基于WEB的异地集成协同环境的设计与实现

计算机支持的协同工作（CSCW）在先进制造技术中的应用，是实现敏捷制造，分散网络化制造的关键技术之一，这里概述了CSCW的概念与实质，并着重介绍了面向先进制造技术的CSCW系统-ICE（集成协同环境）的结构及其实现的关键技术。     

制造资源计划与计算机排样的集成研究

提出了一种将计算机排样与制造资源计划（MRPⅡ）进行有效集成的方法。该方法首先将MRPⅡ划分为多项信息系统子应用，然后通过分析计算机排样系统各输入输出数据流与这些子应用的关系，确认与之进行集成的子应用，并对集成运行方式进行分析。     

Influence of manganese rate on structural,optical and electrochemical properties of CeO2 thin films deposited by spray pyrolysis: Supercapacitor applications

The present work aimed to investigate the electrochemical properties of ITO substrates in propylene carbonate (PC) with 0.5 mol/L lithium perchlorate (LiClO₄) medium in the presence of elaborated thin films of cerium dioxide pure and doped with manganese at varying percentages. Ce_1–xMn_xO₂ (x = 0 wt%, 2 wt%, 4 wt% and 6 wt%) were successfully deposited by the spray pyrolysis (SP) technique on the glass substrate and ITO at 450 °C. The effects of manganese (Mn) doped thin films Ce_1–xMn_xO₂ were studied and investigated by using different analyses namely X-ray diffraction (XRD) analysis, Raman spectroscopy method, UV–Vis spectrophotometer technique, atomic force microscopy (AFM) analysis and electrochemical properties. XRD data obtained present a polycrystalline with a face-centred cubic structure of fluorite type. Raman results of undoped and Mn doped thin films show two peaks at 465 and 600 cm^?1, due to the formation of extrinsic oxygen vacancies by the incorporation of Mn into Ce_1–xMn_xO₂ matrix. Energy dispersive spectroscopy (EDS) data show the presence of Ce, O, and Mn elements in the elaborated films. The AFM results reveal that the surface roughness decreases with increasing Mn rate. Further, band gap energy of thin films decreases with increasing in Mn rate due to the formation of defect state between valence and conduction band. The storage capacity of the elaborated Ce_1–xMn_xO₂/ITO/PC + LiClO₄ electrode reaches a maximum of 1.997 mF in the presence of 6 wt% of Mn.     

全球工业芯片产业现状及对我国工业芯片发展的建议

工业芯片已经成为新工业革命和新基础设施建设的关键支撑,工业芯片的研发和制造水平是衡量一个国家整体制造业竞争力的真正试金石。但是,目前我国工业芯片产业在发展模式、产业链上下游协同合作,共性技术研发、配套服务体系建设以及前沿技术布局等方面均面临着很多不足与问题。本文将通过分析全球工业芯片发展特点、现状及基本格局、我国工业芯片市场规模和需求,以及其存在的主要问题,提出我国工业芯片发展的建议,为我国工业芯片产业发展及其能力提升提供一定参考。     

基于SDN的城域综合IP承载网络架构研究

目前移网和固网业务采用独立的网络进行控制和承载,存在结构复杂、层级冗长、管理维护复杂等诸多问题,研究了基于SDN的城域综合承载网络的参考架构及网络转发面、控制面和管理面的技术要求,给出了演进过渡方案。研究成果有利于运营商统筹整合现有固网资源和移网资源,发挥协同效应,扩大网络覆盖范围,提高网络利用率,同时可节约网络建设和运营成本,实现固网和移网业务有效益的规模化发展。     

关于PLC控制的机电一体化设备的安装及调试探析

不同于以前的手动操作时代,在当下自动化技术运用广泛的背景下,各种不同功能和用途的机电一体化设备正在行业发展的各大领域中得到推广和应用。因此,为了让众多机电一体化设备更好地运行,并有效提升机电设备的运行效率,需要专业人员在对机电一体化设备进行安装和调试时进行有效地分析,保障设备运行,降低故障率。本文会结合案实际例探讨如何对PLC控制的机电一体化设备的安装和调试进行分析。     

