Implementing software metrics — the critical success factors

This paper reviews the current state of industry with regard to the introduction of software metrics. It discusses the benefits that organizations have derived from metrication, it looks at why organizations have sought to introduce metrics programmes, how they have gone about introducing those programmes and the problems that they have encountered during implementation. The review found that, on the whole, only the sanitized aspects of metrics experiences have actually been published. This seems to be especially the case with respect to practitioner resistance. Very few organizations admit to having encountered resistance during the introduction of a metrics programme. The paper also includes the results of a pilot study, conducted by the first author, which examines the attitudes that developers hold towards the introduction of software metrics. The key findings of this pilot study are that positive attitudes to metrics correlate highly with levels of education and to job satisfaction.     

计算机串行通信综述

本文着重向读者介绍目前流行的几种计算机串行通信规程，它们是ＥＩＡ－ＲＳ－２３２Ｃ、ＥＩＡ－ＲＳ－４２２Ａ、ＥＩＡ－ＲＳ－４２３Ａ、ＥＩＡ－ＲＳ－４４９、ＥＩＡ－ＲＳ－４８５、ＡＲ－ＩＮＣ－４２９等。     

微机字处理网络系统智能接口的设计

本文介绍了微机字处理系统网络联机的智能接口设计方案，采用比较简单而独特的手法，解决了通信控制和资源共享问题．     

电子称在化工生产中的应用

针对化工生产环境的特点对电子称重仪器在化工计量中的正确选择和使用作一些分析阐述。     

降低氧化铝生产中熟料折合比的探讨

在氧化铝生产过程中，熟料折合比是烧结法一项重要的综合性指标，本文通过对熟料折合比的定义、计算公式的剖析，分析了生产过程中影响熟料折合比的主要因素，对有效降低熟料折合比的措施进行了探讨。     

自动化服务器对客户端访问的实现

用一个实例说明如何用Delphi来实现服务器对客户的访问。     

NUMERICAL ANALYSIS OF THE EFFECTS OF LOCAL HYDRODYNAMICS ON MASS TRANSFER IN HETEROGENEOUS POROUS MEDIA

Many engineering problems require the estimation of mass transfer coefficients in porous materials. In heterogeneous materials or in cases where mass transfer sites are not spatially uniform, empirical equations for mass transfer coefficients vary widely, and the origin of these differences is not well understood. In this article, we use a stochastic algorithm to model mass transfer from single particles in a two-dimensional heterogeneous packed bed. The computed mass transfer coefficients are used to generate a distribution of local Peclet numbers in the bed. Detailed hydrodynamics are then used to interpret variations in the local Peclet number. The results show clear relationships between pore structure, streamline patterns, and mass transfer rates.     

自动检测系统原理应用和发展状况的研究

自动检测系统广泛应用于各类产品的设计、生产、使用、维护等各个阶段,对提高产品性能及生产率、降低生产成本及整个生产周期成本起着重要作用。首先介绍了检测、检验以及自动检测系统的概念,其次通过自动检测系统的各个组成部分,详述了系统的工作原理,介绍了自动检测系统组建的概念、结构以及在组建中所使用的关键技术。对早期的自动检测系统和新一代自动检测系统进行了介绍,并详述自动检测系统的3个发展阶段。     

Rutile-type TiO2 thin film for high-k gate insulator

We investigated rutile-type titanium dioxide (TiO₂) films for possible use as a high-k gate insulator. The TiO₂ thin films were directly deposited on Si substrates using a RF magnetron sputtering method with a sintered oxide target. A single phase of rutile-type TiO₂ whose dielectric constant of approximately 75 was obtained when the film was deposited in an inert gas atmosphere and annealed at 800 °C in an oxidizing gas atmosphere. The oxygen ions were deficient in the as-deposited film, and consequently, a sufficient oxygen supply was needed to crystallize the film to a single phase of rutile during the post-annealing. However, the interfacial SiO₂ layer between the TiO₂ and the Si substrate simultaneously grew thicker than 2 nm. As the interfacial SiO₂ grew, the leakage current was decreased and the equivalent oxide thickness was increased, in the Au/rutile-type TiO₂/Si capacitor. Therefore, we concluded that the growth of the interfacial SiO₂ layer thicker than 2 nm is inevitable to form the single phase of rutile-type TiO₂ and to decrease the leakage.     

First-principles study of the tensile and fracture of the Al/TiN interface

Employing the density functional theory, we investigate the tensile and fracture processes of the Al/TiN(0 0 1) interface. The simulation presents directly the strain–stress relationship, the ideal tensile strength and the process of bond breaking of the system. Through the analysis of deformation, we find that the softer Al layers deform larger than the harder TiN layers during the tensile process. And fracture occurs between the interface and the sub-interface Al layers. In addition, the results show that during the tensile process, the ripple of the interfacial TiN layer decreases gradually with the increment of the strain. Charge transfer was detected from the Al to TiN layers near the interface area during the tensile process by means of charge density and density of states analyses. The charge transfer affects the fracture process. Compared to our previous study of the Al/TiN(1 1 1) interface, the Al/TiN(0 0 1) interface has smaller work of adhesion and larger tensile strength than the Al/TiN(1 1 1) interface. Our investigation shows that the fractures of the Al/TiN(0 0 1) and (1 1 1) interface systems both happen in the Al layers near the interface.