Determination of the metal/die interfacial heat transfer coefficient and its application in evaluating the pressure distribution inside the casting during the high pressure die casting process

Abstract

High pressure die casting (HPDC) experiments were conducted on a 650 t cold chamber die casting machine to study the interfacial heat transfer behaviour between casting and die. A 'step shape' casting and two commercial alloys namely ADC12 and AM50 were used during the experiments. Temperature and pressure measurements were made inside the die and at the die surface. The metal/die interfacial heat transfer coefficient (IHTC) was successfully determined based on the measured temperature inside the die by solving the inverse heat transfer problem. The IHTC was then used as the boundary condition to determine the 3-D temperature field inside the casting. Based on the predicted temperature distribution, the pressure distribution inside the casting was evaluated by assuming that the transferred pressure from the plunger tip of the injection side to the casting is primarily influenced by the solid fraction of the casting. Reasonable agreement was found between the determined pressure values and the measured pressures at the die surface of the casting.     

A novel mathematical procedure to evaluate the effects of surface topography on the interfacial state of stress. Part II. Verification of the method for scarf interfaces

A mathematical procedure was developed to utilize the complementary energy method, by minimization, in order to obtain an approximate analytical solution to the 3D stress distributions in bonded interfaces of dissimilar materials. The stress solutions obtained predict the stress jumps at the interfaces, which cannot be captured by the current FEA methods. As a novel method, the penalty function is used to enforce the displacement boundary conditions at the interfaces. Furthermore, the mathematical procedure developed enables the integration of different interfacial topographies into the solution procedure. In order to incorporate the effects of surface topography, the interface is expressed as a general surface in Cartesian coordinates, i.e. F(x, y, z) = 0. In this paper, the scarf interface problem, i.e. y = x/2 surface is considered for verification of the method by comparison with finite element analysis (FEA) results. Comparison of the results reveals our new mathematical procedure to be a promising and efficient method for optimizing interface topographies.     

Surface characteristics and adhesion performance of black oxide coated copper substrates with epoxy resins

Black oxide is a conversion coating applied onto the copper substrate to improve its interfacial adhesion with polymeric adhesives. A comprehensive study is made to characterize the black oxide coating using various characterization techniques, including SEM, XPS, AFM, XRD, Auger electron spectroscopy, TEM, D-SIMS, RBS and contact angle measurements. It was found that the oxide coating consisted of cupric and cuprous oxide layers from the top surface to inside. The cuprous oxide layer was formed on the copper crystal surface, on which densely-packed fibrillar cupric oxide grew continuously until saturation. The cupric oxide had a fibrillar structure with high roughness at the nanoscopic scale, whereas the cuprous oxide was rather flat and granular. There was a continuous change in oxide composition with no distinct boundary between the two oxide layers. The bond strength between the epoxy resin and the oxide coated copper substrate increased rapidly at a low level of oxide thickness, and became saturated at thicknesses greater than about 800 nm. There were similar dependences of bond strength on surface roughness, oxide thickness especially of cupric oxide and surface energy, reflecting the importance of these surface characteristics in controlling the interfacial adhesion.     

Effects of XeCl excimer laser treatment of Vectran® fibers and their adhesion to epoxy resin

Vectran^® fibers, made using liquid crystalline polyester, were treated with pulsed XeCl excimer laser (308 nm) to alter their surface characteristics and, thus, improve their adhesion to epoxy resin. The treatments were carried out in air using varying numbers of pulses at different laser fluences. The effects of laser treatment on the fiber surface topography, chemistry and wettability have been investigated. Fiber/epoxy resin interfacial shear strength was measured using the microbead test. The surface roughness was characterized qualitatively and quantitatively using scanning electron microscopy (SEM) and atomic force microscopy (AFM), respectively. Changes in the surface energy were characterized using the Wilhelmy technique. Based on the SEM micrographs, the threshold fluence for the formation of surface structure was found to be less than 36 mJ/(pulse ? cm²). The laser treatments at fluences higher than the threshold fluence introduced periodic roll (wavy) structures on the fiber surface transverse to the fiber axis. From the AFM results, the fiber surface roughness was found to increase by up to 3.5 times the control fiber after the laser treatment. The dispersion component of the surface energy decreased, while the acid–base component of the surface energy increased significantly from 0 to 8.8 mJ/m² after the laser treatment. The Vectran^® fiber/epoxy resin IFSS increased by up to 75% after the laser treatment. This improvement is mainly attributed to higher surface roughness of the fiber.     

Thermodynamic and kinetic analysis of interfacial reaction between CBN and titanium activated Ag–Cu alloy

Abstract

Thermodynamic and kinetic analysis was performed in order to study the interfacial reaction mechanism of cubic boron nitride (CBN) abrasive grains and Ti activated Ag–Cu filler alloy during high temperature brazing. Meanwhile, microstructure of the interfacial layer was experimentally detected using scanning electron microscope (SEM), energy dispersion spectrometer (EDS) and X-ray diffraction (XRD) in the present paper. The results indicate that according to the thermodynamic theory, the interfacial reaction has been proved feasible, and during brazing the special active element Ti concentrated to and reacted with the CBN abrasive to form TiB₂ and TiN, which joined hard the abrasive grain and steel substrate. Furthermore, the diffusion activation energy of the growing process in the interfacial reaction layer has discovered that the layer growth largely depends on the new formed TiN under conditions of 1153–1193 K and 5–30 min.     

