Effects of BiAlO3 on structure and electrical properties of K0.5Na0.5NbO3-LiSbO3 lead-free piezoceramics

(1−x)(0.948 K_0.5Na_0.5NbO₃-0.052LiSbO₃)-xBiAlO₃ (KNNLS-xBA) lead-free piezoceramics were synthesized by conventional solid state reaction method. The compositional dependence of phase structure and electrical properties of the ceramics was systemically studied. XRD patterns revealed that all the ceramic samples possessed pure perovskite structure. In addition, polymorphic phase transition (PPT) for the ceramics with BA doping could not be observed in the measuring range from room temperature to 500 °C. Within the studied range of BA addition, the ceramics with x = 0.002 represented a relatively desirable balance between the degradation of the piezoelectric properties, improvement in temperature stability and mechanical quality factor. It was found that the KNNLS-0.002BA ceramics exhibited optimum overall properties (d₃₃ = 233 pC/N, k_p = 35%, tanδ = 0.047, P_r = 27.3 μC/cm², Q_m = 56 and T_c = 349 °C), suggesting that this material should be a promising lead-free piezoelectric candidate for piezoelectric applications.     

Piezoelectric and dielectric properties of K0.5Na0.5NbO3-LiSbO3-BiScO3 lead-free piezoceramics

(1 − x) (0.95K_0.5Na_0.5NbO₃-0.05LiSbO₃)-xBiScO₃ lead-free piezoceramics have been fabricated by an ordinary pressure-less sintering process. The relationship between the BS content, phase structure, density, and piezoelectric properties and their temperature stability was discussed particularly. All compositions show a main perovskite structure, showing room-temperature symmetries of orthorhombic at x = 0, of tetragonal at 0.002 ≤ x ≤ 0.01. When 0.002 ≤ x ≤ 0.008, the ceramics have excellent electrical properties of d₃₃ = 265-305 pC/N, k_p = 45-54%, ?_r = 1346-1638, Curie temperature T_c = 315-370 °C and depolarizing temperature T_d = 315-365 °C, comparable to that of other KNN-based piezoceramics. The results indicate that the ceramics are promising lead-free piezoelectric materials.     

SMT生产线制程工艺控制细则

从符合RoHS指令及无铅产品可靠性方面考虑,EMS企业最好把无铅制程与有铅制程划分区域、分线进行,但由于资金缺少或有铅产品还占有很大市场份额等种种原因,部分中小型EMS企业不得不采用无铅有铅制程共线的方案.在这种复杂的情况下,为防止有铅产品及其材料对无铅产品造成污染,必须要严格对无铅产品生产过程中的各个工序进行有效控制...     

Relaxor/Ferroelectric Composites: A Solution in the Quest for Practically Viable Lead‐Free Incipient Piezoceramics

Recently developed lead‐free incipient piezoceramics are promising candidates for off‐resonance actuator applications with their exceptionally large electromechanical strains. Their commercialization currently faces two major challenges: high electric field required for activating the large strains and large strain hysteresis. It is demonstrated that design of a relaxor/ferroelectric composite provides a highly effective way to resolve both challenges. Experimental results in conjunction with numerical simulations provide key parameters for the development of viable incipient piezoceramics.     

电子组装中助焊剂的选择 (续一)

助焊剂是电子组装技术中最重要的材料之一,其通过去除材料表面氧化膜及污染物等,保证钎料和母材之间很好的润湿,形成良好焊点。介绍了助焊剂的作用与组成、分类与性能要求以及涂覆方式和工艺评定,有助于实际生产中助焊剂的选择与使用。     

铌酸钾钠基无铅压电陶瓷的现状、机遇与挑战

近十年来, 铌酸钾钠(KNN)基无铅压电陶瓷一直是国内外的研究热点。基于笔者的研究工作, 本文从晶体结构、性能优化、制备工艺三个方面总结了KNN陶瓷的发展现状, 并进而尝试分析了该体系在未来发展中面临的机遇与挑战。     

SAC105焊锡膏的开发与评价

采用低银化焊料合金是无铅化电子组装提高性价比的发展趋势。开发了采用SAC105低银焊料合金的SUPER105系列焊锡膏,抗氧化、表面绝缘电阻、印刷性能、BGA空洞率、焊点推力等测试结果表明,SUPER105焊锡膏完全适用于消费类电子产品组装。     

基于单片机的压电式贾卡控制系统设计

结合德国Karl Mayer 公司最新研制的贾卡装置及其控制系统,研制了一种基于单片机控制的压电式贾卡控制系统.介绍了该控制系统的总体结构,并且重点阐述了控制系统中控制电路和驱动电路等硬件电路的设计.该系统已通过现场调试.具有工作稳定、效率高、性价比高、维修简单等特点.     

Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder

The tensile behavior and microstructure of bulk, Sn-3.5Ag solders as a function of cooling rate were studied. Cooling rate is an important processing parameter that affects the microstructure of the solder and, therefore, significantly influences mechanical behavior. Controlled cooling rates were obtained by cooling specimens in different media: water, air, and furnace. Cooling rate significantly affected secondary dendrite-arm size and spacing of the Sn-rich phase, as well as the aspect ratio of Ag₃Sn. The Sn-rich dendrite-arm size and spacing were smaller for water-cooled specimens than for air-cooled specimens. Furnace cooling yielded a nearly eutectic microstructure because the cooling rate approached equilibrium cooling. The morphology of Ag₃Sn also changed from spherical, at a fast cooling rate, to a needlelike morphology for slower cooling. The changes in the microstructure induced by the cooling rate significantly affected the mechanical behavior of the solder. Yield strength was found to increase with increasing cooling rate, although ultimate tensile strength and strain-to-failure seemed unaffected by cooling rate. Cooling rate did not seem to affect Young’s modulus, although a clear coorelation between modulus and porosity was obtained. The mechanical behavior was correlated with the observed microstructure, and fractographic analysis was employed to elucidate the underlying damage mechanisms.     

A quantitative evaluation of time-independent and time-dependent deformations of lead-free and lead-containing solder alloys

A method to separate plasticity and creep is discussed for a quantitative evaluation of the plastic, transient creep, and steady-state creep deformations of solder alloys. The method of separation employs an elasto-plastic-creep constitutive model comprised of the sum of the plastic, transient creep, and steady-state creep deformations. The plastic deformation is expressed by the Ramberg-Osgood law, the steady-state creep deformation by Garofalo’s creep law, and the transient creep deformation by a model proposed here. A method to estimate the material constants in the elasto-plastic-creep constitutive model is also proposed. The method of separation of the various deformations is applied to the deformation of the lead-free solder alloy Sn/3Ag/0.5Cu and the lead-containing solder alloy Sn/37Pb to compare the differences in the plastic, transient creep, and steady-state creep deformations. The method of separation provides a powerful tool to select the optimum lead-free solder alloys for solder joints of electronic devices.