膜式水冷壁多焊机群控系统

基于DSP的多焊接电源群控系统被应用于膜式水冷壁焊机中.该系统引入优先级群控策略,多台焊接电源在外部参数发生波动时,按不同优先级的群控策略进行有序调整,减小了调整时间和调整误差.同时,根据焊接区域和焊接过程中管屏温度场分布规律,引入焊接参数实时调整策略,实现多台焊接电源在起弧段、稳弧段和收弧段等不同焊接过程的参数动态调整.结果表明,使用该系统控制焊机中的多台焊接电源,膜式水冷壁管屏焊接变形得到有效控制,焊接质量有较明显的提高.     

EFFECT OF INCORPORATING ADDITIONAL OLEIC ACID INTO THE PLASMA MEMBRANE OF BAKER'S YEAST ON THE PERMEATION OF PYRUVIC ACID

Addition of Tween 80 to the growth medium of baker's yeast (Saccharomyces cerevisiae) under anaerobic conditions resulted in an increased content of 9-cis-octadecenoic acid (oleic acid) in a membrane preparation consisting mainly of plasma membrane. There was no significant effect on the pyruvate decarboxylation capacity of disintegrated cells, but that of intact cells was significantly enhanced, presumably because of an oleate-induced increase in the permeability of the plasma membrane to pyruvate.     

Membrane Packaging System to Permit Safe Hydration of Freeze-Dried Contents with Impure Water

We tested the feasibility of using polymer membranes for a self-hydrating packaging system to reconstitute freeze-dried foods using nonpurified water. Several commercial membranes were screened according to (1) hydration rate, (2) water permeability, (3) passage of microorganisms, (4) salt rejection, and (5) strength. The most promising membranes were used for developing and testing prototype packaging systems. A feasible self-contained rehydration system was a nylon-6 polyamide membrane that rehydrated the freeze-dried food within 30 min while passage of microorganisms was prevented. The temperature was 37°C, and the food contained 0.5g/5g of a low molecular weight solute (salt). Such self-contained membrane rehydration systems must be designed to accommodate expected environmental conditions such as temperature, relative humidity, and nature of the product.     

Indicator Sensor Development and Fuel Cell Degradation Imaging

Although extensive research has been conducted, understanding the exact phenomena occurring during the operation of polymer electrolyte fuel cells (PEFCs) remains difficult. This research attempted to identify new reasons for the reduced performance of PEFC using an imaging technique. To begin with, H⁺ and OH⁻ indicator sensors, which display red, blue, and green values (RGB) using digital microscopes, are developed and attached to each electrode of a membrane electrode assembly to enable quantitative analysis of ion generation. The proposed reaction in the fuel cell can be confirmed, and various reactions occurring in the electrode can be examined using this approach. In particular, H⁺ is generated at the anode and cathode of the anion exchange membrane fuel cell, which is found to be a major cause of performance deterioration.     

In vivo electrochemical impedance measurement on single cell membrane

The electrochemical characteristics of the plasma membranes of single cells and organelles were investigated. Silicon fabrication technology was used to produce a metal ultra-microelectrode (UME). Furthermore, the UME was characterized in a cell medium using electrochemical impedance spectroscopy (EIS). A single rat fibroblast cell, or chloroplast purified from Peperomia metallica leaves, was immobilized by a micropipette after which the UME was inserted into its cytosolic space through cell membrane using a piezo actuator. An in vivo EIS measurement between the UME and the counter electrode outside of a single cell was taken. The measurements were analyzed using equivalent circuits in order to estimate the membrane impedance of a single cell.     

Automatic Transformation of Membrane‐Type Electronic Devices into Complex 3D Structures via Extrusion Shear Printing and Thermal Relaxation of Acrylonitrile–Butadiene–Styrene Frameworks

This work demonstrates a means of automatic transformation from planar electronic devices to desirable 3D forms. The method uses a spatially designed thermoplastic framework created via extrusion shear printing of acrylonitrile–butadiene–styrene (ABS) on a stress‐free ABS film, which can be laminated to a membrane‐type electronic device layer. Thermal annealing above the glass transition temperature allows stress relaxation in the printed polymer chains, resulting in an overall shape transformation of the framework. In addition, the significant reduction in the Young's modulus and the ability of the polymer chains to reflow in the rubbery state release the stress concentration in the electronic device layer, which can be positioned outside the neutral mechanical plane. Electrical analyses and mechanical simulations of a membrane‐type Au electrode and indium gallium zinc oxide transistor arrays before and after transformation confirm the versatility of this method for developing 3D electronic devices based on planar forms.     

基于时间混色的无滤色膜液晶显示技术研究

针对目前高质量的滤色膜制造工艺复杂,成本较高的问题,提出了一种利用LED做背光源结合一种时间混色的液晶显示技术,实现颜色显示无滤膜化,使液晶显示系统具有结构简单、色彩输出能力强、性能价格比高的优点。     

应用膜计算的社区检测算法

为提高社区检测算法的速度和质量,提出一种基于膜计算的检测算法.利用膜计算的分布性、并行性,来提高检测的速度和质量,膜对象进化时使用标签传播、遗传规则,实现社区检测的并行计算,并进行仿真实验.结果表明:该算法快速、准确,具有可行性,为网络的社区检测提供了一种新思路.     

Known Good Die

Advances in reducing size and increasing functionality of electronics have been due primarily to the shrinking geometries and increasing performance of integrated circuit technologies. Recently, development efforts aimed at reducing size and increasingfunctionality have focused on the first level of the electronicpackage. The result has been the development of multichip packaging,technologies in which bare IC chips are mounted on a single high density substrate that serves to package thechips, as well as interconnect them. A number of benefits accruebecause of multichip packaging, namely, increased chip density,space savings, higher performance, and less weight. Therefore, thesetechnologies are attractive for today's light weight, portable, highperformance electronic equipment and devices.In spite of these benefits, multichip packaging has not shown the kind of explosive growth and expansion that was predicted[1]. A major inhibitor for these technologies has been theavailability of fully tested and conditioned bare die, orknown good die. This paper reviews the issues and technologies associated with test and burn-in of bareor minimally packaged IC products.