光通信用垂直腔面发射激光器的进展

垂直腔面发射激光器(VCSEL)以其优异的性能有望成为信息时代的新光源.文章介绍了用于光通信的VCSEL的开发现状.     

微型电磁继电器的制作和仿真分析

介绍了一种基于MEMS技术的微型电磁继电器的制作过程和仿真分析.这种微继电器的大小约是4mm×4mm×0.5mm,主要采用普通的微加工技术来完成全部制作工艺.与传统继电器相比,这种继电器采用平面线圈来代替螺线管线圈,有利于MEMS工艺,并且提出了一种双支撑的悬臂梁结构做为活动电极,具有较高的灵敏性和稳定性.另外,还进行了一些有关线圈通过激励电流后对活动电极产生电磁力的理论计算和仿真分析,利用这些结果可以对这种电磁继电器的结构和参数进一步优化.     

射频MEMS压控电容器

研究了射频 MEMS压控电容器的设计和制造工艺。压控电容器的制作采用了 MEMS制造技术 ,其主要结构为硅衬底上制作金属传输线电极和介质层 ,然后制作金属膜桥作为电容器的另一个电极。通过改变加在金属膜桥与传输线间的电压达到改变电容值的目的。这种压控电容器可以工作于射频和微波波段 ,具有很高的Q值。测试结果如下 :在 1 GHz、0 V时 Q值达到 3 0 0 ,0偏压电容值为 0 .2 1 p F,当加上驱动电压后 Cmax/ Cmin的变比约为 4∶ 1     

等离子体横向刻蚀硅的特性研究

研究了用SiO2 +Al作掩模 ,SF6 +O2 混合气体等离子体对Si的横向刻蚀 ,其结果表明 ,在SF6 +O2 等离子体气氛中 ,Al是很好的保护膜 ,可以在待悬浮器件下形成大的开孔。因此 ,预计用这种技术 ,可以在Si片上集成横向尺寸为数百微米 ,具有优良高频性能的MEMSRF/MW无源器件 ,如开关、传输线、电感和电容等。     

Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging

In packaging of microelectromechanical systems (MEMS), optical, and electronic devices, there is a need to directly bond a wide variety of inorganic materials, such as oxides, nitrides, and semiconductors. Such applications involve hermetic-sealing components, three-dimensional MEMS assembly components as well as active semiconductor or optical components, dielectric layers, diffusion barriers, waveguides, and heat sinks. These materials are known to be very difficult to wet and bond with low melting-point solders. New Sn-Ag- or Au-Sn-based universal solders doped with a small amount of rare-earth (RE) elements have been developed, which now allow direct and powerful bonding onto the surfaces of various MEMS, optical, or electronic device materials. The microstructure, interface properties, and mechanical behavior of the bonds as well as the potential packaging applications of these new solder materials for MEMS and optical fiber devices are described. Various packaging-related structural, thermal, or electrical issues in MEMS are also discussed.     

MEMS技术对火控系统的影响

结合火控系统的发展趋势 ,说明了MEMS技术在火控系统中的应用 ,分析了MEMS技术在机械结构、系统性能以及体系结构等方面对火控系统的影响     

PCR芯片和生化微分析系统

介绍了PCR微芯片的最新研究进展,给出了不同结构的PCR芯片设计原理以及特点,介绍由PCR芯片为主要单元的集成微全分析系统的相关研究,同时简要介绍了对PCR的仿真模拟等。     

高电容比射频/微波MEMS膜开关的理论分析和数值模拟

建立了一个MEMS膜开关电容比理论模型，由于这个模型比较全面地考虑了开关阈值电压、维持电压、偏置电压和介质膜内的电场强度等因素对电容比的影响，因而能较为正确地反映开关的电容特性。用数值方法计算了影响开关电容比的因素，并对计算结果进行了分析和讨论。提出了使用脉冲电压作为偏置电压可以使介质膜gj的厚度减少到50nm，从而使开关的电容比增加到3800。最后，讨论了实现高电容比MEMS膜开关的可行性。     

Numerical Study of Scale Effects of Ultra-Thin Nickel Beams

Recent experiments have shown that metallic materials display significant size effects when the characteristic length scale of non-uniform plastic deformation is close to a micron. Couple stress plasticity has been developed to explain such phenomena by Fleck and Hutchinson. The mechanical behaviors of ultra-thin nickel beams in different boundary conditions were studied with the hybrid element developed for couple stress plasticity before. Strong scale effects are found when the beam's thickness is close to the material characteristic length scale. Such phenomena will disappear if the beam' s thickness is greatly larger than the material characteristic length scale. The scale effect is the beams inherent property and it does not change with the change of support conditions.     

DSU与DSU采集链

文章介绍了超精度的新型地震传感器DSU，它由微机电系统(MEMS)和兼有模拟电路和24位△—∑数字电路的混合器件(ASIC)组成，其失真度可达0．0032％，响应频带0～800Hz。DSU采集链使采集站、大线和检波器合为一体，既消除了电磁干扰和道间串音，又提高了采集数据的精度。DSU及DSU采集链的应用将为地震采集技术向超精度发展提供可靠保证。