Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy‐dispersive X‐ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre‐existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.     

真空烧结工艺应用研究

在功率混合集成电路中,对功率芯片的组装要求热阻小和可靠性高,在这方面传统的芯片组装方法如银浆导电胶粘结或者回流焊接往往不能满足要求.介绍了功率芯片的一种新的组装工艺--真空烧结工艺,并对工艺实施过程中影响质量的因素以及解决办法进行了论述.通过试验和生产验证,证明真空烧结工艺解决了生产中存在的空洞较多和热阻较大等质量隐患...     

A procedure for the simulation of fatigue crack growth in adhesively bonded joints based on the cohesive zone model and different mixed-mode propagation criteria

This work deals with the simulation of the fatigue crack growth (FCG) in bonded joints. In particular a cohesive damage model is implemented in the commercial software Abaqus, in order to take into account for the damage produced by fatigue loading. The crack growth rate is evaluated with different Paris-like power laws expressed in terms of strain energy release rate. The crack growth rate is then translated into a variation of the damage distribution over the cohesive zone setting an equivalence between the increment of crack length and the increment of damage. The model takes also into account mixed mode I/II conditions. In this work the validity of the model is tested by comparison with theoretical trends for conditions of pure mode I, pure mode II and mixed mode loading. In the case of mixed mode conditions, different models are implemented for the crack growth rate computation. The results of the model are in very good agreement with the expected trends, therefore the model is adequate to simulate the fatigue crack growth behaviour of bonded joint.     

Effect of pulse voltage and aluminum purity on the characteristics of anodic aluminum oxide using hybrid pulse anodization at room temperature

Most of the anodic aluminum oxide (AAO) templates are performed by potentiostatical method at 0-10 °C to inhibit the Joule's heat enhanced dissolution in aluminum oxide for well-ordered cell configuration. In this article, we propose the hybrid pulse anodization (HPA) method with effective suppression of Joule's heat generation to fabricate AAO at room temperature. Effects of purity of aluminum (Al) foils and pulse voltage on the evolution of pore characteristics have been investigated. The AAO morphology is captured by scanning electron microscope and analyzed via gray-scale imaging in order to identify the pore size distribution. The increased applied potential results in the widened pores and non-uniform cell arrangement due to the increased current density and variation. Moreover, low-purity Al foils lead to the reduced AAO distribution uniformity owing to the uneven electric field induced pits on the Al surface for inferior pore arrangement. Extending both the positive and negative pulse period from 1 s to 5 s during HPA can enhance the distribution uniformity of AAO from high-purity Al by up to about 95%. In addition, the relationship between AAO configuration and Al purity and pulse voltage is further discussed and established.     

Soft magnetic properties of hybrid ferromagnetic films with CoFe, NiFe, and NiFeCuMo layers

Two-layered ferromagnetic alloy films (NiFe and CoFe) with intermediate NiFeCuMo soft magnetic layers of different thicknesses were investigated to understand the relationship between coercivity and magnetization process by taking into account the strength of hard-axis saturation field. The thickness dependence of H_EC (easy-axis coercivity), H_HS (hard-axis saturation field), and χ (susceptibility) of the NiFeCuMo thin films in glass/Ta(5 nm)/[CoFe or NiFe(5 nm-t/2)]/NiFeCuMo(t = 0, 4, 6, 8, 10 nm)/[CoFe or NiFe(5 nm-t/2)]/Ta(5 nm) films prepared using the ion beam deposition method was determined. The magnetic properties (H_EC, H_HS, and χ) of the ferromagnetic CoFe, NiFe three-layers with an intermediate NiFeCuMo super-soft magnetic layer were strongly dependent on the thickness of the NiFeCuMo layer.     

