this study. Numerical results are in good agreement with known analytical solutions in two examples. Copyright © 2003 John Wiley & Sons, Ltd.     

A new curvature technique calculation for surface tension contribution in PLIC-VOF method

The volume of fluid (VOF) methods have been used for numerous numerical simulations. Among these techniques used to define the moving interface, the piecewise linear interface reconstruction (PLIC-VOF) is one of the most accurate. A study of the superficial tension impact on two-phase flow with free surface is presented. A new method based on direct staggered grid is developped to include surface tension in PLIC-VOF. The new numerical curvature calculation method doesn't need smoothed colour function and leads to less “spurious current”. This technique is applied to the calculus of surface tension force in the case of the rise of air bubble in viscous liquid and the fall of liquid drop in the same liquid on free surface. Droplets, thin layer and capillarity waves are observed after the free surface rupture for different Bond number. The influence of surface tension calculus is then obvioused and when the drop hit the free surface, wavelets propagate toward the virtual boundaries imposed.     

Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au

Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.     

WINDOWS系统中高效串行通信的实现

介绍了windows环境下串行通信的核心，并以VC 为开发工具给出了I／O函数与API通信函数实现串行通信的具体编程步骤。     

Wood inspection with non-supervised clustering

Abstract. The appearance of sawn timber has huge natural variations that the human inspector easily compensates for mentally when determining the types of defects and the grade of each board. However, for automatic wood inspection systems these variations are a major source for complication. This makes it difficult to use textbook methodologies for visual inspection. These methodologies generally aim at systems that are trained in a supervised manner with samples of defects and good material, but selecting and labeling the samples is an error-prone process that limits the accuracy that can be achieved. We present a non-supervised clustering-based approach for detecting and recognizing defects in lumber boards. A key idea is to employ a self-organizing map (SOM) for discriminating between sound wood and defects. Human involvement needed for training is minimal. The approach has been tested with color images of lumber boards, and the achieved false detection and error escape rates are low. The approach also provides a self-intuitive visual user interface. Received: 16 December 2000 / Accepted: 8 December 2001 Correspondence to: O. Silvén     

An anti-plane crack perpendicular to the weak/micro-discontinuous interface in a bi-FGM structure with exponential and linear non-homogeneities

Treated was an anti-plane crack perpendicular to the interface of an exponential-type FGM strip bonded to another linear-type FGM substrate with infinite thickness. Through Fourier integral transform, the problem was reduced as a Cauchy singular integral equation, which was further solved numerically by the Lobatto–Chebyshev collocation method. Based on the numerical solution, the effects of the geometrical and physical parameters on the stress intensity factor (SIF) were analyzed and the following conclusions were obtained: (a) A notable discrepancy between the interface-perpendicular crack and the interfacial one is that, to reduce the weak-discontinuity of interface or to make the interface micro-discontinuous will not necessarily decrease the SIF of the former, but will surely decrease that of the latter. (b) When a crack tip is situated very near to the interface (or free surface), its SIF will be high and totally dominated by the interface (or free surface). (c) To increase the stiffness of the FGM on one side of the interface is beneficial to preventing the crack on the other side from growing toward the interface. Besides, some practical suggestions were further given for material design in the field of composites.     

码分多址（CDMA）技术和公用空中接口综述

本文主要讨论数字移动通信中扩频码分多址技术，阐明了ＣＤＭＡ体制的优越之外，分析了ＣＤＭＡ的关键技术，全面介绍了ＣＤＭＡ系统设计的基本原则和ＩＳ－９５－Ａ空中接口标准的含义。     

气泡－水相界面上传质过程的自相似分析解

应用自相似方法求解气泡－水相界上的传质问题，并获得了计算相界面上传质量的表达式。     

液相对流对固液界面稳定性的影响

以模型合金丁二腈－乙醇的强制性晶体生长为基础，利用自行研制的液相对流驱动装置，详细考查了液相自然对流及强迫对流作用下，模型合金平界面失稳的动态生长过程，证实了液相的流动加快了液相温度与浓度分布的均匀化，从而增强了液／固界面的稳定性。并且随流动速度的增加，界面稳定性提高。