An approximate nondominated sorting genetic algorithm to integrate optimization of production scheduling and accurate maintenance based on reliability intervals

With the development of intelligent manufacturing, production scheduling and preventive maintenance are widely applied in industry to enhance production efficiency and machine reliability. Therefore, according to the different processing states and the physical degradation phenomena of the machine, this paper proposes an accurate maintenance (AM) model based on reliability intervals, which have different maintenance activities in diverse intervals and overcome the shortcoming of the single reliability threshold maintenance model used in the past. Combining the flexible job-shop scheduling problem (FJSP), an integrated multiobjective optimization model is established with production scheduling and accurate maintenance. To strengthen the ability of the evolutionary algorithm to solve the presented model/problem, we propose a novel genetic algorithm, named the approximate nondominated sorting genetic algorithm III (ANSGA-III), which is inspired by NSGA-III. To improve the performance of the Pareto dominance principle, the local search, the elite storage for the original algorithm, the approximate dominance principle, the variable neighborhood search, and the elite preservation strategy are proposed. Then, we employ a scheduling example to verify and evaluate the availability of the above three improved operations and the proposed algorithm. Next, we compare ANSGA-III against five recently proposed algorithms, representing the state-of-the-art on similar problems. Finally, we apply ANSGA-III to solve the integrated optimization model, and the results reveal that the machine can maintain higher availability and reliability when compared to other models in our experiments. Consequently, the superiority of the proposed model based on accurate maintenance of reliability intervals is demonstrated, and the optimal reliability threshold between the yellow and red areas is found to be 0.82.     

Optimizing smart manufacturing systems by extending the smart products paradigm to the beginning of life

The research objective of this work is to enhance the perception of, sensing in, and control of smart manufacturing systems (SMS) by leveraging active sensor systems within smart products during the manufacturing phase. Smart manufacturing utilizes rich process data, usually collected by the SMS (e.g., machine tools), to enable accurate tracking and monitoring of individual products throughout the process chain. However, until now, the to-be-manufactured product itself has not contributed to the sensing and compilation of product and process data. More specifically, data measured from the product’s structure during its own fabrication. In this paper, we discuss and evaluate the opportunity to actively use the capabilities of smart products within a SMS in terms of technical and economic feasibility. This opportunity emerged only recently with the advancements in smart products engineering. In this research, we developed a smart product prototype and evaluated it on a SMS testbed (CPlab) with eight distinct, fully-connected manufacturing processes. The results of the conducted experiments show the possibility to uniquely identify two distinct ‘fingerprints’ of manufacturing processes solely based on data provided by sensors within the smart product itself. The sensor data was collected directly from the smart product before manufacture was completed, yet after the intended sensor functionality during the product’s use phase was activated. The capability to automatically, accurately, and reliably identify process signatures and even inform the optimization of manufacturing parameters creates new opportunities for improvements in quality, scheduling, and seamless transparency across the whole value chain.     

城市综合管廊WSN中LEACH-HC协议的仿真研究

城市综合管廊是未来城市发展的重要基础设施之一.具有截面小,延伸距离长的特点.为了适应管廊的这种特殊环境,进行有效监测.对无线传感网络在管廊中的应用做了深入研究.针对LEACH协议的节点布局和簇头选举方面进行改进,提出LEACH-HC协议,以适应管廊的工作要求.通过MATLAB仿真工具与经典LEACH、SEP进行对比实验.结果表明LEACH-HC协议不仅能满足综合管廊的需求,且具有较好的生存能力.     

陶瓷基板表面金属化研究现状与发展趋势

散热基板是大功率电子元器件散热的重要通道,其导热性能将直接影响功率型电子元器件的可靠性与使用寿命。详细介绍了陶瓷作为高导热的散热基板材料,其表面金属化的技术方案及发展现状,同时指出了各种金属化方案的关键技术难点,对比分析了各类陶瓷封装散热基板的特点与性能差异,并在此基础上对陶瓷基板的发展趋势进行预测。