高速公路桥梁主要病害成因及其对策探讨

通过对廊涿高速沿线桥的普查,系统的归纳了公路桥梁的主要病害及其成因,并给出合理的维修及养护建议,以此来保证高速公路桥梁的使用寿命。     

钢牛腿设计及工程实例

结合工程实例,通过数据对比进行了牛腿端部截面优化,并为钢牛腿设计提供了较为清晰的计算思路,从而有利于将此项设计转为程序化,提高设计速度及资源利用率。     

一种实用的毫米波大规模MIMO混合预编码算法

数字模拟混合预编码可以用较少的射频逼近全数字预编码的性能,可以用来解决毫米波大规模MIMO系统中由于射频链路过多造成的硬件损耗和校准问题。为解决传统混合预编码结构难以实现的缺点,该文的混合预编码研究基于一种简单的固定子连接结构。推导了系统可达速率最大,模拟预编码矩阵应满足的条件,从而将混合预编码矩阵设计问题转化为优化问题。采用鸟群算法(BSA)解决此优化问题,求得最优的预编码矩阵。针对模拟移相器分辨率有限的情况,提出一种直接量化的解决方案和一种基于改进的离散BSA的解决方案。仿真结果表明,所提算法能够基于简单结构实现较好的性能;移相器分辨率有限情况下,所提的两种解决方案都是有效的,且基于离散BSA的方案在分辨率较低时性能更优。     

Ni改性GNSs对SnAgCuRE/Cu钎焊接头热老化特性的影响

以Sn2.5Ag0.7Cu0.1RE0.05Ni无铅钎料合金为研究对象,基于石墨烯纳米片（GNS）独特的结构、优异的物理性能和力学性能,以其为复合钎料的增强相,开展基于Ni改性GNSs（Ni-GNSs）增强SnAgCuRE系复合钎料/Cu的钎焊和钎焊接头热老化试验,探讨Ni-GNSs对复合钎料组织及钎焊接头热老化失效断裂机制的影响。结果表明：Ni-GNSs的加入,抑制了复合钎料的线膨胀,产生晶格畸变,导致位错产生,金属间化合物（IMC）颗粒分布在位错线附近,与位错发生交互作用,阻碍位错运动,强化复合钎料,进而强化复合钎料接头。随着热老化时间延长,钎焊接头界面IMC层厚度增加,剪切强度降低;其中,添加0.05%（质量分数）GNSs的复合钎料接头剪切强度降幅最小,为8.9%,且热老化384 h后,其剪切强度仍高于Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu合金接头热老化前的剪切强度。Ni-GNSs的加入,使复合钎料钎焊接头界面IMC的生长系数明显降低,有效缓解了复合钎料/Cu钎焊接头热老化过程中力学性能的降低,进而改变复合钎料/Cu钎焊接头的热老化失效断裂机制,最终影响接头的可靠性。Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头的断裂位置由热老化前的钎缝区向钎缝/界面IMC移动,变为韧脆混合断裂;而添加0.05%（质量分数）GNSs复合钎料接头的断裂位置均在钎缝区,为韧性断裂,钎焊接头可靠性较高。     

地震作用下基础隔震框剪结构竖向连续倒塌可靠度分析

针对地震作用下RC串联滚轴隔震结构受力特征和损伤特点,提出适用于串联滚轴隔震结构柱的新型连接节点。通过开展1/2缩尺拟动力试验,研究采用新型连接节点的滚轴隔震结构柱在不同强度地震作用下的抗震性能。构造适用于滚轴隔震结构的一致危险设计谱,根据结构位移限值要求对滚轴隔震支座进行设计,通过数值模拟验证滚轴隔震支座的减震效果;结合不同超越概率的一致危险设计谱,分别选择地震波对装配式滚轴隔震结构柱进行拟动力试验研究,分析不同强度地震作用下装配柱和现浇柱的破坏形态、滞回曲线、刚度退化、耗能等抗震性能指标。研究结果表明：在超越概率为10%时,通过对非隔震结构柱和滚轴隔震结构柱进行数值模拟,计算得到剪力比为0.5,且通过试验研究发现,在超越概率为2%时,装配式滚轴隔震结构柱损伤指数为0.279,滚轴隔震支座发挥了良好的减震效果,装配柱在罕遇地震作用下发生轻微损伤;在超越概率为2%时,现浇柱最大裂缝宽度发展至1.8 mm,装配柱最大裂缝宽度发展至1.6 mm;对比骨架曲线、刚度退化、累积滞回耗能发现,装配柱承载力、初始刚度和累积滞回耗能较现浇柱略好。