Effect of ammonia concentrations on SCC of α-brass under mode III loading

Stress corrosion cracking (SCC) of α-brass in ammonia solution was studied under mode III loading. The results showed that SCC occurred on the principal stress planes where shear stresses are zero. No SCC occurred on the maximum shear stress plane. Ammonia concentration affected fracture behaviour. When the concentration was low, many cracks with spacing of 10–150 μm were found on 45 ° planes, i.e., the principal stress planes. When the concentration was high, the cracks on 45 ° planes were not clearly visible because of serious general corrosion.     

IF钢切边质量提升控制技术

针对 IF 钢经过连退或镀锌热处理,在切边过程中由于切边质量不佳,带钢边部容易产生毛刺等缺陷,进而影响带钢边部质量的问题,通过研究切边后带钢切断面各区域比例以及切边工艺参数对切边后切断面各区域比例的影响,对圆盘剪切边工艺参数进行了优化设计;同时通过研究去毛刺辊工作原理以及亮边缺陷产生原因,对去毛刺辊的涂层和底辊辊型进行了优化设计。采取优化措施后,IF 钢的切边质量得到了改善,并彻底消除了亮边缺陷。     

TA2／A3爆炸复合界面微观断裂机制的SEM原位研究SCIEI

借助ＳＥＭ对ＴＡ２／Ａ３爆炸复合界面（包括细小波状界面，中波界面及具有再入射流熔块的大波界面）的微观断裂机制进行了动态研究。结果表明，爆炸复合界面微观断裂机制是：微裂纹在波头夹杂或再入射流熔块内及熔块和基体界面处萌生，并在裂尖应力场作用下沿与外载垂直方向扩展。同时，沿ＴＡ２／Ａ３界面产生微裂纹并在外载作用下，相互连接而扩展。     

回火处理对Fe-Mn基合金剪切模量的影响SCIEI

研究了回火温度和时间对两种成分Fe-Mn基合金剪切模量的影响。结果指出,附加Cr,Ti的合金在回火状态下ΔG G-T曲线有极小和极大两个极值,而附加Cr,Ni,W,C的合金只呈现极大值特征。这是由于Ni,W,C降低反铁磁转变点T_N造成的, 随着回火温度升高或回火时间增加,ΔG_λ效应逐渐增加。     

平行刃剪切机剪切过程的有限元仿真模拟分析

金属剪切过程是一种复杂的弹塑性大变形过程,同时还存在着应力与应变之间的物理非线性、位移与应变之间的几何非线性以及工具与试件之间的接触边界非线性等多重非线性关系。本文用计算机辅助工程(CAE)软件——高度非线性结构有限元分析软件MARC对平等刃剪切机的剪切过程进行了三维弹塑性大变形仿真模拟,探索出一种求平行刃剪切机力能参数的数值仿真模拟方法。     

滚切式双边剪剪切质量分析

分析了4种中厚板切边过程中切口缺陷的形状及其形成原因,得出防止钢板在被夹送时跑偏即可避免剪切缺陷并采取了相应对策,实施后提高了钢板成材率。     

Elastic-plastic analytical solution for centric crack loaded by two pairs of point shear forces in finite plate

1 Introduction A great number of cracks exist in metal materials. Their existence and interaction often lead to high stress concentration and become the source of weakening and failure of metal materials[1- 4]. The elastic-plastic analysis for a cracked p…     

Analysis of damage localization for ductile metal in process of shear band propagation

1 Introduction Shear localization is an important and often dominating deformation and failure mechanism for Ti and Ti alloy in dynamic loadings[1—10]. The eventual outcome of localized deformation is ductile rupture and material separation. Shear locali…     

Shear strength and aging characteristics of 63Sn−37Pb solder bumps with various solder ball and pad sizes

The shear strength and aging characteristics of 63Sn–37Pb solder bumps were characterized with variation in solder ball and UBM pad sizes. The shear strength increased with shorter effective crack size,a _effs which was determined with the solder ball and pad sizes. The shear strength of the solder bumps on Au/Ni/Cu and Ni/Cu did not change significantly with reflow time. Substantial decrease in the shear strength occurred for the solder bumps formed on Au/Ni/Cu with aging treatment, and the shear strength after aging was also related to the bump shape which was determined with the solder ball and pad sizes.     

Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds

Copper wire, serving as a cost-saving alternative to gold wire, has been used in many high-end thermosonic ball bonding applications. In this paper, the bond shear force, bond shear strength, and the ball bond diameter are adopted to evaluate the bonding quality. It is concluded that the ef/~cient ultrasonic power is needed to soften the ball to form the copper bonds with high bonding strength. However, excessive ultrasonic power would serve as a fatigue loading to weaken the bonding. Excessive or less bonding force would cause cratering in the silicon.