Novel capacitance sensor design for measuring coating debonding: the effects of thermal-hygroscopic cycling

The effects of combined thermal and hygroscopic cycling on the adhesion performance of an epoxy coating were measured using a novel electrode sensor. The sensor is uniquely designed, consisting of a series of independent interdigitated electrode traces which are arranged parallel to the sensor edges. Coupled with single-frequency capacitance measurements, the sensor detects changes in capacitance in the adhered coating–sensor interfacial region as a function of the distance from the edge of the sensor, x. Recently, this sensor was utilized by O'Brien and co-workers to measure interfacial diffusion and the concentration profile of fluid in an adhesive joint (Int. J. Adhesion Adhesives 23, 335–338 (2003)). In the present work, large capacitance changes due to debonding and displacement of the coating by fluids at the sensor surface were used to monitor coating delamination. The apparent debond growth rate and number of cycles until failure were determined as a function of coating thickness, fluid environment and sensor surface chemistry. The results show that the coating becomes more durable as the thickness is reduced; and also that thermal and hygroscopic cycling of coatings produces different results than conventional continuous adhesion tests. This study suggests that this novel sensor or a similar design is applicable for the study of adhesion loss and interfacial diffusion processes, and could be extended to other coatings or adhesives in a variety of environments. General trends about coating durability are also discussed.     

Adhesion characteristics of underfill resins with flip chip package components

Of fundamental importance to enhance the reliability of flip chip on board (FCOB) packages is to avoid the initiation and propagation of various interfacial failures and, therefore, robust interfacial bonds between the underfill and other components are highly desired. In the present study, the interfacial bond strengths of both conventional and no-flow underfill resins with die passivation, eutectic solder and epoxy solder mask are measured using the button shear test. The surface characteristics of these substrates are analyzed using various techniques, including optical scanning interferometry, scanning electron microscopy and contact angle measurements. It is found that the interfacial bond strength of the underfill with the eutectic solder is far weaker than of other interfaces. The degradation of underfill bond strength with silicon nitride passivation, eutectic solder and polymeric solder mask surfaces is enhanced in the presence of solder flux, and cleaning the fluxed surface with a saponifier is an efficient means to restore the original interfacial adhesion. The necessity of post-solder reflow cleaning is shown by performing thermal cycle tests on FCOB packages with different extents of flux residue. Distinctive solder failure behaviors are observed for the packages with and without post-solder reflow cleaning from the cross-sectional analysis.     

Surface energy parameters of polymers from directly measured interfacial tension with probe polymers

The surface energy parameters of polycaprolactone (PCL) were determined at 160 and 180^°C from its interfacial tensions with probe polymers. The probe polymers were polystyrene (PS) and poly(methyl methacrylate) (PMMA). This method is based on the well-known relationship between blend interfacial tension and polymer surface energy parameters, and requires the use of at least two probe polymers, whose surface energy parameters at the temperature of interest have been independently determined. It also requires direct measurement of blend interfacial tension at the high temperatures of interest. The interfacial tensions were obtained from direct measurements by the imbedded fiber retraction method. The following results were obtained: (a) γ ^P (polar component) values for PCL was within the range reported using other methods, (b) γ ^D (dispersion component) values for PCL decreased with increasing temperature, consistent with expectations and (c) γ ^D values for PCL were on the high end, but still within the rather broad range of reported values.     

Characterization of ramie fiber/soy protein concentrate (SPC) resin interface

Ramie fiber/soy protein concentrate (SPC) polymer (resin) interfacial shear strength (IFSS) was measured using the microbond technique. To characterize the effect of plasticization, SPC resin was mixed with glycerin. Fibers were also treated with ethylene plasma polymer to reduce fiber surface roughness and polar nature to control the IFSS. Fiber surfaces after ethylene plasma polymerization, and fracture surfaces of specimens before and after the microbond tests were characterized using a scanning electron microscope (SEM). Some specimens were also characterized using electron microprobe analyzer (EMPA) to map the residual resin on the fiber surface after the microbond test. Effects of glycerin concentration in SPC and ethylene plasma fiber surface treatment time on the IFSS were investigated. Preparation of SPC resin requires a large amount of water. As expected, during drying of SPC resin, the microdrops shrank significantly. The high IFSS values indicate strong interfacial interaction in the ramie fiber/SPC resin system. This strong interfacial interaction is a result of a highly polar nature of both the ramie fiber and the SPC resin and rough fiber surface. Ethylene plasma polymerization was used to control the IFSS. The plasma polymer imparted a polyethylene-like, non-polar polymer coating on the fiber surface. As a result, the fiber surface became smoother compared to the untreated fiber. Both fiber smoothness and non-polar nature of the coating reduced the ramie fiber/SPC resin IFSS. Plasticization of the SPC resin by glycerin also decreased the adhesion strength of the ramie fibers with the SPC resin. The load-displacement plots for IFSS tests obtained for different resin and fiber combinations indicate different interfacial failure modes.     

Effect of Atmospheric Plasma Treatment on Carbon Fiber/Epoxy Interfacial Adhesion

In this work the effect of atmospheric plasma treatment on carbon fiber has been studied. The carbon fibers were treated for 1, 3 and 5 min with a He/O₂ dielectric barrier discharge atmospheric pressure plasma. The fiber surface morphology, surface chemical composition and interfacial shear strength between the carbon fiber and epoxy resin were investigated using atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and the single fiber composite fragmentation test. Compared to untreated carbon fibers, the plasma treated fiber surfaces exhibited surface morphological and surface composition changes. The fiber surfaces were found to be roughened, the oxygen content on the fiber surfaces increased, and the interfacial shear strength (IFSS) improved after the atmospheric pressure plasma treatment. The fiber strength showed no significant changes after the plasma treatment.