Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

During the reflowing of Sn-9Zn solder ball grid array (BGA) packages with Au/Ni/Cu and Ag/Cu pads, the surface-finished Au and Ag film dissolved rapidly and reacted with the Sn-9Zn solder to form a γ₃-AuZn₄/γ-Au₇Zn₁₈ intermetallic double layer and ε-AgZn₆ intermetallic scallops, respectively. The growth of γ₃-AuZn₄ is prompted by further aging at 100°C through the reaction of γ-Au₇Zn₁₈ with the Zn atoms dissolved from the Zn-rich precipitates embedded in the β-Sn matrix of Sn-9Zn solder BGA with Au/Ni/Cu pads. No intermetallic compounds can be observed at the solder/pad interface of the Sn-9Zn BGA specimens aged at 100°C. However, after aging at 150°C, a Ni₄Zn₂₁ intermetallic layer is formed at the interface between Sn-9Zn solder and Ni/Cu pads. Aging the immersion Ag packages at 100°C and 150°C caused a γ-Cu₅Zn₈ intermetallic layer to appear between ε-AgZn₆ intermetallics and the Cu pad. The scallop-shaped ε-AgZn₆ intermetallics were found to detach from the γ-Cu₅Zn₈ layer and float into the solder ball. Accompanied with the intermetallic reactions during the aging process of reflowed Sn-9Zn solder BGA packages with Au/Ni/Cu and Ag/Cu pads, their ball shear strengths degrade from 8.6 N and 4.8 N to about 7.2 N and 2.9 N, respectively.     

高斯光束传输理论在半导体激光器耦合中的应用

在TO封装激光器生产过程中,激光器和光纤在耦合时耦合功率与耦合位置呈现一定的关系。针对该过程中出现的这一现现象。利用高斯传输定理、模匹配原理和矩阵光学的理论加以分析和解释,得到对TO封装激光器的设计和生产具有指导意义的结论。     

铝/镍/铜UBM厚度对SnAgCu焊点的力学性能及形貌影响

研究了倒装芯片中UBM制备和焊球回流工艺流程。通过改变阻挡层Ni和浸润层Cu的厚度,结合推拉力测试实验,探究了SnAgCu焊点剪切强度的变化规律。研究结果表明,UBM中阻挡层Ni对SnAgCu焊点的力学性能影响最大,而浸润层Cu厚度的增加也能提高SnAgCu焊点的力学性能。进一步对推拉力实验后的焊点形貌进行了SEM观察和EDS分析,得到了焊盘剥离、脆性断裂、焊球剥离、韧性断裂四种不同的焊点失效形式,代表着不同的回流质量,而回流质量主要由UBM的成分和厚度决定。研究结果为倒装焊工艺的优化提供了理论指导。     

粒子群优化BP神经网络的激光铣削质量预测模型

为了有效地控制激光铣削层质量,建立了激光铣削层质量（铣削层宽度、铣削层深度）与铣削层参数（激光功率、扫描速度和离焦量）的BP神经网络预测模型。采用粒子群算法优化了BP神经网络的权值和阈值,构建了基于粒子群神经网络的质量预测模型。所提出的PSO-BP算法解决了一般BP算法迭代速度慢,且易出现局部最优的问题,并以Al2O3陶瓷激光铣削质量预测为例,进行算法实现。仿真结果表明:提出的PSO-BP算法迭代次数大大减少,且预测误差明显减少。所构建的质量预测模型具有较高的预测精度和实用价值。     

一种应用于12 GHz的AlN多层陶瓷外壳

以AlN材料为陶瓷基材,采用陶瓷绝缘子的射频传输端口结构及陶瓷焊球阵列封装形式,结合多层陶瓷加工工艺,设计并制备了一款可封装多个芯片的X波段AlN陶瓷外壳。采用应力仿真软件对外壳进行结构设计,利用电磁仿真软件对该外壳的射频端口进行仿真优化。采用微带线直接穿墙形式,设计了共面波导-带状线-共面波导的射频传输结构,并与陶瓷外壳进行一体化设计和制作。利用GSG探针对外壳样品进行测试,实测结果表明,在0~12 GHz频段内,外壳射频端口的插入损耗不小于-0.5 dB,回波损耗不大于-15 dB,AlN一体化外壳尺寸为10.25 mm×16.25 mm×4 mm,可广泛应用于高频高速信号一体化封装领域。     

高速铣削工件表面粗糙度遗传-BP神经网络建模

遗传算法作为一种高效,并行的全局搜索优化方法,非常适合用于BP神经网络学习率的优化.文中通过基于遗传算法和BP神经网络提出了遗传-BP神经网络.以实验1、实验2、实验5、实验6、实验9、实验11、实验13和实验15下的高速铣削试验数据构建用于高速铣削工件表面粗糙度建模的训练样本对,并用回归的高速铣削工件表面粗糙度预测模...     

RCS测量雷达定标误差分析

RCS测量雷达在宽频带对目标进行RCS测量时,为了能得到准确目标的RCS值,必须对雷达系统进行标定。将气球悬挂标准金属球作为标准定标体,气球的RCS、定标球的加工误差对标定结果有较大影响。进行了误差分析,并提出改进措施,以提高RCS测量雷达系统的校准精度。     

Phthalocyanine‐Based 2D Conjugated Metal‐Organic Framework Nanosheets for High‐Performance Micro‐Supercapacitors

2D conjugated metal‐organic frameworks (2D c‐MOFs) are emerging as a novel class of conductive redox‐active materials for electrochemical energy storage. However, developing 2D c‐MOFs as flexible thin‐film electrodes have been largely limited, due to the lack of capability of solution‐processing and integration into nanodevices arising from the rigid powder samples by solvothermal synthesis. Here, the synthesis of phthalocyanine‐based 2D c‐MOF (Ni₂[CuPc(NH)₈]) nanosheets through ball milling mechanical exfoliation method are reported. The nanosheets feature with average lateral size of ≈160 nm and mean thickness of ≈7 nm (≈10 layers), and exhibit high crystallinity and chemical stability as well as a p‐type semiconducting behavior with mobility of ≈1.5 cm² V^?1 s^?1 at room temperature. Benefiting from the ultrathin feature, the nanosheets allow high utilization of active sites and facile solution‐processability. Thus, micro‐supercapacitor (MSC) devices are fabricated mixing Ni₂[CuPc(NH)₈] nanosheets with exfoliated graphene, which display outstanding cycling stability and a high areal capacitance up to 18.9 mF cm^?2; the performance surpasses most of the reported conducting polymers‐based and 2D materials‐based MSCs.     

Cu引线超声键合FAB工艺及影响研究

通过对50μm直径铜引线超声键合过程中烧球工艺参数的优化,分析了各参数对烧球质量的影响及原因,并通过键合试验重点讨论了铜球表面质量、形球尺寸等对键合质量的影响.