基于异构宏模型的MEMS系统级建模方法

针对含复杂结构的MEMS器件,提出基于异构宏模型的系统级建模方法,即将基于解析法和基于数值计算的宏建模方法结合起来提取复杂器件的参数化宏模型,在此基础上实现MEMS系统级仿真。以z轴加速度计为例,在Saber中进行其系统级的时域、频域仿真,将仿真结果与有限元分析进行了比较,其仿真时间小于3min,相对误差小于3%,表明该方法能够快速有效地实现复杂结构MEMS器件的系统级仿真。     

IH工艺在微机械中的应用

介绍了微机械加工中的一项崭新技术--IH工艺,即集成聚合物固化立体光刻。这一技术是具有大纵横比的真三维立体加工工艺,而且可以加工聚合物和金属等多种材料。最后作者把IH工艺同LIGA工艺等传统工艺方法加以类比,提出了IH工艺的应用前景。     

单晶硅微桥式梁力学性能的弯曲测试

微梁是微电子机械系统(M EM S)中常见的结构,单晶硅是M EM S最基本、最常用的材料之一,其材料力学性能需要精确的评价。应用光刻等技术加工了六组不同尺寸的微桥式梁试件,并进行了弯曲测试,梯形截面的试件可代表矩形、方形等截面的常见微梁。弯曲测试选用的纳米压痕法适用于弹塑性材料,且可同时获取弹性模量、硬度和弯曲强度等多种力学性能参数。实验测得单晶硅的平均弹性模量为(170.295±2.4850)GPa,没有呈现尺寸效应;弯曲强度在3.24~10.15GPa范围内变化,有较强的尺寸效应,平均硬度为(9.4967±1.7533)GPa,尺寸效应不太明显。     

之字型支撑梁硅微谐振器机械性能分析

与相同几何尺寸的其他支撑形式相比,之字型支撑梁降低了硅微谐振器的谐振频率。通过对之字型支撑梁硅微谐振器的力学建模分析,发现其为5次超静定问题,在此基础上得出了谐振频率等重要的性能参数随几何参数的变化关系。分析结果表明,在保证支撑梁垂直长度不变的条件下,对固定的折弯次数n,谐振频率fx 随折弯角度φ的增大而增大;对固定的折弯角度φ,谐振频率fx 随折弯次数n的增大而趋于一个固定值;φ=90°时则等效于双侧直脚型微谐振器。     

新型室温中远波段红外探测器的关键工艺研究

介绍了一种基于MEMS技术的新型室温中远红外波段硅基电容式红外探测器原理和制作工艺过程，并详细介绍了针对单面光刻机而采用的对准孔双面对准和键合对准技术、浓硼扩散FLPW腐蚀停止技术制备超薄敏感硅膜以及薄膜的疏水处理等关键工艺。还对各环节所遇到的问题和其相应的解决方法进行了详细地阐述。     

反射面平动式光栅光调制器的实现及机电特性分析

提出了一种新型的光栅光调制器(GLM),它由可动平板阵列和固定光栅构成,通过可动平板的垂直运动,达到调制光束的目的。为验证该结构实现的可能性,得到器件的机电特性,根据微梁的力学理论进行了电力学理论分析,通过Coventor仿真软件进行了有限元仿真。分析表明,该器件所需驱动电压为16V,无明显的迟滞现象,可动平板的有效衍射面积较大,易于实现面阵结构,提高了光学衍射效率。     

微桥法研究低应力氮化硅力学特性及误差分析

用微机械悬桥法研究低应力氮化硅薄膜的力学性能。对符合弹性验则的微桥进行测试 ,在考虑衬底变形的基础上 ,利用最小二乘法对其载荷—挠度曲线进行拟合 ,得到低应力lowpressurechemicalvapourdeposited (LPCVD)氮化硅的弹性模量为 3 14 .0GPa± 2 9.2GPa ,残余应力为 2 65 .0MPa± 3 4.1MPa。探讨梯形横截面对弯曲强度计算和破坏发生位置的影响 ,得到低应力氮化硅的弯曲强度为 6.9GPa± 1.1GPa。对微桥法测量误差的分析表明 ,衬底变形、微桥长度和厚度的测量精度对最终力学特性的拟合结果影响最大     

微细加工中的快速复型研究

论述了在集成电路和微电子机械微细制造中的光刻技术,为了实现0.1μm甚至更小特征尺寸的光刻而采用的快速复型技术;这种技术吸收了电子束光刻和压印光刻的优点,同时又弥补了它们各自相应的缺点和不足,解决了光刻环节中光刻速度与特征尺寸小的矛盾,实现了大面积、快速、低成本和高精度的微细加工。     

DESIGN OF CANTILEVER PROBES FOR ATOMIC FORCE MICROSCOPY (AFM)

A cantilever beam used in an Atomic Force Microscope is optimized with respect to two different objectives. The first goal is to maximize the first eigenfrequency while keeping the stiffness of the probe constant. The second goal is to maximize the tip angle of the first eigenmode while again keeping the stiffness constant. The resulting design of the beam from the latter optimization gives almost the same result as when maximizing the first eigenfrequency. Adding a restriction on the second eigenfrequency result in a significant change of the optimal design. The beam is modelled with 12 DOF beam finite elements and the optimizations are carried through with either SLP (Sequential Linear Programming) or MM A (Method of Moving Asymptotes) and similar results are obtained.     

A micromechanical analogue mixer with dynamic displacement amplification

A new micromechanical device is proposed which is capable of modulation, demodulation and filtering operations. The device uses a patented 3-mass coupled micromechanical resonator which dynamically amplifies the displacement within a frequency range of interest. Modulation can be obtained by exciting different masses of the resonator with the data and the carrier signals. Demodulation can be obtained similarly by exciting the actuator with the input and carrier signals at the same time. With the help of dynamic motion amplification, filtering and signal amplification can be achieved simultaneously. A generic design approach is introduced which can be applied from kHz to MHz regime frequencies of interest. A sample mixer design for an silicon on insulator-based process is provided. A SPICE (Simulation Program with Integrated Circuit Emphasis)-based electro-mechanical co-simulation platform is also developed and the proposed mixer is simulated.